scholarly journals A Low-Cost and Efficient Microstrip-Fed Air-Substrate-Integrated Waveguide Slot Array

Electronics ◽  
2021 ◽  
Vol 10 (3) ◽  
pp. 338
Author(s):  
Linfeng Li ◽  
Jie-Bang Yan
Keyword(s):  
Printed Circuit Board ◽  
High Efficiency ◽  
Low Cost ◽  
Design Procedure ◽  
Substrate Material ◽  
Circuit Board ◽  
Substrate Integrated Waveguide ◽  
Printed Circuit ◽  
Waveguide Transition ◽  
Pcb Manufacturing

A microstrip-fed air-substrate-integrated waveguide (ASIW) slot array with high efficiency and low cost is presented. The design cuts out the substrate material within SIW, replaces the vias with metallic sidewalls, and uses a simple microstrip line-waveguide transition to feed the slot array. Radiating slots are cut on a 5-mil brass-plate, which covers the top of the substrate cutout to resemble a hollow waveguide structure. This implementation provides a simple and efficient antenna array solution for millimeter-wave (mm-wave) applications. Meanwhile, the fabrication is compatible with the standard printed circuit board (PCB) manufacturing process. To demonstrate the concept, a 4-element ASIW slot array working at the n257 band for 5G communications was designed using low-cost Rogers 4350B and FR4 substrate materials. Our simulation result shows 18% more efficiency than a conventional SIW slot array using the same substrate. The fabricated prototype shows |S11| < −15 dB over 27–29 GHz and a peak realized gain of 10.1 dBi at 28.6 GHz. The design procedure, prototyping process, and design analysis are discussed in the paper.

A Novel Low Cost Package for Radio Frequency Applications

2013 ◽  
Vol 135 (2) ◽  
Author(s):  
Sandeep Chaturvedi ◽  
Shiban K. Koul
Keyword(s):  
High Frequency ◽  
Printed Circuit Board ◽  
Low Cost ◽  
Cost Effective ◽  
Circuit Board ◽  
Test Results ◽  
Printed Circuit ◽  
Pcb Manufacturing ◽  
Manufacturing Techniques ◽  
Commercial Applications

Design, fabrication, and test results of a novel 3-layer RF package using a commonly available high frequency laminate are presented in this paper. The developed package can be manufactured using standard multilayer printed circuit board (PCB) manufacturing techniques making it cost effective for commercial applications. The package exhibits excellent RF characteristics up to 6 GHz.

scholarly journals Wideband and High-Efficiency SIW Cavity-Backed Magneto-Electric Dipole Antenna Array

2019 ◽  
Vol 2019 ◽  
pp. 1-16
Author(s):  
Guang Sun ◽  
Yi Liu ◽  
Taolin Liu ◽  
Hu Yang
Keyword(s):  
Antenna Array ◽  
Printed Circuit Board ◽  
High Efficiency ◽  
High Gain ◽  
Dipole Antenna ◽  
Circuit Board ◽  
Impedance Bandwidth ◽  
Antenna Element ◽  
Substrate Integrated Waveguide ◽  
Printed Circuit

In this paper, a compact, wideband, and high-efficiency substrate integrated waveguide (SIW) feeding cavity-backed aperture-coupled magneto-electric (ME) dipole antenna element and its array are proposed. Firstly, an SIW cavity-backed and a modified bowtie dipole are designed for the antenna element which makes it possess a high gain and wide impedance bandwidth. The antenna element covers an impedance bandwidth of 66.3% from 10.7 to 21.3 GHz with a peak gain of 10.3 dBi. Secondly, a 4 × 4 array is designed using the proposed antenna element. And a full-corporate substrate integrated waveguide feeding network is introduced to excite the array elements for the antenna application with wide bandwidth and high efficiency. For validation, a prototype of 4 × 4 array is fabricated by standard printed circuit board (PCB) facilities and further measured. The measured −10 dB impedance bandwidth of the proposed 4 × 4 antenna array is 30% (12.75–17.25 GHz) with its gain being 18.2–20.9 dBi within the entire band. The measured maximum aperture efficiency of the antenna array is 94% at 14.92 GHz. Notably, the measured results agree well with simulations, and it shows great advantages over other similar antennas on efficiency and bandwidth.

