Experimental Investigation of Thermal Performance of Nano-Enhanced Phase Change Materials for Thermal Management of Electronic Components

2019 ◽  
Author(s):  
Rohit Kothari ◽  
Dattaraj V. Vaidya ◽  
Vinay Shelke ◽  
Santosh K. Sahu ◽  
Shailesh I. Kundalwal
Keyword(s):  
Experimental Investigation ◽  
Phase Change ◽  
Thermal Management ◽  
Phase Change Materials ◽  
Heat Sinks ◽  
Melting Time ◽  
Management Technique ◽  
Base Temperature ◽  
Al2o3 Nanoparticles ◽  
Time Duration

Abstract Present experimental investigation focuses on implementing passive cooling thermal management technique using heat sinks filled with paraffin wax as phase change material (PCM). Al2O3 nanoparticles are dispersed as thermal conductivity enhancer (TCE) in different weight fractions (φ) for improved performance in the PCM. Unfinned and two finned heat sinks are used in this investigation. Experimental analysis is performed on different configurations of heat sinks and nano-enhanced phase change materials (NePCMs) consisting various weight fraction of Al2O3 nanoparticles (φ = 0%, 0.5%, 4%, and 6%) for a constant heat flux of 2.0 kW/m2. Results show that latent heat and specific heat capacity decreases with increase in the Al2O3 nanoparticle loading. Addition of Al2O3 nanoparticles in the PCM results in the reduced melting time of PCM. While, pure PCM based heat sinks keeps heat sink base temperature lower for longer time duration.

scholarly journals Computational Study of Heat Transfer inside Different PCMs Enhanced by Al2O3 Nanoparticles in a Copper Heat Sink at High Heat Loads

Nanomaterials ◽  
2020 ◽  
Vol 10 (2) ◽  
pp. 284 ◽  
Author(s):  
Nadezhda S. Bondareva ◽  
Nikita S. Gibanov ◽  
Mikhail A. Sheremet
Keyword(s):  
Phase Change ◽  
Phase Change Materials ◽  
Computational Study ◽  
Conjugate Problem ◽  
High Heat ◽  
Solid Particles ◽  
Heat Sinks ◽  
Al2o3 Nanoparticles ◽  
Electronic Elements ◽  
The Impact

The cooling of electronic elements is one of the most important problems in the development of architecture in electronic technology. One promising developing cooling method is heat sinks based on the phase change materials (PCMs) enhanced by nano-sized solid particles. In this paper, the influence of the PCM’s physical properties and the concentration of nanoparticles on heat and mass transfer inside a closed radiator with fins, in the presence of a source of constant volumetric heat generation, is analyzed. The conjugate problem of nano-enhanced phase change materials (NePCMs) melting is considered, taking into account natural convection in the melt under the impact of the external convective cooling. A two-dimensional problem is formulated in the non-primitive variables, such as stream function and vorticity. A single-phase nano-liquid model is employed to describe the transport within NePCMs.

Studies on Optimum Distribution of Fins in Heat Sinks Filled With Phase Change Materials

2008 ◽  
Vol 130 (3) ◽  
Author(s):  
S. K. Saha ◽  
K. Srinivasan ◽  
P. Dutta
Keyword(s):  
Phase Change ◽  
Thermal Management ◽  
Phase Change Materials ◽  
Volume Fraction ◽  
Heat Sinks ◽  
Electronic Systems ◽  
Optimum Distribution ◽  
Cross Sectional ◽  
Change Material ◽  
Small Cross Sectional Area

This paper deals with phase change material (PCM), used in conjunction with thermal conductivity enhancer (TCE), as a means of thermal management of electronic systems. Eicosane is used as PCM, while aluminium pin or plate fins are used as TCE. The test section considered in all cases is a 42×42mm2 base with a TCE height of 25mm. An electrical heater at the heat sink base is used to simulate the heat generation in electronic chips. Various volumetric fractions of TCE in the conglomerate of PCM and TCE are considered. The case with 8% TCE volume fraction was found to have the best thermal performance. With this volume fraction of TCE, the effects of fin dimension and fin shape are also investigated. It is found that a large number of small cross-sectional area fins is preferable. A numerical model is also developed to enable an interpretation of experimental results.

scholarly journals Thermal Management of Transient Power Spikes in Electronics: Phase Change Energy Storage or Copper Heat Sinks??

2003 ◽  
Author(s):  
Shankar Krishnan ◽  
Suresh V. Garimella
Keyword(s):  
Phase Change ◽  
Phase Change Material ◽  
Phase Change Materials ◽  
Electronics Cooling ◽  
Thermal Control ◽  
Heat Sinks ◽  
Melting Time ◽  
Power Semiconductors ◽  
Design Calculations ◽  
Change Material

A transient thermal analysis is performed to investigate thermal control of power semiconductors using phase change materials, and to compare the performance of this approach to that of copper heat sinks. Both the melting of the phase change material under a transient power spike input, as well as the resolidification process, are considered. Phase change materials of different kinds (paraffin waxes and metallic alloys) are considered, with and without the use of thermal conductivity enhancers. Simple expressions for the melt depth, melting time and temperature distribution are presented in terms of the dimensions of the heat sink and the thermophysical properties of the phase change material, to aid in the design of passive thermal control systems. The simplified analytical expressions are verified against more complex numerical simulations, and are shown to be excellent tools for design calculations. The suppression of junction temperatures achieved by the use of phase change materials when compared to the performance with copper heat sinks is illustrated. Merits of employing phase change materials for pulsed power electronics cooling applications are discussed.

Experimental Investigation of Composite Phase Change Material Heat Sinks for Enhanced Passive Thermal Management

2020 ◽  
Vol 143 (1) ◽  
Author(s):  
Collier S. Miers ◽  
Amy Marconnet
Keyword(s):  
Phase Change ◽  
Thermal Management ◽  
Phase Change Materials ◽  
Heat Fluxes ◽  
Heat Sinks ◽  
Electronic Systems ◽  
Test Platform ◽  
Regeneration Cycle ◽  
Change Material

Abstract Phase change materials (PCMs) are effective at storing thermal energy and are attractive for use in electronics to smooth temperature peaks during periods of high demand; however, the use of PCMs has been somewhat limited due to the poor thermal properties of the materials. Here, we propose a design for a tunable composite PCM heat sink for passive thermal management in electronic systems and develop an improved test platform to directly compare performance between different designs and PCMs. The composite design leverages high conductivity pathways, which are machined into aluminum heat sinks, and back-filled with PCMs. Two package sizes are considered with several internal fin structures. All designs are evaluated using a test platform with realistic power profiles, controlled interfacial loading, and in situ temperature measurement. The composite PCM heat sinks are benchmarked against solid aluminum packages of the same size. This study focuses on three commercially available PCMs. Performance is evaluated based on (1) the time it takes the test heater chip below each composite PCM package to reach the cut-off temperature of 95 °C and (2) the period of a full melt-regeneration cycle. A range of heat fluxes are considered in this study spanning 6.8–14.5 W cm−2. The isokite design with PlusICE S70 extends the time to reach 95 °C by 36.2% when compared to the solid package, while weighing 17.3% less, making it advantageous for mobile devices.

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