Intermetallic M Pt3 (M = Ti, Zr, Hf): Elastic, electronic, optical and thermal properties

2019 ◽  
Vol 33 (18) ◽  
pp. 1950189 ◽  
Author(s):  
S. K. Mitro ◽  
M. A. Rahman ◽  
F. Parvin ◽  
A. K. M. A. Islam
Keyword(s):  
Thermal Properties ◽  
Elevated Temperatures ◽  
Visible Region ◽  
Debye Model ◽  
Mechanical And Thermal Properties ◽  
Electronic Band ◽  
Thermal Expansion Coefficients ◽  
High Thermal Expansion ◽  
Expansion Coefficients ◽  
Electronic Band Structures

In this study, the structural and unexplored elastic, electronic, optical and thermal properties of Pt-based alloys MPt3 (M = Ti, Hf) and only optical and thermal properties of ZrPt3 are subjected to investigation using the method of the first principles. The results of pressure dependence of mechanical and thermal properties are discussed. The electronic band structures and density of state data show metallic conductivity for all the compounds. The main contribution at Fermi level comes from Ti 3d and Zr 4d (for TiPt3 and ZrPt[Formula: see text] and Pt 5d (for HfPt[Formula: see text] orbitals. The materials’ optical reflectivity values, relatively high in the IR-visible-UV regions, range from [Formula: see text]62% to 72% in the visible region which show better performance values in comparison to those of some representative materials PtAl2, AuAl2 and GdX3 (X = In, Sn, Tl, Pb). The unexplored thermal behaviors are also investigated via quasi-harmonic Debye model at T = 0 and P = 0 as well as at elevated temperatures and pressures. In addition, when used as bonding materials, studied intermetallics with moderately high thermal expansion coefficients can match other substrates. This coupled with the estimated thermal conductivities (k[Formula: see text]) compared to several other species indicate that the intermetallics can be used in applications, such as thermal barrier coatings (TBC). This study has thus indicated possible alternative candidates for high-temperature applications which would initiate further research and development on the intermetallics under study.

Mechanical and Thermal Properties of MgAl2O4-Y3Al5O12 Ceramic Composites

2018 ◽  
Vol 281 ◽  
pp. 255-260 ◽  
Author(s):  
Jiang Bo Liu ◽  
Zhou Fu Wang ◽  
Hao Liu ◽  
Xi Tang Wang ◽  
Yan Ma
Keyword(s):  
Thermal Properties ◽  
Raw Materials ◽  
Laser Flash ◽  
Ceramic Composites ◽  
Mechanical And Thermal Properties ◽  
X Ray Diffraction ◽  
Thermal Expansion Coefficients ◽  
Expansion Coefficients ◽  
Increasing Temperature ◽  
Flash Diffusivity

MgAl2O4-Y3Al5O12 ceramic composites were prepared using fused spinel and a Y2O3 micropowder as the raw materials. The microstructure and thermal properties of the composites were characterized by X-ray diffraction, scanning electron microscopy, laser flash diffusivity measurements. The mechanical properties were also determined. MgAl2O4-Y3Al5O12 ceramic composites are composed of spinel and garnet structures. The thermal expansion coefficients of MgAl2O4 and MgAl2O4-Y3Al5O12 ceramics are similar. The measured thermal diffusivity decreases gradually with increasing temperature. Thermal conductivity of the composites is in the range of 3.3-5.8 W∙m-1∙K-1 from 400°C to 900°C.

Preparation and Properties Study of Cu-MoSi2 Composites

2007 ◽  
Vol 534-536 ◽  
pp. 581-584 ◽  
Author(s):  
Xiaoou Yi ◽  
Wei Hao Xiong ◽  
Jian Li
Keyword(s):  
Thermal Conductivity ◽  
Thermal Expansion ◽  
Thermal Properties ◽  
Mechanical And Thermal Properties ◽  
Matrix Composites ◽  
Thermal Expansion Coefficients ◽  
Low Thermal Expansion ◽  
Powder Metallurgy Process ◽  
Expansion Coefficients ◽  
Metallurgy Process

The particulate dispersive strengthened Cu-MoSi2 composites were prepared by a powder metallurgy process with aim to develop novel copper based composites of reasonable strength, high thermal conductivity and low thermal expansion coefficients. Compacted samples were sintered to over 90% of theoretical density. Microstructure of the composites was investigated by SEM while mechanical properties such as tensile strength, elongation and thermal properties such as thermal conductivity and thermal expansion coefficient (CTE) of the composites were examined as a function of the MoSi2 content and the process of fabrication. A comparative analysis of the mechanical and thermal properties of various Cu-matrix composites currently in use was given and the strengthening mechanisms for the Cu-MoSi2 composites were discussed.

