High Field-Effect Mobility Bottom-Gated Metallorganic Chemical Vapor Deposition ZnO Thin-Film Transistors with SiO[sub 2]∕Si[sub 3]N[sub 4] Bilayer Gate Dielectric

2010 ◽  
Vol 157 (12) ◽  
pp. H1110 ◽  
Author(s):  
K. Remashan ◽  
Y. S. Choi ◽  
S. J. Park ◽  
J. H. Jang
Keyword(s):  
Thin Film ◽  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Thin Film Transistors ◽  
Field Effect ◽  
High Field ◽  
Gate Dielectric ◽  
Chemical Vapor ◽  
Zno Thin Film ◽  
Field Effect Mobility

High Field Effect Mobility in Si Face 4H-SiC MOSFET Made on Sublimation Grown Epitaxial Material

2005 ◽  
Vol 483-485 ◽  
pp. 841-844 ◽  
Author(s):  
Einar Ö. Sveinbjörnsson ◽  
H.Ö. Ólafsson ◽  
G. Gudjónsson ◽  
Fredrik Allerstam ◽  
Per Åke Nilsson ◽  
...  
Keyword(s):  
Chemical Vapor Deposition ◽  
Surface Morphology ◽  
Vapor Deposition ◽  
Field Effect ◽  
High Field ◽  
Chemical Vapor ◽  
Field Effect Mobility ◽  
Fabrication And Characterization ◽  
Peak Field

We report on fabrication and characterization of n-channel Si face 4H-SiC MOSFETs made using sublimation grown epitaxial material. Transistors made on this material exhibit record-high peak field effect mobility of 208 cm2/Vs while reference transistors made on a commercial epitaxial material grown by chemical vapor deposition (CVD) show field effect mobility of 125 cm2/Vs. The mobility enhancement is attributed to better surface morphology of the sublimation grown epitaxial layer.

Hot-wire CVD a-Si:H TFT on Plastic Substrates

2006 ◽  
Vol 910 ◽  
Author(s):  
Farhad Taghibakhsh ◽  
K.S. Karim
Keyword(s):  
Thin Film ◽  
Chemical Vapor Deposition ◽  
Amorphous Silicon ◽  
Vapor Deposition ◽  
Thin Film Transistors ◽  
Gate Dielectric ◽  
Chemical Vapor ◽  
Plastic Substrate ◽  
Hot Wire ◽  
Low Leakage

AbstractFabrication of hot-wire chemical vapor deposition (HWCVD) of amorphous silicon (a-Si) thin film transistors (TFT) on thin polyamide sheets is reported. A single graphite filament at 1500 °C was used for HWCVD and device quality amorphous silicon films were deposited with no thermal damage to plastic substrate. Top-gate staggered thin film transistors (TFTs) were fabricated at 150°C using hot-wire deposited a-Si channel, Plasma enhanced chemical vapor deposition (PECVD) silicon nitride gate dielectric, and microcrystalline n+ drain/source contacts. Low leakage current of 5×10-13 A, high switching current ratio of 1.3×107, and small sub threshold swing of 0.3 V/dec was obtained for TFTs with aspect ratio of 1300μm/100μm. The field effect mobility was extracted to be 0.34 cm2/V.s.

Properties of Amorphous Silicon Thin Film Transistors with Phosphorous-Doped Hydrogenated Microcrystalline Silicon

1996 ◽  
Vol 452 ◽  
Author(s):  
J. H. Choi ◽  
C. W. Kim ◽  
H. G. Yang ◽  
J. H. Souk
Keyword(s):  
Thin Film ◽  
Vapor Deposition ◽  
Thin Film Transistors ◽  
Field Effect ◽  
Chemical Vapor ◽  
Field Effect Mobility ◽  
Rf Power ◽  
Microcrystalline Silicon ◽  
Silicon Thin Film ◽  
Threshold Voltages

AbstractPhosphorous (P) doped hydrogenated microcrystallme silicon (n+μ c-Si:H) films have been prepared by using the hydrogen-diluted plasma enhanced chemical vapor deposition (PECVD) method. The crystallinity of films deposited over the range of SiH4/H2 flow ratios and RF-power is studied by Raman spectroscopy. For a 900 Å thick film deposited at 250°C, a conductivity of 71Ω−1cm−1 and an average crystallinity of 49% is obtained. n+ μ c-Si:H films as well as n+ a-Si:H films are used for both etch stopper and back channel etch type TFTs and the I4-V8 characteristics are compared. For the etch stopper type TFT, the field effect mobility of 0.85 cm2/V.sec, threshold voltages of 2 – 3 V and Ion/Ioff ratio of ∼107 are obtained.

Low-Temperature Formation of SiNx Gate Insulator for Thin-Film Transistor Using CAT-CVD Method

1998 ◽  
Vol 508 ◽  
Author(s):  
A. Izumi ◽  
T. Ichise ◽  
H. Matsumura
Keyword(s):  
Thin Film ◽  
Chemical Vapor Deposition ◽  
Silicon Nitride ◽  
Vapor Deposition ◽  
Thin Film Transistors ◽  
Chemical Vapor ◽  
State Density ◽  
Gate Insulator ◽  
Catalytic Chemical Vapor Deposition ◽  
Silicon Nitride Films

AbstractSilicon nitride films prepared by low temperatures are widely applicable as gate insulator films of thin film transistors of liquid crystal displays. In this work, silicon nitride films are formed around 300 °C by deposition and direct nitridation methods in a catalytic chemical vapor deposition system. The properties of the silicon nitride films are investigated. It is found that, 1) the breakdown electric field is over 9MV/cm, 2) the surface state density is about 1011cm−2eV−1 are observed in the deposition films. These result shows the usefulness of the catalytic chemical vapor deposition silicon nitride films as gate insulator material for thin film transistors.

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