Dislocation Associated with SiC Formation on the Seed Surface during Silicon Crystal Growth Process by the Czochralski Method

2003 ◽  
Vol 42 (Part 1, No. 3) ◽  
pp. 1133-1138 ◽  
Author(s):  
Youji Mizuhara ◽  
Masami Hasebe
2020 ◽  
Vol 1003 ◽  
pp. 247-253
Author(s):  
Zhi Xin Ma ◽  
Xiao Guo Bi ◽  
Xu Dong Liu ◽  
Xiao Dong Li ◽  
Ji Guang Li ◽  
...  

LYSO:Ce single crystal was widely manufactured by Czochralski method. Considering its high cost and the pollution of the crucible, we tried to prepare the crystal by Verneuil method. Unlike Czochralski method, the Verneuil method need the powders with excellent fluidity and high purity. By comparing the powders annealed at 1100°C,1200°C,1300°C,1400°C and 1500°C, we can obtained the needed powders at 1500°C. We also increased the content of silica to satisfy the volatilization in crystal growth process. The single crystal was prepared by changing the growth parameter. We investigated the phase and the microstructure of the powders and observed the microstucture of the crystal fracture. We discussed the improved method of the process of crystal growth.


2014 ◽  
Vol 401 ◽  
pp. 120-123 ◽  
Author(s):  
Kirils Surovovs ◽  
Andris Muiznieks ◽  
Andrejs Sabanskis ◽  
Janis Virbulis

Author(s):  
Jun Liu

The present work is aimed at developing an axial symmetric thermal analysis model for designing the hot-zone of a silicon crystal growth furnace. An analysis model is developed which can be used to predict the approximate pulling rate and power consumption during silicon crystal growth process when utilizing the Czochralski (CZ) method. In addition, the effectiveness of this analysis model is experimentally confirmed.


2012 ◽  
Vol 2012 ◽  
pp. 1-6 ◽  
Author(s):  
Ying-Yang Teng ◽  
Jyh-Chen Chen ◽  
Chung-Wei Lu ◽  
Cheng-Chuan Huang ◽  
Wan-Ting Wun ◽  
...  

We perform numerical simulations to analyze the effect of the position of the heater on the thermal and flow fields and the oxygen concentration distribution during the industrial Cz silicon crystal growth process. The amount of oxygen released from the silica crucible to the silicon melt during the growth process can be lowered by adjusting the heater position to decrease the temperature on the crucible wall. During growth of the crystal body, there is a significant decrease in the gradient of the oxygen concentration along the melt-crystal interface due to the stronger Taylor-Proudman vortex, which is generated by the crucible and crystal rotation. There is a significant reduction in the average oxygen concentration at the melt-crystal interface for longer crystal lengths because of the lower wall temperature, smaller contact surface between the crucible wall and the melt and the stronger Taylor-Proudman vortex.


2021 ◽  
pp. 31-52
Author(s):  
Rabindra Satpathy ◽  
Venkateswarlu Pamuru

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