TWO-DIMENSIONAL SILICON-BASED PHOTONIC CRYSTAL SLAB WITH PARTIAL AIR-BRIDGE

2006 ◽  
Vol 05 (06) ◽  
pp. 683-687 ◽  
Author(s):  
JIE TIAN ◽  
SHOU-ZHEN HAN ◽  
BING-YING CHENG ◽  
SHUAI FENG ◽  
ZHI-YUAN LI ◽  
...  
Keyword(s):  
Photonic Crystal ◽  
Focused Ion Beam ◽  
Near Infrared ◽  
Ion Beam ◽  
Fdtd Method ◽  
Direct Write ◽  
Silica Layer ◽  
Two Dimensional ◽  
Large Area ◽  
Silicon Based

We describe a fabrication process of the near-infrared two-dimensional photonic crystal (PC) slab, which is sustained by part of the silica layer underneath the slab and forms a partly air-bridged type. The process involves focused ion beam (FIB) direct write following the selective wet etching of silicon on isolator (SOI) structures. By control the time of dissolving of silica layer in SOI, we successfully fabricated the sample and measured its transmittance spectrum. It is found that the observed spectrum is consistent with the theoretical band structure with FDTD method. For there is partly silica layer remained to support the air-bridge slab, the PC can be fabricated with a large area. If we change the support material under the slab, we might be able to fabricate PC laser with this kind of structure.

scholarly journals Large Area Nanohole Arrays for Sensing Fabricated by Interference Lithography

Sensors ◽  
2019 ◽  
Vol 19 (9) ◽  
pp. 2182 ◽  
Author(s):  
Chiara Valsecchi ◽  
Luis Enrique Gomez Armas ◽  
Jacson Weber de Menezes
Keyword(s):  
Soft Lithography ◽  
Focused Ion Beam ◽  
Near Infrared ◽  
Ion Beam ◽  
Production Method ◽  
Interference Lithography ◽  
Visible Range ◽  
Large Area ◽  
Nanohole Array ◽  
Nanohole Arrays

Several fabrication techniques are recently used to produce a nanopattern for sensing, as focused ion beam milling (FIB), e-beam lithography (EBL), nanoimprinting, and soft lithography. Here, interference lithography is explored for the fabrication of large area nanohole arrays in metal films as an efficient, flexible, and scalable production method. The transmission spectra in air of the 1 cm2 substrate were evaluated to study the substrate behavior when hole-size, periodicity, and film thickness are varied, in order to elucidate the best sample for the most effective sensing performance. The efficiency of the nanohole array was tested for bulk sensing and compared with other platforms found in the literature. The sensitivity of ~1000 nm/RIU, achieved with an array periodicity in the visible range, exceeds near infrared (NIR) performances previously reported, and demonstrates that interference lithography is one of the best alternative to other expensive and time-consuming nanofabrication methods.

Y-TYPE PHOTONIC CRYSTAL WAVEGUIDE WITH MINIMUM BRANCHES SPACE

2006 ◽  
Vol 05 (06) ◽  
pp. 743-746
Author(s):  
SHOUZHEN HAN ◽  
JIE TIAN ◽  
CHENG REN ◽  
XINGSHENG XU ◽  
ZHIYUAN LE ◽  
...  
Keyword(s):  
Photonic Crystal ◽  
Integrated Circuits ◽  
Focused Ion Beam ◽  
Near Infrared ◽  
Ion Beam ◽  
Infrared Region ◽  
Photonic Crystal Waveguide ◽  
Ion Beam Etching ◽  
Optical Integrated Circuits ◽  
All Optical

The abstract should summarize the context, content and conclusions of the paper in less than 200 words. We fabricated a two-dimensional Y-branch photonic crystal waveguide in the near infrared region by using focused ion beam etching and depositing system. The light guide characters of the waveguide were measured for three different spaces between branches. Field intensity distributions of TE polarized wave in the branches were simulated by using the transfer matrix method. Both the theoretical and experimental results show that the shortest space between branches of the photonic crystal waveguide is about 1.4 times wavelength of transmitted light. If the space became shorter, the light in the two branches would couple to each other seriously. This result might be helpful for the design of compact wave demultiplexer and all-optical integrated circuits.

