scholarly journals Increasing Efficiency of a Finned Heat Sink Using Orthogonal Analysis

Energies ◽  
2021 ◽  
Vol 14 (3) ◽  
pp. 782
Author(s):  
Bin Li ◽  
Zheng Cui ◽  
Qun Cao ◽  
Wei Shao
Keyword(s):  
Heat Sink ◽  
Heat Dissipation ◽  
Structural Parameters ◽  
Simulation Method ◽  
Optimal Structure ◽  
Maximum Temperature ◽  
Air Cooling ◽  
Substrate Thickness ◽  
Orthogonal Analysis ◽  
Cooling Technique

As the heat flux of electronic components is increasing rapidly, the traditional air-cooling technique is gradually not meeting the requirements of thermal management. The immersion liquid-cooling technique shows great potential, and has attracted increasing attention due to its excellent performance in recent years. The finned heat sink is common and essential for cooling electric components. To analyze the influences of its structural parameters on heat dissipation and improve its efficiency while using a dielectric coolant, this study used the orthogonal analysis method to obtain the optimal structure via the numerical simulation method. The maximum temperature of the heat sink was selected as the evaluation criteria. The results showed that the parameters that affect the maximum temperature, in order of importance, are fin thickness, the number of fins, the height of the fins, and substrate thickness. Finally, taking the maximum temperature and mass as indexes obtained the optimal structure of the heat sink. The mass was reduced by 19%, while the temperature only increased by 4.5% when considering the mass index.

scholarly journals Simulation of heat dissipation model of lithium-ion battery pack

2021 ◽  
Vol 300 ◽  
pp. 01014
Author(s):  
Maode Li ◽  
Chuan He ◽  
Jinkui Zheng
Keyword(s):  
Phase Change ◽  
Temperature Rise ◽  
Heat Dissipation ◽  
Lithium Ion ◽  
Maximum Temperature ◽  
Air Cooling ◽  
Power Battery ◽  
Staggered Arrangement ◽  
Dissipation Model ◽  
Cooling Methods

Lithium-ion power battery has become an important part of power battery. According to the performance and characteristics of lithiumion power battery, the influence of current common charge and discharge and different cooling methods on battery performance was analysed in this paper. According to the software simulation, in the 5C charge-discharge cycle, the maximum temperature of the cells with regular arrangement is 57.97°C, the maximum temperature of the cells with staggered arrangement is 55.83°C, and the maximum temperature of phase change cooling is 47.42°C. The most important thing is that the temperature difference between the cells with phase change cooling is only 5.5°C. Some simulation results of air cooling and phase change show that phase change cooling can control the heat dissipation and temperature rise of power battery well. The research in this paper can provide better theoretical guidance for the temperature rise, heat transfer and thermal management of automotive power battery.

The Optimal Structural Parameters of Embedded High-Power Microwave Components Based on RSM-GA

2011 ◽  
Vol 199-200 ◽  
pp. 1537-1540
Author(s):  
Pin Chen ◽  
Zhao Hua Wu ◽  
Sheng Zhang ◽  
Tang Wen Bi ◽  
Qing Song Xiong
Keyword(s):  
Thermal Resistance ◽  
Parameter Optimization ◽  
High Power ◽  
Simulation Analysis ◽  
Structural Parameters ◽  
Thermal Design ◽  
Maximum Temperature ◽  
Structural Parameter ◽  
Substrate Thickness ◽  
Microwave Components

In the thermal design of embedded high-power chips microwave modules, structural parameter is one of the main reasons affect the thermal resistance, thus influences the reliability of the modules, the structural parameter optimized of the microwave components was studied in this paper. The goal of this work is to decrease the temperature and achieves the best structural dimensions. Using the ANSYS software build the EPCM module, through simulation analysis, Linear regression equation be fitted by RSM, which concerning the module maximum temperature with board area, substrate thickness, molybdenum thickness and encapsulation thickness. Based on genetic algorithms, structural parameter optimization algorithm of thermal model was proposed and the optimization structural parameter of embedded high-power chips microwave modules was achieved by corresponding optimization program. Based on ANSYS work, before optimization the model of maximum temperature is 86.717°C, the maximum temperature module of the optimization structural parameter is lower 1.28°C than before, so the thermal resistance decreased. The result show that the maximum temperature module of the optimization structural parameter is in good accord with the FEA results. It turns out that the RSM –GA approach proposed in this work can be effective and robust in providing structural parameter optimization in EPCM.

