scholarly journals Displacement mechanical amplifiers designed on poly-silicon

2019 ◽  
Vol 9 (2) ◽  
pp. 894
Author(s):  
Ramon Cabello-Ruiz ◽  
Margarita Tecpoyotl-Torres ◽  
Alfonso Torres-Jacome ◽  
Gerardo Vera-Dimas ◽  
Svetlana Koshevaya ◽  
...  
Keyword(s):  
Compliant Mechanisms ◽  
Capacitive Accelerometer ◽  
Poly Silicon ◽  
Displacement Sensitivity ◽  
Plane Mode ◽  
Operation Frequency ◽  
Ansys Workbench

Using Poly-Silicon, the implementation of novel Displacement-amplifying Compliant Mechanisms (DaCM), in two geometries of accelerometers, allows for remarkable improvements in their operation frequency and displacement sensitivity, with different proportions. Similar DaCM´s geometries were previously implemented by us with Silicon. In all mentioned cases, the geometries of DaCM´s are adjusted in order to use them with Conventional Capacitive Accelerometer (CCA) and Capacitive Accelerometer with Extended Beams (CAEB), which operate in-plane mode, (y-axis). It should be noted that CAEB shows improvements (95.33%) in displacement sensitivity compared to ACC. Simulations results, carried out using Ansys Workbench software, validate the system’s performance designed with Poly-Silicon. Finally, a comparison with the similar systems, previously designed with Silicon, is also carried out.

scholarly journals Performance of compliant mechanisms applied to a modified shape accelerometer of single and double layer

2019 ◽  
Vol 9 (6) ◽  
pp. 4675
Author(s):  
Margarita Tecpoyotl-Torres ◽  
Ramon Cabello-Ruiz ◽  
Pedro Vargas-Chable ◽  
Jose Gerardo Vera-Dimas ◽  
Alejandra Ocampo-Diaz
Keyword(s):  
Finite Element Method ◽  
Finite Element ◽  
Compliant Mechanisms ◽  
High Sensitivity ◽  
The Finite Element Method ◽  
Capacitive Accelerometer ◽  
Displacement Sensitivity ◽  
Soi Technology ◽  
Plane Mode ◽  
Operation Frequency

<span>Accelerometers are widely used in several mechanisms of high sensitivity. They are employed for example in tilt-control in spacecraft, inertial navigation, oil exploration, seismic monitoring, etc. In order to improve the sensitivity of the measurements, implementation of Displacement-amplifying Compliant Mechanisms (DaCMs) in a capacitive accelerometer have been reported in the literature. In this paper, a system composed of two elements; capacitive accelerometer with extended beams (CAEB) and a DaCM geometry, of single and souble layer, are analysed. Three materials were considered, in the case, for the second layer. The DaCM implementation improves the operation frequency and displacement sensitivity, under different proportions, at the same time. Furthermore, three sweeps were performed: a range of thickness from 25 µm up to 30 µm (to determine the appropriate silicon mass value, using SOI technology), a range of second layer thickness (to choose the more appropriate material and its thickness) and a range of gravity values (to determine the maximum normal stress in the beams, which defines the superior value of the g operation range). The in-plane mode (y-axis) was considered in all analysed cases. This characterization was developed using the Finite Element Method. Structural and modal analysis responses were under study.</span>

scholarly journals A Novel Displacement-amplifying Compliant Mechanism Implemented on a Modified Capacitive Accelerometer

2017 ◽  
Vol 7 (4) ◽  
pp. 1858 ◽  
Author(s):  
Ramon Cabello-Ruiz ◽  
Margarita Tecpoyotl-Torres ◽  
Alfonso Torres-Jacome ◽  
Volodymyr Grimalsky ◽  
Jose Gerardo Vera-Dimas ◽  
...  
Keyword(s):  
Compliant Mechanism ◽  
Operating Frequency ◽  
Oil Exploration ◽  
Capacitive Accelerometer ◽  
Matlab Code ◽  
Displacement Sensitivity ◽  
Frequency Relationship ◽  
Parameter Values ◽  
Plane Mode ◽  
Operation Frequency