A Novel Wideband transition from Substrate Integrated Waveguide to Rectangular Waveguide

2020 ◽  
Vol 10 ◽  
Author(s):  
Keyur Mahant ◽  
Hiren Mewada ◽  
Amit Patel ◽  
Alpesh Vala ◽  
Jitendra Chaudhari
Keyword(s):  
Rectangular Waveguide ◽  
Printed Circuit Board ◽  
Low Cost ◽  
Single Layer ◽  
Circuit Board ◽  
Substrate Integrated Waveguide ◽  
Ka Band ◽  
Better Than ◽  
Millimeter Wave Circuits ◽  
Wideband Transition

Aim: In this article, wideband substrate integrated waveguide (SIW) and rectangular waveguide (RWG) transition operating in Ka-band is proposed Objective: In this article, wideband substrate integrated waveguide (SIW) and rectangular waveguide (RWG) transition operating in Ka-band is proposed. Method: Coupling patch etched on the SIW cavity to couple the electromagnetic energy from SIW to RWG. Moreover, metasurface is introduced into the radiating patch to enhance bandwidth. To verify the functionality of the proposed structure back to back transition is designed and fabricated on a single layer substrate using standard printed circuit board (PCB) fabrication technology. Results: Measured results matches with the simulation results, measured insertion loss is less than 1.2 dB and return loss is better than 3 dB for the frequency range of 28.8 to 36.3 GHz. By fabricating transition with 35 SRRs bandwidth of the proposed transition can be improved. Conclusion: The proposed transition has advantages like compact in size, easy to fabricate, low cost and wide bandwidth. Proposed structure is a good candidate for millimeter wave circuits and systems.

scholarly journals Highly Compact Through-Wire Microstrip to Empty Substrate Integrated Coaxial Line Transition

2021 ◽  
Vol 11 (15) ◽  
pp. 6885
Author(s):  
Marcos D. Fernandez ◽  
José A. Ballesteros ◽  
Angel Belenguer
Keyword(s):  
Printed Circuit Board ◽  
Low Cost ◽  
Coaxial Line ◽  
Circuit Board ◽  
Central Layer ◽  
Printed Circuit ◽  
Integrated Technology ◽  
Low Profile ◽  
The Many ◽  
High Degree

Empty substrate integrated coaxial line (ESICL) technology preserves the many advantages of the substrate integrated technology waveguides, such as low cost, low profile, or integration in a printed circuit board (PCB); in addition, ESICL is non-dispersive and has low radiation. To date, only two transitions have been proposed in the literature that connect the ESICL to classical planar lines such as grounded coplanar and microstrip. In both transitions, the feeding planar lines and the ESICL are built in the same substrate layer and they are based on transformed structures in the planar line, which must be in the central layer of the ESICL. These transitions also combine a lot of metallized and non-metallized parts, which increases the complexity of the manufacturing process. In this work, a new through-wire microstrip-to-ESICL transition is proposed. The feeding lines and the ESICL are implemented in different layers, so that the height of the ESICL can be independently chosen. In addition, it is a highly compact transition that does not require a transformer and can be freely rotated in its plane. This simplicity provides a high degree of versatility in the design phase, where there are only four variables that control the performance of the transition.

A PCB Sensor for Magnetic Materials

2019 ◽  
Vol 2019 (DPC) ◽  
pp. 001323-001342
Author(s):  
Robert N. Dean ◽  
Lauren E. Beckingham
Keyword(s):  
Magnetic Materials ◽  
Printed Circuit Board ◽  
Low Cost ◽  
Complex Impedance ◽  
Corrosion Products ◽  
Physical Contact ◽  
Circuit Board ◽  
Sensor Technology ◽  
Printed Circuit ◽  
Surrounding Environment

Printed circuit board (PCB) sensors are a sensor technology where the layout of traces on a PCB has been optimized so that the traces electromagnetically interact with the surrounding environment. These types of sensors can be manufactured at very low cost using standard commercially available low-cost printed circuit board fabrication. Exposed conductive electrodes on the circuit board are useful for measuring the electrical conductivity of the surrounding environment, and these sensors have been used in applications such as salinity measurement and dissolved ion content measurement of aqueous solutions. Insulated interdigitated electrode sensors are useful for capacitively analyzing the surrounding environment, and these sensors have been used to detect the presence of liquid water and to measure the moisture content of substances in physical contact with the sensor. Additionally, by measuring the complex impedance of the capacitive sensor over a wide frequency range, information concerning the chemical composition of the substance in contact with the sensor can be determined. In addition to conducive and capacitive PCB sensors, the third type of PCB sensor would be an inductive sensor. Although it is challenging to realize 3D coils in PCB technology, planar inductors can be realized in a single Cu layer on a PCB, and insulated from the environment using a cover layer of polymeric solder mask. This type of electrode structure can inductively couple with magnetic materials in close proximity to the sensor. A variety of magnetic materials exist, including iron, nickel and cobalt. Additionally, many alloys of these elements are also magnetic. Of particular interest are corrosion products with magnetic properties, such as iron(III) oxide, Fe3O2, also known as common rust. A thin layer of iron(III) oxide powder deposited on the sensor's active area results in a measureable increase in the sensor's inductance. As such, an inductive PCB sensor could be a low-cost option for detecting the presence of some corrosion products in its operating environment.

