scholarly journals Selective Glaze for Last Line Visible Thermal Head

1981 ◽  
Vol 8 (1-2) ◽  
pp. 115-121
Author(s):  
Kaoru Hashimoto ◽  
Nobuo Kamehara ◽  
Minoru Terashima ◽  
Koichi Niwa
Keyword(s):  
Thin Film ◽  
Thick Film ◽  
Power Supply ◽  
Ceramic Substrate ◽  
Alumina Substrate ◽  
Experimental Results ◽  
Print Quality ◽  
Heat Sources ◽  
Fine Grained ◽  
Screen Printed

A thermal head in which the last line is visible allows characters to be viewed as soon as they are printed. The thermal head is constructed with a selective glazed layer and heat sources, which are formed at the edge of a ceramic substrate. The selective glazed layer must be smooth and flat, even at the edge, for heat sources to be formed on it. Selective glaze characteristics were studied using PbO-B2O3-SiO2and B2O3-SiO2glazing materials to realize the last line visible thermal head. Several commercially available gold conductors were screen printed on fine grained alumina substrates. Wettability, levelling characteristics and flatness at the edge of the selective glaze on each gold conductor were examined. Dependence of their characteristics on firing conditions were also examined. A combination of PbO-B2O3-SiO2glass and fritless gold conductor provides a smooth and flat glaze surface even at the edge, and experimental results show that PbO-B2O3-SiO2glazing material has the most suitable characteristics for a last line visible thermal head. A last line visible thermal head was formed using PbO-B2O3-SiO2glazing material. The selective glazed layer was formed over the thick film circuits of gold for the power supply, which were screen printed on a fine grained alumina substrate. Ta2N thin film for resistive heat sources was formed at the edge of the glazed layer. The thermal head provides good print quality and can print 20 characters/line at 5 lines/sec with a resolution of 2.7 dots/mm.

scholarly journals A Study on Effect of Line Width, Composition and Firing Temperature on the Microstripline Properties

2000 ◽  
Vol 23 (3) ◽  
pp. 163-173 ◽  
Author(s):  
Sunit Rane ◽  
Vijaya Puri
Keyword(s):  
Thin Film ◽  
Thick Film ◽  
Line Width ◽  
Firing Temperature ◽  
Thick Films ◽  
Alumina Substrate ◽  
Thin Film Technology ◽  
Binder Composition ◽  
Cu Thin Film ◽  
Ku Band

The transmittance and reflectance of microstriplines of different widths, fabricated by thick film and thin film technology are studied in the X and Ku band (8–18 GHz). The fritless thick film Ag pastes with different binder composition was formulated indigenously and screen-printed the microstriplines on alumina substrate. These microstriplines were compared with the microstriplines made from ESL (USA) pastes and also Cu thin film circuits. The effect of line width, composition and firing temperature on the thick film microstriplines was investigated. The transmittance of all the indigenously prepared Ag thick film paste compared well with microstriplines prepared with ESL pastes. All these thick film pastes gave good transmittance upto 18.0 GHz. The results indicate firing at 700℃ gives best films, and also 18 mil or 20-mil line width is more suitable than conventional 25-mil line width if thick films are used for metallization upto 18.0 GHz.

Screen printed carbon nanotube thick film on alumina substrate

2017 ◽  
Vol 43 (5) ◽  
pp. 4612-4617 ◽  
Author(s):  
Varsha D. Phadtare ◽  
Vinayak G. Parale ◽  
Gopal K. Kulkarni ◽  
Ninad B. Velhal ◽  
Hyung-Ho Park ◽  
...  
Keyword(s):  
Carbon Nanotube ◽  
Thick Film ◽  
Alumina Substrate ◽  
Screen Printed

scholarly journals Current Noise in Thick and Thin Film Resistors

1983 ◽  
Vol 10 (2-3) ◽  
pp. 81-85 ◽  
Author(s):  
S. Demolder ◽  
A. Van Calster ◽  
M. Vandendriessche
Keyword(s):  
Thin Film ◽  
Thick Film ◽  
Measured Data ◽  
Measuring Circuit ◽  
Current Noise ◽  
High Quality ◽  
Thin Film Resistors

In this paper a sensitive measuring circuit is described for the measurement of current noise on high quality thin and thick film resistors. Measured data on resistors are presented and analysed.

scholarly journals A Digital Improvement—Trimming a Digital Temperature Sensor with EEPROM Reprogrammable Fuses

Sensors ◽  
2021 ◽  
Vol 21 (5) ◽  
pp. 1700
Author(s):  
Anca Mihaela Vasile (Dragan) ◽  
Alina Negut ◽  
Adrian Tache ◽  
Gheorghe Brezeanu
Keyword(s):  
Standard Deviation ◽  
Power Supply ◽  
Temperature Sensor ◽  
Experimental Results ◽  
Temperature Error ◽  
Thermal Sensor ◽  
Memory Cells ◽  
Temperature Range ◽  
Read Only Memory ◽  
Digital Temperature Sensor