The micro-accelerometers are devices used to measure acceleration. They are implemented in applications such as tilt-control in spacecraft, inertial navigation, oil exploration, etc. These applications require high operating frequency and displacement sensitivity. But getting both high parameter values at the same time is difficult, because there are physical relationships, for each one, where the mass is involved. When the mass is reduced, the operating frequency is high, but the displacement sensitivity decreases and vice versa. The implementation of Displacement-amplifying Compliant Mechanism (DaCM) supports to this dependence decreases. In this paper the displacement sensitivity and operation frequency of a Conventional Capacitive Accelerometer are shown (CCA). A Capacitive Accelerometer with Extended Beams (CAEB) is also presented, which improves displacement sensitivity compared with CCA, and finally the implementation of DACM´s in the aforementioned devices was also carried out. All analyzed cases were developed considering the in-plane mode. The Matlab code used to calculate displacement sensitivity and operating frequency relationship is given in Appendix A.

An Objective Evaluation of Displacement-Amplifying Compliant Mechanisms for Sensor Applications

2006 ◽  
Author(s):  
Girish Krishnan ◽  
G. K. Ananthasuresh
Keyword(s):  
Natural Frequency ◽  
Compliant Mechanisms ◽  
Selection Procedure ◽  
Force Sensor ◽  
Objective Evaluation ◽  
Performance Criteria ◽  
Sensor Applications ◽  
Capacitive Accelerometer ◽  
General Evaluation

Displacement-amplifying compliant mechanisms (DaCMs) reported in literature are mostly used for actuator applications. This paper considers them for sensor applications that rely on displacement measurement, and evaluates them objectively. The main goal is to increase the sensitivity under constraints imposed by several secondary requirements and practical constraints. A spring-mass-lever model that effectively captures the addition of a DaCM to a sensor is used in comparing eight DaCMs. We observe that they significantly differ in performance criteria such as geometric advantage, stiffness, natural frequency, mode amplification, factor of safety against failure, cross-axis stiffness, etc., but none excel in all. Thus, a combined figure of merit is proposed using which the most suitable DaCM could be selected for a sensor application. A case-study of a micro machined capacitive accelerometer and another case-study of a vision-based force sensor are included to illustrate the general evaluation and selection procedure of DaCMs with specific applications. Some other insights gained with the analysis presented here were the optimum size-scale for a DaCM, the effect on its natural frequency, limits on its stiffness, and working range of the sensor.

Multi-material topology optimization of compliant mechanisms via solid isotropic material with penalization approach and alternating active phase algorithm

2020 ◽  
Vol 234 (13) ◽  
pp. 2631-2642
Author(s):  
Behzad Majdi ◽  
Arash Reza
Keyword(s):  
Topology Optimization ◽  
Isotropic Material ◽  
Close Agreement ◽  
Optimization Problem ◽  
Compliant Mechanisms ◽  
Active Phase ◽  
Maximum Displacement ◽  
Topology Optimization Problem ◽  
Solid Phases ◽  
Ansys Workbench

The present study aims at providing a topology optimization of multi-material compliant mechanisms using solid isotropic material with penalization (SIMP) approach. In this respect, three multi-material gripper, invertor, and cruncher compliant mechanisms are considered that consist of three solid phases, including polyamide, polyethylene terephthalate, and polypropylene. The alternating active-phase algorithm is employed to find the distribution of the materials in the mechanism. In this case, the multiphase topology optimization problem is divided into a series of binary phase topology optimization sub-problems to be solved partially in a sequential manner. Finally, the maximum displacement of the multi-material compliant mechanisms was validated against the results obtained from the finite element simulations by the ANSYS Workbench software, and a close agreement between the results was observed. The results reveal the capability of the SIMP method to accurately conduct the topology optimization of multi-material compliant mechanisms.

scholarly journals A Modified U-Shaped Micro-Actuator with a Compliant Mechanism Applied to a Microgripper

Actuators ◽  
2019 ◽  
Vol 8 (1) ◽  
pp. 28 ◽  
Author(s):  
Pedro Vargas-Chable ◽  
Margarita Tecpoyotl-Torres ◽  
Ramon Cabello-Ruiz ◽  
Jose Rodriguez-Ramirez ◽  
Rafael Vargas-Bernal
Keyword(s):  
Stress Reduction ◽  
Room Temperature ◽  
Compliant Mechanisms ◽  
Compliant Mechanism ◽  
Equivalent Stress ◽  
Performance Parameters ◽  
The Finite Element Method ◽  
Micro Actuator ◽  
The Impact ◽  
Ansys Workbench

