An Optimized On-Chip Boost-Type DC-DC Converter With an On-Board Inductance

2014 ◽  
Author(s):  
Paul C.-P. Chao ◽  
Ching-Hua Kuan ◽  
Jia-Wei Su
Keyword(s):  
Printed Circuit Board ◽  
High Efficiency ◽  
Rapid Development ◽  
Current Drive ◽  
Circuit Board ◽  
Electronic Products ◽  
Fully Integrated ◽  
Printed Circuit ◽  
Limited Output ◽  
On Chip

The rapid development of portable electronic products in recent years increases demands of varied displays. With resolutions of panel sizes and pixels under current drive capability improved, this study is intended for designing an inductive DC boost converter circuit for displays, which is fully integrated with IC fabrication technology [1][2]. Most of current displays employ capacitances for voltage-boosting to supply relative high-voltage biases to displays. These booster circuits are in small sizes and with high efficiency, but limited output currents, which are inadequate for some of large-sized displays. To remedy the problem, an on-board, small-sized inductor in the forms of coils in a printed circuit board (PCB) is proposed for a superior solution. This PCB-type inductor can be incorporated into the same board with other drive chips for the displays, while offering large, adequate current, as an incapable task via an on-chip coil.

scholarly journals Design and Implementation of SOC-Based Noncontact-Type Level Sensing for Conductive and Nonconductive Liquids

2021 ◽  
Vol 2021 ◽  
pp. 1-12
Author(s):  
J. L. Mazher Iqbal ◽  
Munagapati Siva Kishore ◽  
Arulkumaran Ganeshan ◽  
G. Narayan
Keyword(s):  
Printed Circuit Board ◽  
System On Chip ◽  
Circuit Board ◽  
Sensor Technology ◽  
Electromechanical Systems ◽  
Printed Circuit ◽  
Design And Implementation ◽  
Hardware System ◽  
On Chip

In contrast to the existing electromechanical systems, the noncontact-type capacitive measurement allows for a chemically and mechanically isolated, continuous, and inherently wear-free measurement. Integration of the sensor directly into the container’s wall offers considerable savings potential because of miniaturization and installation efforts. This paper presents the implementation of noncontact (NC)-type level sensing techniques utilizing the Programmable System on Chip (PSoC). The hardware system developed based on the PSoC microcontroller is interfaced with capacitive-based printed circuit board (PCB) strip. The designer has the choice of placing the sensors directly on the container or close to it. This sensor technology can measure both the conductive and nonconductive liquids with equal accuracy.

scholarly journals Locate faulty components by IR based Direct Current Injection method with Analog Signature Analysis

2021 ◽  
Author(s):  
Zhifeng Zhu ◽  
Paul Leone
Keyword(s):  
Direct Current ◽  
Printed Circuit Board ◽  
Failure Modes ◽  
High Efficiency ◽  
Circuit Board ◽  
Signature Analysis ◽  
Printed Circuit Board Assembly ◽  
Component Failure ◽  
Printed Circuit ◽  
Circuit Board Assembly

Abstract This article describes a method to integrate Analog Signature Analysis (ASA) into IR based Direct Current Inject method (IRDCI) for Printed Circuit Board Assembly failure analysis, which extends IRDCI application from diagnostic shorted power rails to any measurement locations that show signature differences. Also, it extends the application of component failure modes from electrical short to breakdown or degradation that can be identified by signature comparison and still keep high efficiency to eliminate the needs to guess and remove suspected faulty components one by one from the board to validate.

scholarly journals Load-dependent power transfer efficiency for on-chip coils

2021 ◽  
Author(s):  
Joakim Nilsson ◽  
Johan Borg ◽  
Jonny Johansson
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Transfer Efficiency ◽  
Cmos Process ◽  
Power Transfer ◽  
Single Chip ◽  
Process Technology ◽  
Printed Circuit ◽  
Power Transfer Efficiency ◽  
On Chip