An EEPROM (electrically erasable programmable read-only memory) reprogrammable fuse for trimming a digital temperature sensor is designed in a 0.18-µm CMOS EEPROM. The fuse uses EEPROM memory cells, which allow multiple programming cycles by modifying the stored data on the digital trim codes applied to the thermal sensor. By reprogramming the fuse, the temperature sensor can be adjusted with an increased trim variation in order to achieve higher accuracy. Experimental results for the trimmed digital sensor showed a +1.5/−1.0 ℃ inaccuracy in the temperature range of −20 to 125 ℃ for 25 trimmed DTS samples at 1.8 V by one-point calibration. Furthermore, an average mean of 0.40 ℃ and a standard deviation of 0.70 ℃ temperature error were obtained in the same temperature range for power supply voltages from 1.7 to 1.9 V. Thus, the digital sensor exhibits similar performances for the entire power supply range of 1.7 to 3.6 V.

Synthesis of Nanocomposite thin film Ti/Al Multilayers and Ti-Aluminides

1996 ◽  
Vol 457 ◽  
Author(s):  
R. Banerjee ◽  
X. D. Zhang ◽  
S. A. Dregia ◽  
H. L. Fraser
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Magnetron Sputtering ◽  
Layer Thickness ◽  
Thermodynamic Model ◽  
Interfacial Reactions ◽  
Experimental Results ◽  
Structural Transitions ◽  
Nanocomposite Thin Film ◽  
Multilayered Thin Films

ABSTRACTNanocomposite Ti/Al multilayered thin films have been deposited by magnetron sputtering. These multilayers exhibit interesting structural transitions on reducing the layer thickness of both Ti and Al. Ti transforms from its bulk stable hep structure to fee and Al transforms from fee to hep. The effect of ratio of Ti layer thickness to Al layer thickness on the structural transitions has been investigated for a constant bilayer periodicity of 10 nm by considering three different multilayers: 7.5 nm Ti / 2.5 nm Al, 5 nm Ti / 5 nm Al and 2.5 nm Ti / 7.5 nm Al. The experimental results have been qualitatively explained on the basis of a thermodynamic model. Preliminary experimental results of interfacial reactions in Ti/Al bilayers resulting in the formation of Ti-aluminides are also presented in the paper.

Experimental Study on the Failure Criterion for Brittle Materials in Compression

2011 ◽  
Vol 320 ◽  
pp. 259-262
Author(s):  
Xu Ran ◽  
Zhe Ming Zhu ◽  
Hao Tang
Keyword(s):  
Thin Film ◽  
Experimental Study ◽  
Compressive Strength ◽  
Fracture Mechanics ◽  
Failure Criterion ◽  
Brittle Materials ◽  
Experimental Results ◽  
Experiment Study ◽  
Confining Stress ◽  
Theoretical Results

The mechanical behavior of multi-cracks under compression has become a very important project in the field of fracture mechanics and rock mechanics. In this paper, based on the previous theoretical results of the failure criterion for brittle materials under compression, experiment study is implemented. The specimens are square plates and are made of cement, sand and water, and the cracks are made by using a very thin film (0.1 mm). The relations of material compressive strength versus crack spacing and the lateral confining stress are obtained from experimental results. The experimental results agree well with the failure criterion for brittle materials under compression, which indicates that the criterion is effective and applicable.

Effect of Film Thickness on Fatigue Strength of TiAl Alloy Coated with TiAlN Film at Elevated Temperature

2005 ◽  
Vol 297-300 ◽  
pp. 1446-1451 ◽  
Author(s):  
Takeshi Kasuya ◽  
Hideto Suzuki
Keyword(s):  
Thin Film ◽  
Fatigue Strength ◽  
Film Thickness ◽  
Thick Film ◽  
Physical Vapor Deposition ◽  
Tial Alloy ◽  
Testing Machine ◽  
Intermetallic Alloy ◽  
Fracture Control ◽  
The Difference

The fatigue strength of TiAl intermetallic alloy coated with TiAlN film was studied in vacuum at 1073K using a SEM-servo testing machine. In addition, three kinds of TiAlN films were given by physical vapor deposition (1, 3, and 10μ m). The fatigue strength of 3μ m was highest. Also, the fatigue strength of 1μ m was lowest. From this result, existence of optimum film thickness was suggested because the difference of fatigue strength arose in each film thickness. The justification for existence of optimum film thickness is competition of 45-degree crack and 90-degree crack. The 45-degree crack is phenomenon seen in the thin film (1μ m), and is caused by plastic deformation of TiAl substrate. The 45-degree crack is the factor of the fatigue strength fall by the side of thin film. In contrast, the 90-degree crack is phenomenon in the thick film (10μ m), and is caused as result of reaction against load to film. The 90-degree crack is the factor of the fatigue strength fall by the side of thick film. In conclusion, the optimum film thickness can perform meso fracture control, and improves fatigue strength.

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