In this paper, a modified U-shaped micro-actuator with a compliant mechanism is proposed. It was analyzed with a uniform and modified thin arm, as well as a similar variation in the corresponding flexure, in order to observe the impact of the compliant lumped mechanism. The use of these compliant mechanisms implies an increment in the deformation and a reduction in the equivalent stress of 25% and 52.25%, respectively. This characterization was developed using the Finite Element Method (FEM) in ANSYS Workbench. The design, analysis and simulation were developed with Polysilicon. In this study, the following performance parameters were also analyzed: force and temperature distribution. This device is supplied with voltage from 0 V up to 3 V, at room temperature. The modified U-shaped actuator was applied in both arms of a microgripper, and to evaluate its electrothermal performance, a static structural analysis has been carried out in Ansys Workbench. The microgripper has an increment in deformation of 22.33%, an equivalent stress reduction of 50%, and a decrease in operation frequency of 10.8%. The force between its jaws is of 367 µN. This low level of force could be useful when sensitive particles are manipulated.

Design Guidelines for MEMS Optical Accelerometer based on Dependence of Sensitivities on Diaphragm Dimensions

2019 ◽  
Vol 29 (07) ◽  
pp. 2050107
Author(s):  
Sumit Kumar Jindal ◽  
Srishti Priya ◽  
S. Kshipra Prasadh
Keyword(s):  
Large Scale ◽  
Electrical Signal ◽  
Design Guidelines ◽  
Capacitive Sensing ◽  
Optical Interferometer ◽  
Optical Mems ◽  
Micro Electro Mechanical Systems ◽  
Capacitive Accelerometer ◽  
Displacement Sensitivity ◽  
Sensing Characteristics

This work deals in specifying the design considerations while constructing a Micro Electro Mechanical Systems (MEMS) optical accelerometer working on capacitive sensing technique. Sensitivity is one of the most demanded characteristics of any sensor. The sensor considered is a MEMS capacitive accelerometer in which both displacement and capacitance are the primary sensing characteristics. This differential capacitive accelerometer causes change in displacement due to applied acceleration and further produces change in capacitance. So, the main focus in this work is to improve or select the suitable diaphragm dimensions of the differential capacitor in order to get optimal capacitive and displacement sensitivity. This is done for an Optical MEMS (MOEMS) based sensor where slight change has a large-scale impact. The electrical signal is converted to optical by adding an Optical Interferometer. Mach–Zehnder Interferometer (MZI) is used to carry out the intensity modulation which also gives protection in inflammable surroundings. This makes the system suitable for working in high temperature regions.

Evaluation and Design of Displacement-Amplifying Compliant Mechanisms for Sensor Applications

2008 ◽  
Vol 130 (10) ◽  
Author(s):  
Girish Krishnan ◽  
G. K. Ananthasuresh
Keyword(s):  
Elastic Body ◽  
Compliant Mechanisms ◽  
Force Sensor ◽  
Optimization Methods ◽  
Size Optimization ◽  
Mass Model ◽  
Sensor Applications ◽  
Capacitive Accelerometer ◽  
Points Of Interest ◽  
Primary Problem

Displacement-amplifying compliant mechanisms (DaCMs) reported in literature are widely used for actuator applications. This paper considers them for sensor applications that rely on displacement measurement, and proposes methods to evaluate and design such mechanisms. The motivation of this work is to increase the sensitivity of a micromachined capacitive accelerometer and a minute mechanical force sensor using DaCMs. A lumped spring-mass-lever (SML) model, which effectively captures the effects of appending a DaCM to a sensor, is introduced. This model is a generalization of the ubiquitously used spring-mass model for the case of an elastic body that has two points of interest—an input and an output. The SML model is shown to be useful in not only evaluating the suitability of an existing DaCM for a new application but also for designing a new DaCM. With the help of this model, we compare a number of DaCMs from literature and identify those that nearly meet the primary problem specifications. To obtain improved designs that also meet the secondary specifications, topology and size-optimization methods are used. For the two applications considered in this paper, we obtain a few new DaCM topologies, which are added to the catalog of DaCMs for future use. The spring-mass-lever model, the evaluation and design methods, and the catalog of DaCMs presented here are useful in other sensor and actuator applications.