AbstractThis paper presents a theory for the power transfer efficiency of printed circuit board coils to integrated circuit coils, with focus on load-dependence for low-power single-chip systems. The theory is verified with electromagnetic simulations modelled on a 350 nm CMOS process which in turn are verified by measurements on manufactured integrated circuits. The power transfer efficiency is evaluated by on-chip rectification of a 151 MHz signal transmitted by a spiral coil on a printed circuit board at 10 mm of separation to an on-chip coil. Such an approach avoids the influence of off-chip parasitic elements such as bond wires, which would reduce the accuracy of the evaluation. It is found that there is a lower limit for the load below which reducing the power consumption of on-chip circuits yield no increase in voltage generated at the load. For the examined process technology, this limit appears to lie around 56 k$$\Omega$$ Ω . The paper is focused on the analysis and verification of the theory behind this limit. We relate the results presented in this work to the application of wireless single-chip temperature monitoring of power semiconductors and conclude that such a system would be compatible with this limit.

scholarly journals Study on effect of drilling rotational speed and tool wear on chip evacuation of micro drilling of printed circuit board

2016 ◽  
Vol 82 (834) ◽  
pp. 15-00463-15-00463 ◽  
Author(s):  
Hiromi YOSHIMURA ◽  
Yu KATAHIRA ◽  
Hidehito WATANABE ◽  
Taiju YAMASHITA
Keyword(s):  
Tool Wear ◽  
Rotational Speed ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit ◽  
Micro Drilling ◽  
On Chip

scholarly journals Highly Integrated Elastic Island-Structured Printed Circuit Board with Controlled Young’s Modulus for Stretchable Electronics

Micromachines ◽  
2020 ◽  
Vol 11 (6) ◽  
pp. 617
Author(s):  
Duho Cho ◽  
Junhyung Kim ◽  
Pyoenggeun Jeong ◽  
Wooyoung Shim ◽  
Su Yeon Lee ◽  
...  
Keyword(s):  
Young’S Modulus ◽  
Printed Circuit Board ◽  
Young's Modulus ◽  
Circuit Board ◽  
Stretchable Electronics ◽  
Fully Integrated ◽  
Printed Circuit ◽  
Reinforcing Agent ◽  
Highly Stretchable ◽  
Levels Of Integration

A stretchable printed circuit board (PCB), which is an essential component of next-generation electronic devices, should be highly stretchable even at high levels of integration, as well as durable under repetitive stretching and patternable. Herein, an island-structured stretchable PCB composed of materials with controlled Young’s modulus and viscosity by adding a reinforcing agent or controlling the degree of crosslinking is reported. Each material was fabricated with the most effective structures through a 3D printer. The PCB was able to stretch 71.3% even when highly integrated and was patterned so that various components could be mounted. When fully integrated, the stress applied to the mounted components was reduced by 99.9% even when stretched by over 70%. Consequently, a 4 × 4 array of capacitance sensors in a stretchable keypad demonstration using our PCB was shown to work, even at 50% stretching of the PCB.

scholarly journals A Low-Cost and Efficient Microstrip-Fed Air-Substrate-Integrated Waveguide Slot Array

Electronics ◽  
2021 ◽  
Vol 10 (3) ◽  
pp. 338
Author(s):  
Linfeng Li ◽  
Jie-Bang Yan
Keyword(s):  
Printed Circuit Board ◽  
High Efficiency ◽  
Low Cost ◽  
Design Procedure ◽  
Substrate Material ◽  
Circuit Board ◽  
Substrate Integrated Waveguide ◽  
Printed Circuit ◽  
Waveguide Transition ◽  
Pcb Manufacturing

A microstrip-fed air-substrate-integrated waveguide (ASIW) slot array with high efficiency and low cost is presented. The design cuts out the substrate material within SIW, replaces the vias with metallic sidewalls, and uses a simple microstrip line-waveguide transition to feed the slot array. Radiating slots are cut on a 5-mil brass-plate, which covers the top of the substrate cutout to resemble a hollow waveguide structure. This implementation provides a simple and efficient antenna array solution for millimeter-wave (mm-wave) applications. Meanwhile, the fabrication is compatible with the standard printed circuit board (PCB) manufacturing process. To demonstrate the concept, a 4-element ASIW slot array working at the n257 band for 5G communications was designed using low-cost Rogers 4350B and FR4 substrate materials. Our simulation result shows 18% more efficiency than a conventional SIW slot array using the same substrate. The fabricated prototype shows |S11| < −15 dB over 27–29 GHz and a peak realized gain of 10.1 dBi at 28.6 GHz. The design procedure, prototyping process, and design analysis are discussed in the paper.

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