Applications of Failure Modes and Effects Analysis to Biotechnology Manufacturing Processes

2005 ◽  
pp. 13-30 ◽  
Author(s):  
Gail Sofer ◽  
John Haury ◽  
Robert Seely
Keyword(s):  
Failure Modes ◽  
Manufacturing Processes

A Review on Corrosion and Wear of Additively Manufactured Alloys

2021 ◽  
pp. 1-54
Author(s):  
Peter Renner ◽  
Swarn Jha ◽  
Yan Chen ◽  
Ajinkya Raut ◽  
Siddhi Mehta ◽  
...  
Keyword(s):  
Additive Manufacturing ◽  
Consumer Satisfaction ◽  
Failure Modes ◽  
State Of The Art ◽  
Corrosion And Wear ◽  
Manufacturing Processes ◽  
Processing Conditions ◽  
Anisotropic Behavior ◽  
Wear Properties ◽  
Profound Influence

Abstract Products made from additive manufacturing processes have attracted great attention in engineering, health care, and society at large. However, there is little knowledge about the failure of additively manufactured alloys, in particular, corrosion and wear seen in most engineering applications. The haphazard and inefficient usage of such alloys raised concerns about safety, compatibility, reliability, cost, and consumer satisfaction. To address those concerns, we studied the mechanisms of the most common failure modes, corrosion and wear, of alloys fabricated through additive manufacturing based on published literature. It was found that the processing conditions have profound influence on microstructure and thus corrosion and wear resistance of alloys. Because of the layered structure, the initiation and growth of both corrosion and wear exhibited anisotropic behavior. The insights from this review could be used as a reference of the state-of-the art and to help in the development of future additively manufactured alloys with improved corrosion and wear properties.

Accelerated Temperature and Voltage Stress Tests of Embedded Planar Capacitors With Epoxy–BaTiO3 Composite Dielectric

2012 ◽  
Vol 134 (2) ◽  
Author(s):  
Mohammed A. Alam ◽  
Michael H. Azarian ◽  
Michael Osterman ◽  
Michael Pecht
Keyword(s):  
Leakage Current ◽  
Failure Modes ◽  
Failure Mechanisms ◽  
Dielectric Materials ◽  
Manufacturing Processes ◽  
Time To Failure ◽  
Sudden Increase ◽  
Stress Tests ◽  
Voltage Stress ◽  
Degradation Models

Accelerated temperature and voltage stress tests were conducted on embedded planar capacitors with epoxy–BaTiO3 composite dielectric. The failure modes were found to be a sudden increase in the leakage current across the capacitor dielectric and a gradual decrease in the capacitance. The failure mechanisms associated with these failure modes were investigated by performing data analysis and failure analysis. The time-to-failure as a result of a sudden increase in the leakage current was modeled using the Prokopowicz equation. The values of constants of the Prokopowicz equation, n and Ea, were determined for the epoxy–BaTiO3 composite. The degradation in capacitance was modeled by performing regression analysis. The time-to-failure and degradation models can be used for the qualification tests of embedded planar capacitors, for the development of new composite dielectric materials, and to improve the manufacturing processes of these capacitors.

scholarly journals Flexural Performance of Cross-Laminated Bamboo (CLB) Slabs and CFRP Grid Composite CLB Slabs

2019 ◽  
Vol 2019 ◽  
pp. 1-17 ◽  
Author(s):  
Qingfang Lv ◽  
Weiyang Wang ◽  
Ye Liu
Keyword(s):  
Carrying Capacity ◽  
Failure Modes ◽  
Strain Analysis ◽  
Manufacturing Processes ◽  
Load Carrying Capacity ◽  
Layer Number ◽  
Flexural Performance ◽  
Number Of Layers ◽  
Laminated Bamboo ◽  
Load Carrying

In order to accord well with the requirements of sustainable development and green construction, a cross-laminated bamboo composed of an odd number of orthogonally oriented layers of bamboo scrimber is proposed in this paper. Adjacent bamboo layers are face-bonded by structural adhesives under pressure. The uniform mechanical and physical properties can be obtained through the orthogonal layup. Flexural performances of three groups of one-way CLB slabs and two groups of one-way CLB slabs strengthened with CFRP grids were investigated via four-point monotonic loading configuration until failure. Experimental parameters of thickness of the layer, number of layers, and manufacturing processes of CFRP grids were taken into consideration. Experimental observations showed that the failure of the CLB slab was brittle, and different failure modes were found in the CLB slab with CFRP grids via different manufacturing processes. Test results showed that the load-carrying capacity increased with the thickness of the layer, number of layers, and application of CFRP grids pressed in the bamboo layer, but the CFRP grids pressed in the interface of adjacent bamboo layers weakened the load-carrying capacity. The strain analysis demonstrated that the compression region was utilized with more efficiency via CFRP grids pressed in the bamboo layer, and the plane cross section assumption is suitable for both CLB slab and CLB slab strengthened with CFRP grids. A theoretical calculation method of flexural load-carrying capacity was proposed for the CLB slab, the accuracy of which was proved.

