Low-Rate Sputter-Deposited Fe3Si Thin Films on Si Substrates: Structural and Ferromagnetic Properties

2011 ◽  
Vol 11 (3) ◽  
pp. 2687-2690
Author(s):  
S. L. Liew ◽  
D. H. L. Seng ◽  
H. R. Tan ◽  
D. Z. Chi
2009 ◽  
Vol 1183 ◽  
Author(s):  
Siao Li LIEW ◽  
Debbie Hwee Leng SENG ◽  
Hui Ru TAN ◽  
Dongzhi CHI

AbstractFe3Si thin films were deposited on Si(001) from magnetron sputtering with varying deposition rates and subjected to post-deposition anneal (PDA). Structural investigations via XRD, SIMS and cross-sectional TEM reveal that high rate-deposited Fe3Si is amorphous while low rate-deposited Fe3Si is poly-crystalline with significant differences observed at the Fe3Si/Si interfaces. The structural differences were attributed to the influence of deposition rate on the grain nucleation and microstructural morphology in the as-deposited Fe3Si and the subsequent annealed films which in turn determine the ferromagnetic properties. Magnetic properties of Fe3Si deposited at high rate degrade with PDA - coercive field Hc increases from 1 to 14 Oe while saturation magnetization Ms decreases from ˜940 to 590 emu/cm3. In contrast, Fe3Si film sputter-deposited at low rate has a Hc of 5 Oe, Ms of ˜920 emu/cm3 and remnant magnetization Mr ˜0.9Ms that are maintained even upon PDA at 350 oC.


1998 ◽  
Vol 541 ◽  
Author(s):  
S. Tirumala ◽  
S. O. Ryu ◽  
K. B. Lee ◽  
R. Vedula ◽  
S. B. Desu

AbstractThe effect of various electrode materials on the ferroelectric properties of SrBi2Ta2O9 (SBT) thin films has been investigated for non-volatile memory applications. Two sets of electrode structures, viz., Pt-Ir based and Pt-Rh based, were sputter deposited in-situ on Si substrates. SBT thin films were deposited on these electrodes using a metal-organic solution deposition technique followed by a post-deposition anneal at 750 °C in oxygen. Structural characterization revealed a polycrystalline nature with predominant perovskite phase in SBT thin films. Ferroelectric properties were studied in capacitor mode by depositing top electrodes, where the top electrode material is identical to that of the bottom electrode. Extensive analysis of the ferroelectric properties signify the important role played by the electrode material in establishing the device applicability is reported in this work.


1996 ◽  
Vol 433 ◽  
Author(s):  
T. B. Wu ◽  
J. M. Wu ◽  
C. M. Wu ◽  
M. J. Shyu ◽  
M. S. Chen ◽  
...  

AbstractHighly (100)-textured thin film of metallic LaNiO3 (LNO) was grown on the Pt/Ti/SiO2/Si substrates by rf magnetron sputtering at ˜300°C, which was used as a bottom electrode to prepare highly (100)-textured ferroelectric films. Examples on the deposition of PbTiO3, (Pbl−xLax)TiO3, Pb(Zr0.53Ti0.47)O3, Pb[(Mg1/3Nb2/3)1−xTix]O3, and (Ba1−xSrx)TiO3 thin films by rf magnetron sputtering or sol-gel method are shown. A reduction of temperature for perovskite phase formation can be achieved, especially for those difficult to crystallize. The surface roughness of the ferroelectric films is also improved as compared to that of films deposited on conventional Pt electrode. Although the electrical properties of the ferroelectric films are affected by the out-diffusion of LNO when a higher temperature was used in the preparation of the films, under an appropriate processing condition, the highly (100)-textured films can have satisfactory electrical characteristics for application. Moreover, the polarization-fatigue property can be also improved by the use of LNO electrode.


1996 ◽  
Vol 441 ◽  
Author(s):  
Dong-Yeon Park ◽  
Dong-Su Lee ◽  
Min Hong Kim ◽  
Tae-Soon Park ◽  
Hyun-Jung Woo ◽  
...  

AbstractPlatinum(Pt) films were sputter-deposited on Si02/Si substrates under the mixed gas atmosphere of Ar and O2. Under certain deposition conditions, the films were oriented such that the (100) direction is normal to the substrate surface. The formation of the (100) texture was affected by the gas pressure and film thickness. After annealing at 650 °C for 1 hour, (100) oriented Pt films with the resistivity of pure Pt were obtained. The annealed Pt films all passed a tape adhesion test and had no defects such as hillocks or pinholes. The experimental results from this work are presented.


1994 ◽  
Vol 339 ◽  
Author(s):  
K. G. Kreider ◽  
D. R. F. Burgess ◽  
M. J. Tarlov ◽  
G. Gillen ◽  
S. Wight ◽  
...  