Mathematical and simulation analysis of natural convection heat transfer for DC–DC converter

2020 ◽  
Vol 234 (20) ◽  
pp. 4136-4146
Author(s):  
Vipan Kumar ◽  
Harry Garg ◽  
Chetandeep Singh ◽  
Sucheta Kandoria ◽  
Vinod Karar
Keyword(s):  
Thermal Management ◽  
Heat Sink ◽  
Heat Dissipation ◽  
Simulation Analysis ◽  
Convection Heat Transfer ◽  
Maximum Temperature ◽  
Electronic Systems ◽  
Optimal Functioning ◽  
Converter Heat ◽  
Safe Operating

Thermal management of electronic systems is the utmost concern to achieve optimum efficiency under space and weight constraints. For the optimal functioning of a system, the heat generated by the electronic components needs to be dissipated efficiently. The passive cooling technique is extensively used in electronic systems, wherein the more contact surface area of a heat source and the surroundings are utilized. This paper focuses on mathematical and simulation analysis for different types of heat sink designs for the 30 W multi-output DC–DC converter. Heat sink with inverted trapezoidal fins has resulted in efficient thermal management of the converter at its safe operating temperature of 398 K. Results show that the maximum temperature attained by the converter was 352 K which was in the safe operating zone of the converter. A comparative study of the effectiveness of heat dissipation with respect to maximum temperature attained has been discussed. Mathematical verification of Rayleigh number for different heat sink designs has also been carried out for its critical value.

scholarly journals Deferred Cooling System for Desert Climates

2020 ◽  
Vol 12 (2) ◽  
pp. 168781401988805
Author(s):  
MF El Bedaiwy ◽  
MS El Morsi ◽  
MA Serag-Eldin
Keyword(s):  
Heat Dissipation ◽  
Cooling System ◽  
Temperature Drop ◽  
Weather Data ◽  
Maximum Temperature ◽  
Air Cooling ◽  
Ambient Conditions ◽  
Thermodynamic Cycles ◽  
Radiation Exchange ◽  
Equipment Sizing

The paper presents the design of a novel heat rejection system suitable for desert climates where daytime temperatures are typically high, nighttime cooling through sky radiation exchange is highly effective, and freshwater is scarce. Desert climates also feature high solar energy intensities during daytime, which can be exploited to power thermodynamic cycles. However, such cycles reject heat during operation, and daytime temperatures are too high for employing air cooling whereas scarcity of freshwater limits the applicability of evaporative cooling. We propose a system that defers dissipation of heat rejected during daytime operation to nighttime when ambient conditions are much more favorable for heat dissipation to the atmosphere. The paper presents the proposed design, its method of operation, and its implementation in a solar-driven ice-making plant in Upper Egypt. A mathematical model was developed to predict system performance and support decision-making over equipment sizing. It was used to simulate the performance of the deferred cooling system over a week. Using weather data collected at New Cairo (30.02 °N latitude, 31.5 °E longitude) in April 2017, the model demonstrated that the system could achieve a maximum temperature drop of 16 °C, which corresponds to a cooling of 47 MJ/m2/night.

scholarly journals Optimization of Air Cooling System Using Adjoint Solver Technique

Energies ◽  
2021 ◽  
Vol 14 (13) ◽  
pp. 3753
Author(s):  
Grzegorz Czerwiński ◽  
Jerzy Wołoszyn
Keyword(s):  
Heat Source ◽  
Heat Sink ◽  
Cooling System ◽  
Geometric Model ◽  
Maximum Temperature ◽  
Air Cooling ◽  
Ansys Fluent ◽  
Source Temperature ◽  
Heat Source Temperature ◽  
Air Cooling System

