Theoretical Prediction of Zinc Blende Phase GaN Avalanche Photodiode Performance Based on Numerically Calculated Electron and Hole Impact Ionization Rate Ratio

1996 ◽  
Vol 423 ◽  
Author(s):  
J. Kolnik ◽  
I. H. Oguzman ◽  
K. F. Brennan ◽  
R. Wang ◽  
P. P. Ruden

AbstractIn this paper, we present the first calculations of the electron and hole initiated interband impact ionization rate in zinc blende phase GaN as a function of the applied electric field strength. The calculations are performed using an ensemble Monte Carlo simulator including the full details of the conduction and valence bands along with a numerically determined, wave-vector dependent interband ionization transition rate determined from an empirical pseudopotential calculation. The first four conduction bands and first three valence bands, which fully comprise the energy range of interest for device simulation, are included in the analysis. It is found that the electron and hole ionization rates are comparable over the full range of applied electric field strengths examined. Based on these calculations an avalanche photodiode, APD, made from bulk zinc blende GaN then would exhibit poor noise and bandwidth performance. It should be noted however, that the accuracy of the band structure employed and the scattering rates is presently unknown since little experimental information is available for comparison. Therefore, due to these uncertainties, it is difficult to unequivocally conclude that the ionization rates are comparable.

1997 ◽  
Vol 468 ◽  
Author(s):  
E. Bellotti ◽  
I. H. Oguzman ◽  
J. Kölnik ◽  
K. F. Brennan ◽  
R. Wang ◽  
...  

ABSTRACTIn this paper, we present the first calculations of the electron and hole impact ionizatioi coefficients for both wurtzite and zincblende phase GaN as a function of the applied electrii field. The calculations are made using an ensemble Monte Carlo simulator including the ful details of the conduction and valence bands derived from an empirical pseudopotentia calculation. The interband impact ionization transition rates for both carrier species an determined by direct numerical integration including a wavevector dependent dielectric function It is found that the electron and hole ionization coefficients are comparable in zincblende Ga> at an applied field of ∼ 3 MV/cm, yet vary to a slight degree at both higher and lower applied field strengths. In the wurtzite phase, the electron and hole coefficients are comparable at hig] fields but diverge at lower applied fields. The most striking result is that the ionization rates an predicted to be substantially different for both carrier species between the two phases. It i predicted that the ionization rates for both carrier species in the zincblende phase are significanti; higher than in the wurtzite phase over the full range of applied fields examined.


Coatings ◽  
2019 ◽  
Vol 9 (8) ◽  
pp. 514 ◽  
Author(s):  
Feng-Tso Chien ◽  
Kuang-Po Hsueh ◽  
Zhen-Jie Hong ◽  
Kuan-Ting Lin ◽  
Yao-Tsung Tsai ◽  
...  

In this study, a novel low impact ionization rate (low-IIR) poly-Si thin film transistor featuring a current and electric field split (CES) structure with bottom field plate (BFP) and partial thicker channel raised source/drain (RSD) designs is proposed and demonstrated. The bottom field plate design can allure the electron and alter the electron current path to evade the high electric field area and therefore reduce the device IIR and suppress the kink effect. A two-dimensional device simulator was applied to describe and compare the current path, electric field magnitude distributions, and IIR of the proposed structure and conventional devices. In addition, the advantages of a partial thicker channel RSD design are present, and the leakage current of CES-thin-film transistor (TFT) can be reduced and the ON/OFF current ratio be improved, owing to a smaller drain electric field.


2011 ◽  
Vol 383-390 ◽  
pp. 5851-5854
Author(s):  
Yung Yu Chen

Due to the reduced gate coupling ratio, the channel Fowler-Nordheim (CFN) programming speed of stacked-gate flash memories with high-permittivity (k) tunnel dielectrics (TDs) is helpless in operation voltage reduction. Although the electric field on high-k tunnel dielectrics is lower than SiO2 tunnel oxide, enhanced impact ionization rate and lower barrier height contribute to higher channel hot-electron (CHE) injection current and efficiency. Consequently, high-k TDs are only effective for the memories programmed with hot electron injection rather than FN tunneling, which is suitable for the NOR-type stacked-gate flash memories.


Author(s):  
Abebe T. Tarekegne ◽  
Krzysztof Iwaszczuk ◽  
Hideki Hirori ◽  
Koichiro Tanaka ◽  
Peter U. Jepsen

The Monte Carlo (MC) simulation of the carrier transport mechanisms including impact ionization at high electric field in GaN is presented. Two non-parabolic conduction and valence bands were considered for the simulation of transport properties of electron and hole respectively. The carriers’ drift velocity and energy are simulated as a function of applied electric field at room temperature. The maximum velocity of electron is 2.85 × 107 cm/s at 140 kV/cm. The velocity of electron is saturated at 2 × 107 cm/s at electric field greater than 300 kV/cm. In our work, the velocity of hole is 5 × 106 cm/s at 500 kV/cm. Electron energy increases as the electric field increase and fluctuated at electric field greater than 600 kV/cm when impact ionization occurred. The impact ionization rates are obtained by using modified Keldysh equation. The hole impact ionization rate is higher than that of electron. This work also shows higher electron impact ionization coefficient than that of hole at electric field greater than 4.04 MV/cm


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