ABSTRACTSilicon carbide has excellent physical and electronic properties for use in devices when higher temperatures or higher power densities are required. We have investigated a direct laser conversion technique to create electrical conductors on the high band-gap silicon carbide. Thin films of silicon carbide (SiC) were sputter deposited on AI2O3, SiO2, and Si substrates using a SiC target with an RF planar magnetron. These films were irradiated at 308 nm with multiple 15 ns excimer laser pulses creating 0.5 to 2 mm wide electrically conducting paths. Both the irradiated and unirradiated films were evaluated as a function of substrate type, deposition temperature, finish, stoichiomelry, annealing temperature, sputter gas, film thickness, and laser processing conditions. The lowest resistivity films, originally 10 ohm-m, were calculated to be 160 μohm-m obtained after irradiation, which compares to a value of 50 μohm-m obtained after irradiating bulk SiC. The films were characterized using XPS, SIMS, AES, SEM, and Raman spectroscopy. We were able to characterize the composition of the films and conducting traces, the surface oxide, the critical binding energies, the lattice structure, and the morphology of the microstructure. Models for the phase transformations and conductivity have been formulated.


2008 ◽  
Vol 59 ◽  
pp. 190-197 ◽  
Author(s):  
Eckhard Quandt ◽  
C. Zamponi

Shape memory alloys are able to provide high work output when due to the martensitic transformation. Therefore, they are a promising candidate for actuation mechanisms in microsystems, e.g. in microvalves. Sputter deposited SMA thin films are already in use as free-standing films or as composites. Since it is also possible to deposit and structure the SMA composites on Si substrates by photolithographic techniques, the fabrication process is compatible to MEMS and therefore most favorable for an number of applications. Superelastic shape memory materials are of special interest in medical applications due to the large strains at constant stress and their biocompatibility. Superelastic NiTi thin films have been fabricated by magnetron sputtering using cast melted targets. Special heat treatment was performed to adjust superelastic properties and transformation temperatures. A superelastic strain of up to 6.5% at 37°C was obtained. Although NiTi shows an excellent biocompatibility enhanced antibacterial properties would significantly broaden its application range. Coatings containing Ag have already been used for this application. In order to apply this approach to TiNi-based alloys thin films of different TiNiAg compositions have been prepared by sputtering.


1987 ◽  
Vol 108 ◽  
Author(s):  
S. N. Farrens ◽  
J. H. Perepezko ◽  
B. L. Doyle ◽  
S. R. Lee

ABSTRACTThe interdiffusion and crystallization reactions between amorphous Ni-Nb alloy films and Si substrates and several overlayer metals have been monitored by x-ray diffraction and high resolution Rutherford backscattering spectroscopy. Free standing amorphous thin films of Ni-Nb alloys crystallize in one hour at temperatures between 600–625 °C and show little dependence of the crystallization temperature, Tx, on composition over the range from 30–80 at.% Ni. However, in films that are sputter deposited onto Si substrates Tx tends to increase with increasing Nb composition. Ni60Nb40 samples without overlayers crystallize at 650–700 °C. Enhancement of the thermal stability to 700–750 °C is achieved with a Nb overlayer. In contrast, a Ni overlayer can reduce Tx to 450 °C. At the film/substrate interface silicide formation reactions with Ni from the film contribute to a destabilization of the amorphous alloy. The modification of Tx with Ni, Nb, and other overlayers appears to be related to changes in the reaction kinetics associated with penetration of the overlayer into the film.


1991 ◽  
Vol 230 ◽  
Author(s):  
John E. Sanchez ◽  
L. T. McKnelly ◽  
J. W. Morris

AbstractΘ phase CuAl2 precipitate size evolution during coarsening at 310°C in 0.5 μm thick Al-2% (wt) Cu thin films was characterized by transmission electron microscopy. Films were sputter deposited onto oxidized Si substrates by standard techniques. The coarsening process preferred the growth of blocky Θ morphologies at Al triple points. Coarsening was via solute Cu diffusion along Al grain boundaries during annealing. The average Θ size dependence on annealing time (t) is approximately (t)1/4 in general agreement with models for particle coarsening along grain boundaries. Concurrent Al grain growth was shown to initially enhance the Θ coarsening rate above (t)1/4 behavior. This boundary coarsening process leads to a grain size dependence of the coarsening rate which has been observed in related and other previous work in thin films. These results are shown to be relevant for effects produced during accelerated electromigration testing, such as previous ‘curious’ 0 morphologies at triple points observed by others, the enhanced flux of Cu during testing, and possible mechanisms affecting electromigration failure processes.


2003 ◽  
Vol 82 (3) ◽  
pp. 984-990 ◽  
Author(s):  
Hsin-Yi Lee ◽  
Yung-Wei Hsieh ◽  
C.-H. Hsu ◽  
K.S. Liang

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