Deposition Mechanism of Oxide Thin Films Manufactured by a Focused Energetic Beam Process

2002 ◽  
Vol 749 ◽  
Author(s):  
H.D. Wanzenboeck ◽  
S. Harasek ◽  
H. Langfischer ◽  
E. Bertagnolli
Keyword(s):  
Focused Ion Beam ◽  
Silicon Oxide ◽  
Ion Beam ◽  
Chemical Vapor ◽  
Solid Material ◽  
Sample Surface ◽  
Direct Write ◽  
Large Area ◽  
Mixture Ratio ◽  
Process Energy

ABSTRACTChemical vapor deposition (CVD) is a versatile deposition technique for both dielectrics and metals. CVD is based upon the adsorption of a volatile species from the gas phase and the decomposition of the adsorbed molecules on the sample surface resulting in the deposition of solid material. In contrast to thermal CVD or plasma assisted CVD used for large area coatings this work focuses on a method for locally confined deposition. A focused energetic beam is used to provide the necessary activation energy for CVD. With a focused beam material could be deposited locally within a strictly confined area down to the nanometer range. The deposition of silicon oxide microstructures utilizing two precursor gases - siloxane and oxygen - was performed by direct-write nanolithography. For initiating the CVD process energy is introduced by local ion exposure utilizing a scanning focused ion beam (FIB). The influence of the different ion fluxes and the effect of the mixture ratio of precursors were studied. Deliberate changes in the process parameters allowed adjusting the physical properties and the chemical composition of the solid silicon oxide. Process control allows tailoring of material properties according to requirements of the application.

Rapid prototyping of two-dimensional photonic crystal devices by a dual beam focused ion beam system

2005 ◽  
Vol 78-79 ◽  
pp. 417-421 ◽  
Author(s):  
T. Stomeo ◽  
G. Visimberga ◽  
M.T. Todaro ◽  
A. Passaseo ◽  
R. Cingolani ◽  
...  
Keyword(s):  
Photonic Crystal ◽  
Rapid Prototyping ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Two Dimensional ◽  
Dimensional Photonic Crystal ◽  
Beam System ◽  
Dual Beam ◽  
Two Dimensional Photonic Crystal

An Infrared Microscope for Use on a Focused Ion Beam for Circuit Edit and Backside Edit Applications

2015 ◽  
Author(s):  
Alexander Richards ◽  
Matthew Weschler ◽  
Michael Durller
Keyword(s):  
Focused Ion Beam ◽  
Near Infrared ◽  
Ion Beam ◽  
Visible Spectrum ◽  
Camera System ◽  
Buried Structures ◽  
Ir Camera ◽  
Area Of Interest ◽  
Near Ultraviolet ◽  
Infrared Microscope

Abstract To help solve the navigational problem, i.e., being able to successfully locate a circuit for probing or editing without destroying chip functionality, a near-infrared (NIR), near-ultraviolet (NUV), and visible spectrum camera system was developed that attaches to most focused ion beam (FIB) or scanning electron microscope vacuum chambers. This paper reviews the details of the design and implementation of the NIR/NUV camera system, as instantiated upon the FEI FIB 200, with a particular focus on its use for the visualization of buried structures, and also for non-destructive real time area of interest location and end point detection. It specifically considers the use of the micro-optical camera system for its benefit in assisting with frontside and backside circuit edit, as well as other typical FIB milling activities. The quality of the image obtained by the IR camera rivals or exceeds traditional optical based imaging microscopy techniques.

scholarly journals Direct-write, focused ion beam-deposited, 7 K superconducting C–Ga–O nanowire

2010 ◽  
Vol 96 (26) ◽  
pp. 262511 ◽  
Author(s):  
Pashupati Dhakal ◽  
G. McMahon ◽  
S. Shepard ◽  
T. Kirkpatrick ◽  
J. I. Oh ◽  
...  
Keyword(s):  
Focused Ion Beam ◽  
Ion Beam ◽  
Direct Write

Fabrication of large area nanogap electrodes for sensing applications

2013 ◽  
Vol 1530 ◽  
Author(s):  
A. Bendavid ◽  
L. Wieczorek ◽  
R. Chai ◽  
J. S. Cooper ◽  
B. Raguse
Keyword(s):  
Large Scale ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Beam Current ◽  
Fabrication Method ◽  
Large Area ◽  
Sensor Applications ◽  
Sensing Applications ◽  
Lift Off ◽  
Nanogap Electrodes

ABSTRACTA large area nanogap electrode fabrication method combinig conventional lithography patterning with the of focused ion beam (FIB) is presented. Lithography and a lift-off process were used to pattern 50 nm thick platinum pads having an area of 300 μm × 300 μm. A range of 30-300 nm wide nanogaps (length from 300 μm to 10 mm ) were then etched using an FIB of Ga+ at an acceleration voltage of 30 kV at various beam currents. An investigation of Ga+ beam current ranging between 1-50 pA was undertaken to optimise the process for the current fabrication method. In this study, we used Monte Carlo simulation to calculate the damage depth in various materials by the Ga+. Calculation of the recoil cascades of the substrate atoms are also presented. The nanogap electrodes fabricated in this study were found to have empty gap resistances exceeding several hundred MΩ. A comparison of the gap length versus electrical resistance on glass substrates is presented. The results thus outline some important issues in low-conductance measurements. The proposed nanogap fabrication method can be extended to various sensor applications, such as chemical sensing, that employ the nanogap platform. This method may be used as a prototype technique for large-scale fabrication due to its simple, fast and reliable features.

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