scholarly journals High impact ionization rate in silicon by sub-picosecond THz electric field pulses (Conference Presentation)

Author(s):  
Abebe T. Tarekegne ◽  
Krzysztof Iwaszczuk ◽  
Hideki Hirori ◽  
Koichiro Tanaka ◽  
Peter U. Jepsen
Coatings ◽  
2019 ◽  
Vol 9 (8) ◽  
pp. 514 ◽  
Author(s):  
Feng-Tso Chien ◽  
Kuang-Po Hsueh ◽  
Zhen-Jie Hong ◽  
Kuan-Ting Lin ◽  
Yao-Tsung Tsai ◽  
...  

In this study, a novel low impact ionization rate (low-IIR) poly-Si thin film transistor featuring a current and electric field split (CES) structure with bottom field plate (BFP) and partial thicker channel raised source/drain (RSD) designs is proposed and demonstrated. The bottom field plate design can allure the electron and alter the electron current path to evade the high electric field area and therefore reduce the device IIR and suppress the kink effect. A two-dimensional device simulator was applied to describe and compare the current path, electric field magnitude distributions, and IIR of the proposed structure and conventional devices. In addition, the advantages of a partial thicker channel RSD design are present, and the leakage current of CES-thin-film transistor (TFT) can be reduced and the ON/OFF current ratio be improved, owing to a smaller drain electric field.


2011 ◽  
Vol 383-390 ◽  
pp. 5851-5854
Author(s):  
Yung Yu Chen

Due to the reduced gate coupling ratio, the channel Fowler-Nordheim (CFN) programming speed of stacked-gate flash memories with high-permittivity (k) tunnel dielectrics (TDs) is helpless in operation voltage reduction. Although the electric field on high-k tunnel dielectrics is lower than SiO2 tunnel oxide, enhanced impact ionization rate and lower barrier height contribute to higher channel hot-electron (CHE) injection current and efficiency. Consequently, high-k TDs are only effective for the memories programmed with hot electron injection rather than FN tunneling, which is suitable for the NOR-type stacked-gate flash memories.


1996 ◽  
Vol 423 ◽  
Author(s):  
J. Kolnik ◽  
I. H. Oguzman ◽  
K. F. Brennan ◽  
R. Wang ◽  
P. P. Ruden

AbstractIn this paper, we present the first calculations of the electron and hole initiated interband impact ionization rate in zinc blende phase GaN as a function of the applied electric field strength. The calculations are performed using an ensemble Monte Carlo simulator including the full details of the conduction and valence bands along with a numerically determined, wave-vector dependent interband ionization transition rate determined from an empirical pseudopotential calculation. The first four conduction bands and first three valence bands, which fully comprise the energy range of interest for device simulation, are included in the analysis. It is found that the electron and hole ionization rates are comparable over the full range of applied electric field strengths examined. Based on these calculations an avalanche photodiode, APD, made from bulk zinc blende GaN then would exhibit poor noise and bandwidth performance. It should be noted however, that the accuracy of the band structure employed and the scattering rates is presently unknown since little experimental information is available for comparison. Therefore, due to these uncertainties, it is difficult to unequivocally conclude that the ionization rates are comparable.


2010 ◽  
Vol 25 (11) ◽  
pp. 115010 ◽  
Author(s):  
G R Li ◽  
Z X Qin ◽  
G F Luo ◽  
B Shen ◽  
G Y Zhang

Sign in / Sign up

Export Citation Format

Share Document