Conceptual Design of a Dual Latent Heat Sink for Thermal Management of Pulse Heat Generating Electronic Systems

2007 ◽  
Author(s):  
Krishna Kota ◽  
Louis Chow ◽  
Jianhua Du ◽  
Jayanta Kapat ◽  
Quinn Leland ◽  
...  
Keyword(s):  
Thermal Management ◽  
Latent Heat ◽  
Conceptual Design ◽  
Heat Sink ◽  
Electronic Systems ◽  
Pulse Heat

Design of a Dual Latent Heat Sink for Pulsed Electronic Systems

2008 ◽  
Vol 22 (4) ◽  
pp. 572-580 ◽  
Author(s):  
Krishna M. Kota ◽  
Louis C. Chow ◽  
Jianhua Du ◽  
Jayanta S. Kapat ◽  
Quinn Leland ◽  
...  
Keyword(s):  
Latent Heat ◽  
Heat Sink ◽  
Electronic Systems

scholarly journals Liquid metal heat sink for laptop computers

2017 ◽  
Author(s):  
◽  
Chengyi Gu
Keyword(s):  
Liquid Metal ◽  
Thermal Management ◽  
Heat Generation ◽  
Heat Sink ◽  
Electronic Systems ◽  
Pump Efficiency ◽  
Liquid Cooling ◽  
Laptop Computer ◽  
Conventional Cooling ◽  
Cooling Loop

With the rapid miniaturization of the electronic systems, heat generation in the components becomes a major concern for thermal management. The high density of heat generation can be a bottleneck to attain higher performance and reliability of computers. Because conventional cooling methods such as finned heat sink are often incapable of providing adequate cooling for sophisticated electronic systems, new systems like heat pipes or liquid cooling systems are being studied. This work focused on the novel design of a liquid metal and heat sink cooling loop targeted for laptop computer thermal management. The liquid metal was driven by an electromechanical pump, offering no moving parts and quiet operation. To better understand the design process, theoretical analysis for fluid flow and heat transfer performance of liquid metal and heat sink are conducted. Furthermore, in order to demonstrate the feasibility of this new concept, a series of experiments on the fabricated module under different heater powers and pump power are performed. A thermal resistance value of 0.53 ?/W was experimentally determined, making the performance similar to competing technologies. Performance was impeded by a low pump efficiency, a known impediment with electromagnetic pumps.

Mathematical and simulation analysis of natural convection heat transfer for DC–DC converter

2020 ◽  
Vol 234 (20) ◽  
pp. 4136-4146
Author(s):  
Vipan Kumar ◽  
Harry Garg ◽  
Chetandeep Singh ◽  
Sucheta Kandoria ◽  
Vinod Karar
Keyword(s):  
Thermal Management ◽  
Heat Sink ◽  
Heat Dissipation ◽  
Simulation Analysis ◽  
Convection Heat Transfer ◽  
Maximum Temperature ◽  
Electronic Systems ◽  
Optimal Functioning ◽  
Converter Heat ◽  
Safe Operating

Thermal management of electronic systems is the utmost concern to achieve optimum efficiency under space and weight constraints. For the optimal functioning of a system, the heat generated by the electronic components needs to be dissipated efficiently. The passive cooling technique is extensively used in electronic systems, wherein the more contact surface area of a heat source and the surroundings are utilized. This paper focuses on mathematical and simulation analysis for different types of heat sink designs for the 30 W multi-output DC–DC converter. Heat sink with inverted trapezoidal fins has resulted in efficient thermal management of the converter at its safe operating temperature of 398 K. Results show that the maximum temperature attained by the converter was 352 K which was in the safe operating zone of the converter. A comparative study of the effectiveness of heat dissipation with respect to maximum temperature attained has been discussed. Mathematical verification of Rayleigh number for different heat sink designs has also been carried out for its critical value.

scholarly journals Characterization of a Condenser for a High Performance Multi-Condenser Loop Heat Pipe