Novel Silicon-Elastomers for Advanced Soft Lithography

2006 ◽  
Vol 947 ◽  
Author(s):  
Kyung Choi
Keyword(s):  
Thermal Expansion ◽  
High Resolution ◽  
Soft Lithography ◽  
Materials Properties ◽  
Nano Scale ◽  
Thermal Expansion Coefficients ◽  
High Thermal Expansion ◽  
Expansion Coefficients

ABSTRACTHigh resolution pattern transfers in the nano-scale regime have been considerable challenges in ‘soft lithography’ to achieve nanodevices with enhanced performances. In this technology, the resolution of pattern integrations is significantly rely on the materials' properties of polydimethylsiloxane (PDMS) stamps. Since commercial PDMS stamps have shown limitations in nano-scale resolution soft lithography due to their low physical toughness and high thermal expansion coefficients, we developed stiffer, photocured PDMS silicon elastomers designed, specifically for nano-sized soft lithography and photopatternable nanofabrications.

Preparation and Characterization of Thermally Compatible Leucite-Reinforced Dental Ceramics

2011 ◽  
Vol 308-310 ◽  
pp. 311-314
Author(s):  
Jin Wen ◽  
Shu Zhen Sun
Keyword(s):  
Thermal Expansion ◽  
Dental Ceramics ◽  
Dental Porcelain ◽  
Thermal Expansion Coefficients ◽  
High Thermal Expansion ◽  
Coprecipitation Technique ◽  
Thermal Compatibility ◽  
The Common ◽  
Expansion Coefficients

The high average thermal expansion required for thermal compatibility of dental porcelain with their substrate alloy is supplied by the mineral leucite (KAlSi2O6). In the research, the high thermal expansion coefficients phase leucite was prepared by coprecipitation technique. Three materials with formulae of K2O∶Al2O3∶SiO2= 1∶1∶x ( x=1.4, 2.0, 4.0 ) were investigated for differences in phase, thermal expansion. Unstoichiometric composition where K2O and Al2O3were added properly is advantage to leucite obtained. Coprecipitation processing produced fine leucite powder that would sinter at 1300°C, this temperature is about 200°C lower than of melting method. The average thermal expansion coefficients of leucite is 22.7×10-6/°Cfrom room temperature to 620°C,which is higher than the common porcelain. Changing in the leucite content of dental porcelain would results from thermal expansion coefficients of porcelain variation, which could be responsible for changes in porcelain-metal thermal compatibility.

Variation of the Expansion Coefficient of Nanofluids With Temperature: A Correction for Conductivity Data

2012 ◽  
Vol 3 (4) ◽  
Author(s):  
Efstathios E. Michaelides
Keyword(s):  
Thermal Conductivity ◽  
Thermal Expansion ◽  
Conductivity Data ◽  
Volumetric Fraction ◽  
Solid Materials ◽  
Strong Function ◽  
Temperature Changes ◽  
Thermal Expansion Coefficients ◽  
High Thermal Expansion ◽  
Expansion Coefficients

The two constituent phases of the nanofluids have thermal expansion coefficients that are significantly different. Moreover, the variability of the thermal expansion coefficients of fluids with temperature is significantly higher than that of solid materials. The mismatch of the thermal expansion coefficients creates changes of the volumetric fraction of solids with temperature changes. The changes can be significant with fluids that have high thermal expansion coefficients, such as refrigerants and fluids that operate close to their critical points. Since the thermal conductivity of nanofluids is a very strong function of the volumetric fraction of the nanoparticles, these changes of the volumetric fraction may cause significant effects on the thermal conductivity of the nanofluids, which must be accounted for in any design process.

Thermal expansion coefficients of a binary alloy Ni80Zr20 at elevated temperatures

1984 ◽  
Vol 17 (5) ◽  
pp. 359-360
Author(s):  
S. K. Shadangi ◽  
U. K. Shadangi ◽  
S. C. Panda
Keyword(s):  
Thermal Expansion ◽  
Thermal Expansion Coefficient ◽  
Expansion Coefficient ◽  
Elevated Temperatures ◽  
Intermetallic Phase ◽  
Lattice Parameter ◽  
Solid Solution Phase ◽  
Linear Variation ◽  
Thermal Expansion Coefficients ◽  
Expansion Coefficients

The Debye–Scherrer pattern of the alloy Ni80Zr20 clearly shows the presence of a nickel solid-solution phase along with a new intermetallic phase Ni23Zr6, which seems to be isostructural with the Co23Zr6 phase. The thermal expansion coefficient of the Ni23Zr6 phase has been investigated in the temperature range 1003–1493 K. Linear variation of lattice parameter with temperature has been observed. The thermal expansion coefficient remains almost constant throughout this temperature interval.

