Printed Flexible LC Filter Using Additive Micro-Dispensing With Silver Conductive Paste and ECA for Component Attachment

Abstract Filters are used in a variety of signal processing applications in commercial and defense electronics. The use of additively printed electronics in high-frequency applications requires an understanding of the process-performance interactions versus frequency of operation. Assembly of filters for integration into existing circuits requires additively printed metallization traces in addition to component attachment methods. Comparison of frequency response of the additively-printed filtering circuits vs conventional filters subtractively-fabricated on rigid substrates is needed to determine the performance parity of additive fabrication methods. In this paper, a micro-dispensing device is used to print conductive traces and electrically conductive adhesive (ECA) pads for the attachment of components. The effect of different print parameters on the width and height of the trace has been studied. Mechanical and electrical properties also play an important role in the study of different sintering conditions. Optimized parameters from the printing process and sintering analysis are used to print and compare commercially available LC filter circuitry using the Bode plot.

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One-Step Preparation of Silver Hexagonal Microsheets as Electrically Conductive Adhesive Fillers for Printed Electronics

ACS Applied Materials & Interfaces ◽

10.1021/acsami.5b03571 ◽

2015 ◽

Vol 7 (24) ◽

pp. 13685-13692 ◽

Cited By ~ 37

Author(s):

Hu-Ming Ren ◽

Ying Guo ◽

Sheng-Yun Huang ◽

Kai Zhang ◽

Matthew M.F. Yuen ◽

...

Keyword(s):

Printed Electronics ◽

Conductive Adhesive ◽

Electrically Conductive ◽

Electrically Conductive Adhesive ◽

One Step

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Development of Multi-Layer Circuitry Using Electrically Conductive Adhesive and Low-Temperature Solder Material for Surface-Mount Component Attachment

10.1115/ipack2021-74086 ◽

2021 ◽

Author(s):

Pradeep Lall ◽

Jinesh Narangaparambil ◽

Scott Miller

Keyword(s):

Low Temperature ◽

Flexible Electronics ◽

Printed Electronics ◽

Dielectric Materials ◽

Conductive Adhesive ◽

Direct Write ◽

Electrically Conductive ◽

Electrically Conductive Adhesive ◽

Design And Manufacturing ◽

Printing Parameters

Abstract The increased versatility in the design and manufacturing of components in low volumes, as well as the shorter time between design and prototype, has increased interest in the field of additively printed electronics. The ability to directly print on a variety of substrates, whether rigid, flexible, or conformable, provides several benefits over conventional electronics fabrication methods. Furthermore, the growing complexity of flexible electronics necessitates the development of multilayered circuits similar to traditional PCBs to decrease the volumetric and gravimetric effect of the underlying electronics. Using z-axis interconnections with dielectric materials, which may allow or prevent the connection between two layers, is one method of reaching several layers of circuits. In this paper, a working multilayer circuitry test vehicle is designed and additively printed using the direct-write method. The circuit model involves conductive and dielectric ink printing, as well as passive and active component attachments using an electrically conductive adhesive (ECA) and low-temperature solder (LTS). The study also shows details about the process of developing dielectric printing parameters for microvias for multilayer z-axis interconnections.

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The Microstructure of Steatite (Protoenstatite)

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s0424820100118102 ◽

1985 ◽

Vol 43 ◽

pp. 236-237

Author(s):

W. E. Lee ◽

A. H. Heuer

Keyword(s):

High Frequency ◽

Glass Ceramics ◽

Magnesium Silicate ◽

Beam Current ◽

Glassy Matrix ◽

Angle Of Incidence ◽

X Ray ◽

Mechanical And Electrical Properties ◽

Argon Ions ◽

High Temperature Polymorph

IntroductionTraditional steatite ceramics, made by firing (vitrifying) hydrous magnesium silicate, have long been used as insulators for high frequency applications due to their excellent mechanical and electrical properties. Early x-ray and optical analysis of steatites showed that they were composed largely of protoenstatite (MgSiO3) in a glassy matrix. Recent studies of enstatite-containing glass ceramics have revived interest in the polymorphism of enstatite. Three polymorphs exist, two with orthorhombic and one with monoclinic symmetry (ortho, proto and clino enstatite, respectively). Steatite ceramics are of particular interest a they contain the normally unstable high-temperature polymorph, protoenstatite.Experimental3mm diameter discs cut from steatite rods (∼10” long and 0.5” dia.) were ground, polished, dimpled, and ion-thinned to electron transparency using 6KV Argon ions at a beam current of 1 x 10-3 A and a 12° angle of incidence. The discs were coated with carbon prior to TEM examination to minimize charging effects.