Interface morphology of thermal oxide grown on polycrystalline silicon by different processes

1992 ◽  
Vol 50 (2) ◽  
pp. 1396-1397
Author(s):  
H. Yen ◽  
E. P. Kvam ◽  
R. Bashir ◽  
S. Venkatesan ◽  
G. W. Neudeck
Keyword(s):  
Integrated Circuits ◽  
Polycrystalline Silicon ◽  
Silicon Films ◽  
Interface Morphology ◽  
Oxide Interface ◽  
Poly Silicon ◽  
Thermal Oxide ◽  
Grain Orientations ◽  
Polycrystalline Silicon Films ◽  
P Type

Polycrystalline silicon, when highly doped, is commonly used in microelectronics applications such as gates and interconnects. The packing density of integrated circuits can be enhanced by fabricating multilevel polycrystalline silicon films separated by insulating SiO2 layers. It has been found that device performance and electrical properties are strongly affected by the interface morphology between polycrystalline silicon and SiO2. As a thermal oxide layer is grown, the poly silicon is consumed, and there is a volume expansion of the oxide relative to the atomic silicon. Roughness at the poly silicon/thermal oxide interface can be severely deleterious due to stresses induced by the volume change during oxidation. Further, grain orientations and grain boundaries may alter oxidation kinetics, which will also affect roughness, and thus stress.Three groups of polycrystalline silicon films were deposited by LPCVD after growing thermal oxide on p-type wafers. The films were doped with phosphorus or arsenic by three different methods.

Inducing Frictional Force to Enhance the Transient Response in Beams

2019 ◽  
Vol 22 (2) ◽  
pp. 88-93
Author(s):  
Hamed Khanger Mina ◽  
Waleed K. Al-Ashtrai
Keyword(s):  
Numerical Analysis ◽  
Transient Response ◽  
Frictional Force ◽  
Damping Ratio ◽  
Experimental Results ◽  
Damping Capacity ◽  
Tightening Force ◽  
Contact Areas ◽  
Good Agreement ◽  
Ansys Workbench

This paper studies the effect of contact areas on the transient response of mechanical structures. Precisely, it investigates replacing the ordinary beam of a structure by two beams of half the thickness, which are joined by bolts. The response of these beams is controlled by adjusting the tightening of the connecting bolts and hence changing the magnitude of the induced frictional force between the two beams which affect the beams damping capacity. A cantilever of two beams joined together by bolts has been investigated numerically and experimentally. The numerical analysis was performed using ANSYS-Workbench version 17.2. A good agreement between the numerical and experimental results has been obtained. In general, results showed that the two beams vibrate independently when the bolts were loosed and the structure stiffness is about 20 N/m and the damping ratio is about 0.008. With increasing the bolts tightening, the stiffness and the damping ratio of the structure were also increased till they reach their maximum values when the tightening force equals to 8330 N, where the structure now has stiffness equals to 88 N/m and the damping ratio is about 0.062. Beyond this force value, increasing the bolts tightening has no effect on stiffness of the structure while the damping ratio is decreased until it returned to 0.008 when the bolts tightening becomes immense and the beams behave as one beam of double thickness.

Dynamic Behavior Analysis of the Slider Crank Linkage using ANSYS Workbench and MATLAB Program

2013 ◽  
Vol 1 (1) ◽  
pp. 42-25
Author(s):  
Nabil N. Swadi
Keyword(s):  
Graphical Method ◽  
Joint Torque ◽  
Pressure Force ◽  
Matlab Program ◽  
Element Simulation ◽  
Acceleration Method ◽  
Complete Revolution ◽  
Two Phases ◽  
Good Agreement ◽  
Ansys Workbench

This paper is concerned with the study of the kinematic and kinetic analysis of a slider crank linkage using D'Alembert's principle. The links of the considered mechanism are assumed to be rigid. The analytical solution to observe the motion (displacement, velocity, and acceleration), reactions at each joint, torque required to drive the mechanism and the shaking force have been computed by a computer program written in MATLAB language over one complete revolution of the crank shaft. The results are compared with a finite element simulation carried out by using ANSYS Workbench software and are found to be in good agreement. A graphical method (relative velocity and acceleration method) has been also applied for two phases of the crank shaft (q2 = 10° and 130°). The results obtained from this method (graphical) are compared with those obtained from analytical and numerical method and are found very acceptable. To make the analysis linear the friction force on the joints and sliding interface are neglected. All results, in this work, are obtained when the crank shaft turns at a uniform angular velocity (w2 = 188.5 rad/s) and time dependent gas pressure force on the slider crown.

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