Electron and Phonon Transport in n- and p-type Skutterudites

2013 ◽  
Vol 1490 ◽  
pp. 9-18 ◽  
Author(s):  
Jiong Yang ◽  
S. Wang ◽  
Jihui Yang ◽  
W. Zhang ◽  
L. Chen
Keyword(s):  
Power Factor ◽  
Thermal Conduction ◽  
Elevated Temperatures ◽  
Phonon Transport ◽  
Strong Electron ◽  
Electronic Band ◽  
Filled Skutterudites ◽  
Module Development ◽  
P Type ◽  
Electronic Band Structures

ABSTRACTFilled skutterudites are one of the most promising materials for thermoelectric (TE) power generation applications at intermediate temperatures due to their superior TE and thermomechanical performance as compared to other materials. In the past, we have demonstrated that n-type skutterudites can be optimized so that their maximum TE figure of merit reaches 1.7 at 850 K. TE performance of the p-type, however, is lagging behind, which hinders the optimization of skutterudites-based TE module development. In this paper we reveal that the underlying reasons for inferior TE properties of the p-type root in their electronic band structures, which result in higher thermal conductivity at elevated temperatures due to bipolar lattice thermal conduction and lower power factor because of heavy valance bands induced strong electron-phonon interactions. We also identify means of improving the power factor and reducing bipolar effect.

Properties and crystallization of Li2O–CaO–Al2O3–SiO2–TiO2glasses

1993 ◽  
Vol 8 (4) ◽  
pp. 890-898 ◽  
Author(s):  
Moo-Chin Wang ◽  
Min-Hsiung Hon
Keyword(s):  
Thermal Expansion ◽  
Thermal Properties ◽  
Diffraction Analysis ◽  
Crystalline Phase ◽  
Glass Ceramics ◽  
Weight Percent ◽  
X Ray Diffraction ◽  
X Ray ◽  
Thermal Expansion Coefficients ◽  
Expansion Coefficients

The addition of CaO to Li2O–Al2O3–SiO2–TiO2(LAST), forming the Li2O–CaO–Al2O3–SiO2–TiO2(LCAST) system, is used in the preparation of low themal expansion coefficient glass-ceramics. By a progressive weight percent substitution of CaO for SiO2, at constant ratios of concentration of Li2O, Al2O3, and TiO2, a number of properties of these glasses have been studied. The results indicated that these thermal properties increased progressively with increasing CaO concentration. X-ray diffraction analysis was utilized to identify the crystalline phase in glass-ceramics of the Li2O–CaO–Al2O3–SiO2-TiO2system. Thed-spacings of the major crystallites were precisely measured and fitted with those of β-spodumene. The minor crystalline phase of titanite, CaO · TiO2· SiO2, was also present. The average thermal expansion coefficients from 25 to 700 °C were 3.50 × 10−6/°C, 3.81 × 10−6/°C, and 3.91 × 10−6/°C for samples A, B, and C, respectively.

Measurements of Thermal Properties of Gaskets for the Design of Bolted Flange Joints Under Thermal Conduction Conditions

2006 ◽  
Author(s):  
Takahiro Ohmura ◽  
Kanji Hanashima ◽  
Junichi Nyumura ◽  
Toshiyuki Sawa
Keyword(s):  
Thermal Conductivity ◽  
Thermal Expansion ◽  
Thermal Properties ◽  
Effective Thermal Conductivity ◽  
Linear Thermal Expansion ◽  
Absolute Temperature ◽  
Thermal Expansion Coefficients ◽  
Expansion Coefficients ◽  
Bolted Flange ◽  
The Relationship

In this study, the thermal properties of the gaskets, which were used for designing the bolted flange joints, such as effective thermal conductivity, specific heat, linear thermal expansion coefficient and so on were measured. Especially, the effective thermal conductivities were measured by using the heat flow method. The relationship between the gasket structure and the thickness was shown by using an equivalent thermal resistance, and an empirical equation of effective thermal conductivity, which was related to the bulk density and absolute temperature, was proposed by deriving the heat conduction in solid, radiation and gas. Also, in the measurement of the linear thermal expansion coefficients of the gaskets, the measured values were shown to change substantially below 150 °C, and to depend on the heating rate and the load applied on the gasket sample.

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