Air cooling systems are currently the most popular and least expensive solutions to maintain a safe temperature in electronic devices. Heat sinks have been widely used in this area, allowing for an increase in the effective heat transfer surface area. The main objective of this study was to optimise the shape of the heat sink geometric model using the Adjoint Solver technique. The optimised shape in the context of minimal temperature value behind the heat sink is proposed. The effect of radiation and trapezoidal fin shape on the maximum temperature in the cooling system is also investigated. Simulation studies were performed in Ansys Fluent software using the Reynolds—averaged Navier–Stokes technique. As a result of the simulation, it turned out that not taking into account the radiation leads to an overestimation of temperatures in the system—even by 14 ∘C. It was found that as the angle and height of the fins increases, the temperature value behind the heat sink decreases and the heat source temperature increases. The best design in the context of minimal temperature value behind the heat sink from all analysed cases is obtained for heat sink with deformed fins according to iteration 14. The temperature reduction behind the heat sink by as much as 25 ∘C, with minor changes in heat source temperature, has been achieved.

scholarly journals The flow and heat performance of tree-like network heat sink with diverging–converging channel

2021 ◽  
Vol 236 ◽  
pp. 01027
Author(s):  
Xiugen Zhu ◽  
Peng Qian ◽  
Zizhen Huang ◽  
Chengyuan Luo ◽  
Minghou Liu
Keyword(s):  
Pressure Drop ◽  
Flow Rate ◽  
Heat Sink ◽  
Heat Dissipation ◽  
Maximum Temperature ◽  
Pumping Power ◽  
Flow Recirculation ◽  
Converging Channel ◽  
Converging Angle ◽  
Good Heat

A tree-like network heat sink with diverging–converging channel is designed, and effect of flow rate, channel diverging-converging angles on the flow and heat dissipation performance of the tree-like network heat sink is analysed and compared by numerical simulation. Results show that the diverging– converging angle of 2° can reduce the pressure drop by 14% when inlet mass flow rate is 0.00499kg/s. And the maximum temperature, the temperature difference between the maximum and minimum of the heat sink increases by 0.63K and 0.92K respectively. As the diverging-converging angle increases to 4°, however, it only reduces the pressure drop by 13% and can not bring more pressure drop due to formation of flow recirculation inside the tree-like network heat sink channel. Therefore, the diverging–converging fractal micro-channel heat sink with 2° has good heat dissipation performance with obvious lower pumping power.

Study on Process of Planing Forming of Plate Fin Heat Sinks

2006 ◽  
Vol 532-533 ◽  
pp. 237-240 ◽  
Author(s):  
Zhen Ping Wan ◽  
Yong Tang ◽  
Wen Jun Deng ◽  
Ya Jun Liu
Keyword(s):  
Boundary Layer ◽  
Rough Surface ◽  
Heat Sink ◽  
Thermal Boundary Layer ◽  
Heat Dissipation ◽  
Rake Angle ◽  
Heat Sinks ◽  
Air Cooling ◽  
Transition Area ◽  
On Chip

Primary heat dissipation method of IC Chip is still air-cooling at present. This paper presents a new machining method of air-cooled plate fin heat sinks, namely orthogonal planing. The surface of plate fins machined by this method are rough enough to augment its specific surface area; the rough surface can also disturb laminar sub-layer of turbulent thermal boundary layer, thus the thermal resistances of thermal boundary layer are reduced. Therefore, heat dissipation efficiency of heat sink can be enhanced further. The focus of plate fin heat sinks forming by orthogonal planing is how to machine flat chips. A new pattern of chip curl that is called down-curl can be observed when rake angle of tool is rather large and cutting thickness is very thin. As cutting thickness increases, down-curl chips become flat and then up-curling. There is a transition area that chips are not curled between down- and up-curl. The conditions that chips are not curled are obtained through investigating influences of rake angle and cutting thickness on chip curl, and flat plate fins with rough surface are produced.