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Repeatability and Extended Time Stability Study of an Additively Printed Strain Gauge Under Different Load Conditions

10.1115/ipack2021-74570 ◽

2021 ◽

Author(s):

Pradeep Lall ◽

Jinesh Narangaparambil ◽

Tony Thomas ◽

Kyle Schulze

Keyword(s):

Strain Gauge ◽

Printed Electronics ◽

Performance Testing ◽

Temperature Limit ◽

Stability Study ◽

Strain Gauges ◽

Gauge Factor ◽

Wearable Electronics ◽

Strain Sensing ◽

Sintering Conditions

Abstract Printed electronics has found new applications in wearable electronics owing to the opportunities for integration, and the ability of sustaining folding, flexing and twisting. Continuous monitoring necessitates the production of sensors, which include temperature, humidity, sweat, and strain sensors. In this paper, a process study was performed on the FR4 board while taking into account multiple printing parameters for the direct-write system. The process parameters include ink pressure, print speed, and stand-off height, as well as their effect on the trace profile and print consistency using white light interferometry analysis. The printed traces have also been studied for different sintering conditions while keeping the FR4 board’s temperature limit in mind. The paper also discusses the effect of sintering conditions on mechanical and electrical properties, specifically shear load to failure and resistivity. The data from this was then used to print strain gauges and compared them to commercially available strain gauges. By reporting the gauge factor, the printed strain gauge has been standardized. The conductive ink’s strain sensing capabilities will be studied under tensile cyclic loading (3-point bending) at various strain rates and maximum strains. Long-term performance testing will be carried out using cyclic tensile loads.

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Considerations on Process Performance in Incremental Forming by Inducing High Frequency Vibration

Proceedings of EUCOMES 08 ◽

10.1007/978-1-4020-8915-2_63 ◽

2008 ◽

pp. 523-530

Author(s):

D. Mundo ◽

G. Gatti ◽

G. Ambrogio ◽

L. Filice ◽

G. A. Danieli

Keyword(s):

High Frequency ◽

Incremental Forming ◽

Process Performance ◽

High Frequency Vibration

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In situ hydrothermal synthesis of silver nanoparticle based on graphene and their application for electrically conductive adhesive

2016 17th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2016.7583089 ◽

2016 ◽

Author(s):

Jinfeng Zeng ◽

Hongru Ma ◽

Xun Tian ◽

Yanqing Ma

Keyword(s):

Hydrothermal Synthesis ◽

Silver Nanoparticle ◽

Conductive Adhesive ◽

Electrically Conductive ◽

Electrically Conductive Adhesive

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Package-Interposer-Package (PIP): A Breakthrough Package-on-Package (PoP) Technology for 3D-Integration

International Symposium on Microelectronics ◽

10.4071/isom-2012-wa15 ◽

2012 ◽

Vol 2012 (1) ◽

pp. 000561-000567

Author(s):

Rabindra N. Das ◽

Frank D. Egitto ◽

Barry Bonitz ◽

Erich Kopp ◽

Mark D. Poliks ◽

...

Keyword(s):

System Integration ◽

Integrated Approach ◽

Power Delivery ◽

Solder Paste ◽

3D Integration ◽

Electrically Conductive ◽

Reflow Temperature ◽

Electrically Conductive Adhesive ◽

The Stability ◽

Electrical Connections

Package on Package (PoP) stacking has become an attractive method for 3D integration to meet the demands of higher functionality in ever smaller packages, especially when coupled with the use of stacked die. To accomplish this, new packaging designs need to be able to integrate more dies with greater function, higher I/O counts, smaller pitches, and greater heat densities, while being pushed into smaller and smaller footprints. A new 3D “Package Interposer Package” (PIP) solution is suitable for combining multiple memory, ASICs, stacked die, stacked packaged die, etc., into a single package. This approach also favors system integration with high density power delivery by appropriate interposer design and thermal management. Traditional Package on Package (PoP) approaches use direct solder connections between the substrates and are limited to use of single (or minimum) die on the bottom substrate, to reduce warpage and improve stability. For PIP, the stability imparted by the interposer reduces warpage, allowing assemblers of the PIP to select the top and bottom components (substrates, die, stacked die, modules) from various suppliers. This mitigates the problem of variation in warpage trends from room temperature to reflow temperature for different substrates/modules when combined with other packages. PIP facilitates more space-efficient designs, and can accommodate any stacked die height without compromising warpage and stability. PIP can accommodate modules with stacked die on organic, ceramic, or silicon board substrates, where each can be detached and replaced without affecting the rest of the package. Thus, PIP will be economical for high-end electronics, since a damaged, non-factional part of the package can be selectively removed and replaced. A variety of interposer structures were used to fabricate Package Interposer Package (PIP) modules. Electrical connections were formed during reflow using a tin-lead eutectic solder paste. Interconnection among substrates (packages) in the stack was achieved using interposers. Plated through holes in the interposers, formed by laser or mechanical drilling and having diameters ranging from 50 μm to 250 μm, were filled with an electrically conductive adhesive and cured. The adhesive-filled and cured interposers were reflowed with circuitized substrates to produce a PIP structure. In summary, the present work describes an integrated approach to develop 3D PIP constructions on various stacked die or stacked packaged die configurations.

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