Triple functions of polyaniline in situ coated on silver powders for high-performance electrically conductive pastes

2021 ◽  
Vol 11 (7) ◽  
pp. 1231-1238
Author(s):  
Maocheng Zhang ◽  
Mengqi Yao ◽  
Ni Wang ◽  
Wencheng Hu
Keyword(s):  
Electrical Resistivity ◽  
High Performance ◽  
Chemical Reduction ◽  
Conductive Adhesive ◽  
Silane Coupling Agents ◽  
Conductive Adhesives ◽  
Electrically Conductive ◽  
Conductive Fillers ◽  
Preparation Strategy

Silver powders, with high electrical conductivity, as the conductive fillers of electrically conductive adhesives have been widely investigated in the fields of microelectronic packaging. Herein, polyaniline (PANI)-coated silver powders were successfully fabricated via a facile chemical reduction, followed by the polymerization of aniline. The PANI plays triple functions to synergistically improve the performance of electrically conductive pastes as follows: (1) The aniline-coated silver particles are used as an ideal dispersant to substitute polyvinyl pyrrolidone and polyethylene glycol in the preparation strategy of silver powders; (2) The polymerization of aniline plays a surface modifier role instead of silane coupling agents to prepare silver-based conductive adhesives with homodisperse silver powders; (3) The high conductivity of PANI could reduce the contact resistance between silver powders and decrease the electrical resistivity of conductive adhesive films significantly. As a result, the PANI coats silver powders (pH = 3) show a decreased electrical resistivity of conductive adhesive films of 4.24×10−5 Ω·cm with the shear resistance of 9.06 MPa and the sheet resistance of 10.6 mΩ.sq−1. This work provides an efficient way to controllably synthesize PANI-coated silver powders for high-performance electrically conductive pastes.

scholarly journals Multifunctional Electrically Conductive Copper Electroplated Fabrics Sensitizes by In-Situ Deposition of Copper and Silver Nanoparticles

Nanomaterials ◽  
2021 ◽  
Vol 11 (11) ◽  
pp. 3097
Author(s):  
Azam Ali ◽  
Fiaz Hussain ◽  
Ambreen Kalsoom ◽  
Tauqeer Riaz ◽  
Muhammad Zaman Khan ◽  
...  
Keyword(s):  
Electrical Resistivity ◽  
Ohmic Heating ◽  
Chemical Reduction ◽  
Metal Coating ◽  
Sem Images ◽  
Electrically Conductive ◽  
In Situ Deposition ◽  
Coated Fabric ◽  
Textile Sensors

In this study, we developed multifunctional and durable textile sensors. The fabrics were coated with metal in two steps. At first, pretreatment of fabric was performed, and then copper and silver particles were coated by the chemical reduction method. Hence, the absorbance/adherence of metal was confirmed by the deposition of particles on microfibers. The particles filled the micro spaces between the fibers and made the continuous network to facilitate the electrical conduction. Secondly, further electroplating of the metal was performed to make the compact layer on the particle- coated fabric. The fabrics were analyzed against electrical resistivity and electromagnetic shielding over the frequency range of 200 MHz to 1500 MHz. The presence of metal coating was confirmed from the surface microstructure of coated fabric samples examined by scanning electron microscopy, EDS, and XRD tests. For optimized plating parameters, the minimum surface resistivity of 67 Ω, EMI shielding of 66 dB and Ohmic heating of 118 °C at 10 V was observed. It was found that EMI SH was increased with an increase in the deposition rate of the metal. Furthermore, towards the end, the durability of conductive textiles was observed against severe washing. It was observed that even after severe washing there was an insignificant increase in electrical resistivity and good retention of the metal coating, as was also proven with SEM images.

scholarly journals Preparation of Silver Nanopowders and Its Application in Low Temperature Electrically Conductive Adhesive

2021 ◽  
Author(s):  
Xiao Min Zhang ◽  
Xiao-Li Yang ◽  
Bin Wang
Keyword(s):  
Electrical Conductivity ◽  
Low Temperature ◽  
High Performance ◽  
Electronic Device ◽  
Conductive Adhesive ◽  
High Electrical Conductivity ◽  
Electrically Conductive ◽  
Electrically Conductive Adhesive ◽  
Conductive Fillers ◽  
Dc Arc

Abstract Printable electrically conductive adhesive with high electrical conductivity and good mechanical properties has wide application prospect in electronic device. In order to explore new conductive fillers of interconnecting materials in electronic circuit and electronic packaging industries, silver nanopowders were prepared by DC arc plasma method with high pure. The silver nanopowders present a spherical structure, the particle’s diameter range from 15 to 220 nm. In this paper, a high performance electrically conductive adhesive (ECA) was prepared. This ECA was fabricated by mixing silver nanopowders with epoxy resin and was screen-printed to a required shape. It was found that the ECA can be solidified through a low temperature sintering method in the air at 150 ℃ for 10 min. The electrical and mechanical of above ECA were investigated and characterized. The ECA filled with 75% silver nanopowders exhibits excellent performances, including high electrical conductivity (9.5×10-4 Ω·cm), high bonding strength ( 8.3 MPa). Based on the performance characteristics, the ECA applications in flexible printed electrodes and interconnecting materials are demonstrated.