2011 ◽  
Author(s):  
Daniel F. Hanks ◽  
Teresa B. Peters ◽  
John G. Brisson ◽  
Evelyn N. Wang
Keyword(s):  
Heat Pipe ◽  
Thermal Management ◽  
Heat Sink ◽  
High Performance ◽  
Electronic Systems ◽  
Loop Heat Pipe ◽  
Particle Sizes ◽  
Vapor Interface ◽  
Liquid Vapor

We experimentally characterized a condenser design for a multi-condenser loop heat pipe (LHP) capable of dissipating 1000 W. The LHP is designed for integration into a high performance air-cooled heat sink to address thermal management challenges in advanced electronic systems. The multi-layer stack of condensers utilizes a sintered wick design to stabilize the liquid-vapor interface and prevent liquid flooding of the lower condenser layers in the presence of a gravitational head. In addition a liquid subcooler is incorporated to suppress vapor flashing in the liquid return line. We fabricated the condensers using photo-chemically etched Monel frames with Monel sintered wicks with particle sizes up to 44 μm. We characterized the performance of the condensers in a custom experimental flow rig that monitors the pressure and temperatures of the vapor and liquid. The condenser dissipated the required heat load with a subcooling of up to 18°C, while maintaining a stable liquid-vapor interface with a capillary pressure of 6.2 kPa. In the future, we will incorporate the condenser into a loop heat pipe for a high performance air-cooled heat sink.

Thermal management of power electronics with liquid cooled metal foam heat sink

2021 ◽  
Vol 163 ◽  
pp. 106796
Author(s):  
Yongtong Li ◽  
Liang Gong ◽  
Bin Ding ◽  
Minghai Xu ◽  
Yogendra Joshi
Keyword(s):  
Power Electronics ◽  
Thermal Management ◽  
Heat Sink ◽  
Metal Foam

scholarly journals Capillary-Limited Evaporation From Well-Defined Microstructured Surfaces

2013 ◽  
Author(s):  
Solomon Adera ◽  
Rishi Raj ◽  
Evelyn N. Wang
Keyword(s):  
Thin Film ◽  
Heat Transfer ◽  
Heat Flux ◽  
Phase Change ◽  
Thermal Management ◽  
Latent Heat ◽  
Thin Film Evaporation ◽  
Film Evaporation ◽  
Microstructured Surfaces ◽  
Latent Heat Of Vaporization

Thermal management is increasingly becoming a bottleneck for a variety of high power density applications such as integrated circuits, solar cells, microprocessors, and energy conversion devices. The performance and reliability of these devices are usually limited by the rate at which heat can be removed from the device footprint, which averages well above 100 W/cm2 (locally this heat flux can exceed 1000 W/cm2). State-of-the-art air cooling strategies which utilize the sensible heat are insufficient at these large heat fluxes. As a result, novel thermal management solutions such as via thin-film evaporation that utilize the latent heat of vaporization of a fluid are needed. The high latent heat of vaporization associated with typical liquid-vapor phase change phenomena allows significant heat transfer with small temperature rise. In this work, we demonstrate a promising thermal management approach where square arrays of cylindrical micropillar arrays are used for thin-film evaporation. The microstructures control the liquid film thickness and the associated thermal resistance in addition to maintaining a continuous liquid supply via the capillary pumping mechanism. When the capillary-induced liquid supply mechanism cannot deliver sufficient liquid for phase change heat transfer, the critical heat flux is reached and dryout occurs. This capillary limitation on thin-film evaporation was experimentally investigated by fabricating well-defined silicon micropillar arrays using standard contact photolithography and deep reactive ion etching. A thin film resistive heater and thermal sensors were integrated on the back side of the test sample using e-beam evaporation and acetone lift-off. The experiments were carried out in a controlled environmental chamber maintained at the water saturation pressure of ≈3.5 kPa and ≈25 °C. We demonstrated significantly higher heat dissipation capability in excess of 100 W/cm2. These preliminary results suggest the potential of thin-film evaporation from microstructured surfaces for advanced thermal management applications.

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