Least-Volume Optimization of Finned Heat Sinks for Burn-in Air-Cooling Solutions

2003 ◽  
Author(s):  
Zhaojuan He ◽  
Patrick E. Phelan
Keyword(s):  
Heat Sink ◽  
Heat Dissipation ◽  
Past Research ◽  
Heat Sinks ◽  
Air Cooling ◽  
Electronic Packages ◽  
Pin Fin ◽  
Heat Spreaders ◽  
Forced Air ◽  
Innovative Techniques

With the development and increasing use of high-density components with their high power dissipation needs, electronic packages have required the investigation of innovative techniques for the efficient dissipation of heat. One prevalent method is the use of forced convection heat spreaders, called heat sinks, which are also widely used in Burn-In (BI) ovens. There are some contradictions remaining in recent research on modeling and Nusselt number correlations of heat sinks in forced air convection. This paper begins by reviewing past research for different finned heat sink geometries with and without bypass flow over the heat sinks. A new method called Least Volume Optimization is then proposed to analyze the thermal performance of finned heat sinks for BI air-cooling solutions. The analysis shows that the volumetric heat dissipation of a parallel plate fin heat sink is higher than that of a pin fin heat sink, based on an optimal fin geometry.

Design and Simulation of Locally Enhanced Microchannel Heat Sink for Diode Partially Pumped Slab Laser

2020 ◽  
Author(s):  
Zhanfeng Guo ◽  
Yunna Sun ◽  
Yan Wang ◽  
Guangyuan Wang ◽  
Xutong Song ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Heat Sink ◽  
Heat Dissipation ◽  
Power Level ◽  
Original System ◽  
Maximum Temperature ◽  
Microchannel Heat Sink ◽  
Heat Accumulation ◽  
Rectangular Microchannel ◽  
Multi Stage

With the power level of diode-pumped solid-state laser (DPSSL) rising continuously, its thermal effect has become the main problem limiting the laser performance. In this paper, based on the heat distribution of diode partially end-pumped slab(Innoslab) laser, a shunt rectangular microchannel heat sink with locally enhanced heat dissipation is designed. Firstly, multi-stage parallel short channels are designed in the heat concentration area to enhance the solid-liquid heat exchange in this area, and the effects of structure and working conditions on its heat dissipation performance are investigated. Secondly, the copper layer is introduced into the end face of the low thermal conductivity crystal to form a high thermal conductivity path, which alleviates the heat accumulation inside the crystal. Compared with the traditional liquid-cooled plate system, the maximum temperature of the laser crystal is reduced from 169.62℃ to 118.18℃, the pressure drop is reduced by 66.75%, and the total mass of the system is reduced to 4.87% of the original system, which effectively improves the practical performance of the device.

Thermal Behaviors of Passively-Cooled Hybrid Fin Heat Sinks for Lightweight and High Performance Thermal Management

2015 ◽  
Author(s):  
Nico Setiawan Effendi ◽  
Kyoung Joon Kim
Keyword(s):  
Thermal Resistance ◽  
Heat Sink ◽  
High Performance ◽  
Heat Dissipation ◽  
Computational Study ◽  
Heat Sinks ◽  
Channel Diameter ◽  
Internal Channel ◽  
Study Results ◽  
Parametric Effects

A computational study is conducted to explore thermal performances of natural convection hybrid fin heat sinks (HF HSs). The proposed HF HSs are a hollow hybrid fin heat sink (HHF HS) and a solid hybrid fin heat sink (SHF HS). Parametric effects such as a fin spacing, an internal channel diameter, a heat dissipation on the performance of HF HSs are investigated by CFD analysis. Study results show that the thermal resistance of the HS increases while the mass-multiplied thermal resistance of the HS decreases associated with the increase of the channel diameter. The results also shows the thermal resistance of the SHF HS is 13% smaller, and the mass-multiplied thermal resistance of the HHF HS is 32% smaller compared with the pin fin heat sink (PF HS). These interesting results are mainly due to integrated effects of the mass-reduction, the surface area enhancement, and the heat pumping via the internal channel. Such better performances of HF HSs show the feasibility of alternatives to the conventional PF HS especially for passive cooling of LED lighting modules.

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