Spark Plasma Sintering of Silicon Nitride-Boron Carbide Composites

2008 ◽  
Vol 403 ◽  
pp. 225-226
Author(s):  
E. Ayas ◽  
A. Kalemtas ◽  
Gürsoy Arslan ◽  
Alpagut Kara ◽  
Ferhat Kara
Keyword(s):  
Electrical Resistivity ◽  
Spark Plasma Sintering ◽  
Xrd Analysis ◽  
Sintering Process ◽  
Electrically Conductive ◽  
Plasma Sintering ◽  
B4c Particles ◽  
Spark Plasma ◽  
In Situ Reactions

Si3N4-B4C composites containing fine and coarse B4C particles were produced using Al2O3 and Y2O3 as sintering additives via spark plasma sintering (SPS) technique. Phase assemblages of the produced composites were determined by XRD analysis. Si3N4, B4C and in situ formed SiC, h-BN and Si phases were observed. Even when incorporated in significant amounts, B4C was consumed readily in the Si3N4 based system. Consequently, full densification of these composites was found to be a very difficult task due to the simultaneous in-situ reactions, even in fast sintering process. Electrical resistivity measurements carried out at room temperature indicated that addition of both fine and coarse B4C particles decreased the electrical resistivity by several orders of magnitude due to the formation of electrically conductive in-situ phases, mainly SiC and metallic Si.

scholarly journals Synthesis of polypyrrole nanoparticles and their applications in electrically conductive adhesives for improving conductivity

RSC Advances ◽  
2017 ◽  
Vol 7 (84) ◽  
pp. 53219-53225 ◽  
Author(s):  
Jiayue Wen ◽  
Yanhong Tian ◽  
Zhipeng Mei ◽  
Weizhen Wu ◽  
Yanqing Tian
Keyword(s):  
Electrical Resistivity ◽  
Conductive Adhesives ◽  
Electrically Conductive ◽  
Electrically Conductive Adhesives ◽  
Polypyrrole Nanoparticles

An innovative application of doping conjugated-polypyrrole nanoparticles (PPy NPs) into electrical conductive adhesives (ECAs) to prepare low electrical resistivity interconnecting materials.

scholarly journals Effects of Silver Coating Covered with Copper Filler on Electrical Resistivity of Electrically Conductive Adhesives

2010 ◽  
Vol 51 (10) ◽  
pp. 1785-1789 ◽  
Author(s):  
Hiroshi Nishikawa ◽  
Saya Mikami ◽  
Koichi Miyake ◽  
Akira Aoki ◽  
Tadashi Takemoto
Keyword(s):  
Electrical Resistivity ◽  
Silver Coating ◽  
Conductive Adhesives ◽  
Electrically Conductive ◽  
Electrically Conductive Adhesives

Nano-scale Conductive Films for High Performance Fine Pitch Interconnect

2007 ◽  
Vol 990 ◽  
Author(s):  
Yi Li ◽  
Myung Jin Yim ◽  
Kyung Sik Moon ◽  
ChingPing Wong
Keyword(s):  
High Performance ◽  
Electrical Conductance ◽  
Conductive Adhesives ◽  
Bonding Pressure ◽  
Nano Scale ◽  
Fine Pitch ◽  
Conductive Film ◽  
Joint Resistance ◽  
Conductive Fillers ◽  
Free Solder

ABSTRACTIn this paper, a novel nano-scale conductive film which combines the advantages of both traditional anisotropic conductive adhesives/films (ACAs/ACFs) and nonconductive adhesives/films (NCAs/NCFs) is introduced and developed for next generation high performance ultra-fine pitch packaging applications. This novel interconnect film possesses the properties of electrical conduction along the z-direction with relatively low bonding pressure (ACF-like) and the ultra-fine pitch (< 100 nm) capability (NCF-like). Unlike typical ACF which requires 1–5 vol% of conductive fillers, the novel nano-scale conductive film only needs less than 0.1 vol% conductive fillers to achieve good electrical conductance in the z direction. The nano-scale conductive film also allows a lower bonding pressure than NCF to achieve a much lower joint resistance (over two orders of magnitude lower than typical ACF joints) and higher current carrying capability. With low temperature sintering of nano-silver fillers, the joint resistance of the nano-scale conductive film could be as low as 10−5 Ohm, even lower than the NCF and lead-free solder joints. The reliability of the nano-scale conductive film after high temperature and humidity test (85°C/85%RH) was also improved compared to the NCF joints. As such, a high performance, fine pitch conductive film was developed.

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