A Comparison of Immersion Gold and Tin Surface Finishes on Sensing Electrodes for PCB Environmental Saltwater Concentration Sensors

2016 ◽  
Vol 2016 (1) ◽  
pp. 000557-000562
Author(s):  
Robert N. Dean ◽  
Frank T. Werner ◽  
Michael J. Bozack
Keyword(s):  
Surface Finish ◽  
Printed Circuit Board ◽  
Chemical Constituents ◽  
Low Cost ◽  
Circuit Board ◽  
Testing Environment ◽  
Printed Circuit ◽  
Sensor Performance ◽  
Sensing Applications ◽  
Surface Finishes

Abstract Printed circuit board (PCB) sensors using low-cost commercial printed circuit board fabrication processes have been demonstrated for environmental sensing applications. One configuration of these sensors uses exposed electrodes to measure saltwater concentration in freshwater/seawater mixtures, through monitoring the resistance between the electrodes when they are immersed in the saltwater/freshwater solution. The lowest cost commercial PCB processes use an immersion Sn HASL surface finish on exposed copper cladding, including the sensing electrodes. This commercial PCB process has been demonstrated to make an effective, low-cost, short-lifetime sensor for saltwater concentration testing. The Sn finish, however, may not be optimal for this application. Sn oxidizes, which can interfere with sensor performance. Additionally, Sn and Sn oxides are potentially reactive with chemical constituents in seawater and seawater/freshwater solutions. An immersion Au (ENIG) surface finish is certainly less reactive with the atmosphere and chemicals likely present in the testing environment. However, an immersion Au finish increases the cost of the sensors by 30% to 40%. To investigate if the possible benefits of the more expensive Au surface finish are worth the extra expense, a study was performed where identical PCB sensors were procured from a commercial vendor with their standard low-cost Sn HASL finish and with their standard ENIG surface finish. Both sets of sensors were then evaluated in concentrations of seawater and freshwater, from 0% to 100% seawater concentration, using freshwater samples from a natural freshwater source near the coast where the seawater was obtained. Testing demonstrated an insignificant difference in sensor performance between the Sn HASL and the ENIG coated sensing electrodes. The results of this investigation indicated that for applications where the sensors will not be used for long periods of time, the added expense of an immersion Au surface finish is not worth the added cost.

scholarly journals Affordable Thin Lens Using Single Polarized Disparate Filter Arrays for Beyond 5G toward 6G

Sensors ◽  
2019 ◽  
Vol 19 (18) ◽  
pp. 3982
Author(s):  
Inseop Yoon ◽  
Seongwoog Oh ◽  
Jungsuek Oh
Keyword(s):  
Manufacturing Process ◽  
Printed Circuit Board ◽  
Design Procedure ◽  
Circuit Board ◽  
Process Conditions ◽  
60 Ghz ◽  
Thin Lens ◽  
Gain Enhancement ◽  
Unit Cells ◽  
Pcb Manufacturing

This paper proposes a novel design approach for a thin lens with the aim of overcoming fineness limits in the commercial millimeter wave printed circuit board (PCB) manufacturing process. The PCB manufacturing process typically does not allow the fabrication of metallic patterns with a gap and width of less than 100 μm. This hampers expanding thin lens technology to 5G commercial applications, especially when such technology is considered for 60 GHz or higher frequency, which requires a finer gap and width of metallic traces. This paper proposes that problematic process conditions can be mitigated when a lens is designed by establishing single-polarized lumped element models where larger capacitance and inductance values can be obtained for the same patch and grid unit cells. While the proposed design technique is more advantageous at higher target frequencies, a 60 GHz application and a wireless backhaul system is selected because of a limited range of frequencies that can be measured by an available vector network analyzer. The required gap or width of metallic traces can be widened significantly by using the proposed single-polarized unit cells to acquire the same in-plane capacitance or inductance. This enables the lens operating at higher-frequency under the process limits in fabricable fine traces. Finally, the effectiveness of the simulated design procedure is demonstrated by fabricating a 60 GHz thin lens that can achieve a gain enhancement of 16 dB for a 4 × 4 patch antenna array with a gain of 16.5 dBi.

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