Prioritization of Failure Modes in Manufacturing Processes

2020 ◽  
Author(s):  
Jagdeep Singh ◽  
Harwinder Singh ◽  
Bhupinder Singh
Keyword(s):  
Failure Modes ◽  
Manufacturing Processes

Effect of Underfilling Materials and Processes on the Reliability of System in Package

2007 ◽  
Author(s):  
Tae Hyun Kim ◽  
Sung Yi ◽  
Jae Ky Roh ◽  
Chang Mu Jung ◽  
Yan Shuang Guo ◽  
...  
Keyword(s):  
Numerical Simulation ◽  
Thermal Expansion ◽  
Failure Modes ◽  
Void Formation ◽  
Manufacturing Processes ◽  
Packaging Materials ◽  
Geometric Complexity ◽  
Adhesion Test ◽  
Passive Components ◽  
Interface Delamination

During the manufacturing process of the system-in-package, it has become susceptible to defects and internal residual stresses when dies, components, electric functionality and geometric complexity have increased. The mismatch of thermal expansion coefficient (CTE) among packaging materials and devices may lead to various failure modes during manufacturing processes, such as die broken, solder crack, substrate interface delamination. In this paper, the effect of underfill on the reliability of a system-in-package has been studied. A Bluetooth package is considered. The dimension of the package is 4.84 (L) × 6.15 (W) × 1.32 (H) mm. It contains an IC chip and several passive components such as crystals and filters. The substrate is NSMD type. Three underfill materials are considered. Materials were selected based on the numerical simulation. The causes of void formation during the underfill process have been investigated. In addition, the adhesion test of die passive material and PCB solder register was performed.

A Qualitative Failure Analysis Using Function-Based Performance State-Machines for Fault Identification and Propagation During Early Design Phases

2014 ◽  
Author(s):  
Charlie B. DeStefano ◽  
David C. Jensen
Keyword(s):  
Failure Analysis ◽  
Failure Modes ◽  
Fault Identification ◽  
Manufacturing Processes ◽  
Analysis Method ◽  
Well Performance ◽  
Early Design ◽  
Analysis Methods ◽  
Potential Failure

In a time when major technological advancements are happening at incredible rates and where demands for next-generation systems are constantly growing, advancements in failure analysis methods must constantly be developed, as well. Performance and safety are always top concerns for high-risk complex systems, and therefore, it is important for new failure analysis methods to be explored in order to obtain more useful and comprehensive failure information as early as possible, particularly during early design phases when detailed models might not yet exist. Therefore, this paper proposes a qualitative, function-based failure analysis method for early design phases that is capable of not only analyzing potential failure modes for physical components, but also for any manufacturing processes that might cause failures, as well. In this paper, the proposed method is first described in general and then applied in a case study of a proposed design for a nanochannel DNA sequencing device. Lastly, this paper discusses how more advanced and detailed analyses can be incorporated into this approach during later design phases, when more failure information becomes available.

Scanning Electron Microscopy in Hybrid Microelectronics

1976 ◽  
Vol 34 ◽  
pp. 456-457
Author(s):  
S. Khadpe ◽  
R. Faryniak
Keyword(s):  
Integrated Circuits ◽  
Thick Film ◽  
Integrated Circuit ◽  
Failure Modes ◽  
Three Dimensional ◽  
Circuit Components ◽  
Hybrid Microcircuit ◽  
Electrical Connections ◽  
Scanning Electron

The Scanning Electron Microscope (SEM) is an important tool in Thick Film Hybrid Microcircuits Manufacturing because of its large depth of focus and three dimensional capability. This paper discusses some of the important areas in which the SEM is used to monitor process control and component failure modes during the various stages of manufacture of a typical hybrid microcircuit.Figure 1 shows a thick film hybrid microcircuit used in a Motorola Paging Receiver. The circuit consists of thick film resistors and conductors screened and fired on a ceramic (aluminum oxide) substrate. Two integrated circuit dice are bonded to the conductors by means of conductive epoxy and electrical connections from each integrated circuit to the substrate are made by ultrasonically bonding 1 mil aluminum wires from the die pads to appropriate conductor pads on the substrate. In addition to the integrated circuits and the resistors, the circuit includes seven chip capacitors soldered onto the substrate. Some of the important considerations involved in the selection and reliability aspects of the hybrid circuit components are: (a) the quality of the substrate; (b) the surface structure of the thick film conductors; (c) the metallization characteristics of the integrated circuit; and (d) the quality of the wire bond interconnections.

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