OS9-11 Effects of Strain Rate and Specimen Size on Tensile Strength of Iron Green Bodies(Polymers and Resins,OS9 Recent advances in impact engineering,STRENGTH OF MATERIALS)

Tensile test at loading velocities up to 10 m·s-1(strain rate up to 3.2x102s-1) was carried out forr SiCp/AC4CH composite and AC4CH alloy. The microstructure of the composite before and after tensile deformation was carefully examined with both optical microscope and SEM. The experimental results demonstrated that the ultimate tensile strength (UTS) and yield strength (YS) increase with increasing loading velocity up to 10 m·s-1. Comparing with AC4CH alloy, the fracture elongation of the composite is sensitivity with the increasing strain rate. The YS of both the composite and AC4CH alloy shows more sensitive than that of the UTS with the increasing strain rate, especially in the range of strain rate higher than 102s-1.

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The effect of temperature and strain rate on the tensile strength of a fast-gas-cooled uranium-2 wt% molybdenum alloy

Journal of Nuclear Materials ◽

10.1016/0022-3115(85)90413-1 ◽

1985 ◽

Vol 132 (2) ◽

pp. 181-191 ◽

Cited By ~ 1

Author(s):

G.A.C. Boyd ◽

J. Harding ◽

P.A. Bleasdale ◽

K. Dunn ◽

G.I. Turner

Keyword(s):

Tensile Strength ◽

Strain Rate ◽

Molybdenum Alloy ◽

Effect Of Temperature

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Fracture Behavior of an AlMgMnSc Alloy at Different Temperatures

Materials Science Forum ◽

10.4028/www.scientific.net/msf.1016.292 ◽

2021 ◽

Vol 1016 ◽

pp. 292-296

Author(s):

Yuliya Igorevna Borisova ◽

Diana Yuzbekova ◽

Anna Mogucheva

Keyword(s):

Tensile Strength ◽

Ultimate Tensile Strength ◽

Brittle Fracture ◽

Fracture Surface ◽

Strain Rate ◽

Fracture Behavior ◽

Fine Grained ◽

Angular Pressing ◽

Different Temperatures ◽

Elongation To Failure

An Al-4.57Mg-0.35Mn-0.2Sc-0.09Zr (wt. %) alloy was studied in the fine-grained state obtaining after equal channel angular pressing. The mechanical behavior of alloy at the temperatures 173 K, 298 K and 348 K and at strain rate 1×10–3 s–1 is studied. Increase of the temperature testing from 173 K to 348 K decreases the yield stress by 80 MPa, the ultimate tensile strength by 60 MPa while elongation-to failure increases by a factor of 1.4. It was found that at temperatures of 298 and 173 K, the studied alloy mainly demonstrates the mode of ductile fracture, and at a temperature of 348 K the mechanism can be described as mixed ductile-brittle fracture. It was also established that of the studied alloy is the temperature dependence of the size of the dimples on the fracture surface. The formation of smaller dimples in the samples deformed at 298 K was observed.

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Comprehensive Properties of a Novel Quaternary Sn-Bi-Sb-Ag Solder: Wettability, Interfacial Structure and Mechanical Properties

Metals ◽

10.3390/met9070791 ◽

2019 ◽

Vol 9 (7) ◽

pp. 791 ◽

Cited By ~ 1

Author(s):

Kaipeng Wang ◽

Fengjiang Wang ◽

Ying Huang ◽

Kai Qi

Keyword(s):

Tensile Strength ◽

Shear Strength ◽

Low Temperature ◽

Strain Rate ◽

Isothermal Aging ◽

Solder Joints ◽

Solder Matrix ◽

Interfacial Structure ◽

Solder Alloys ◽

Cu Substrate

Sn-58Bi eutectic solder is the most recommended low temperature Pb-free solder but is also limited from the interfacial embrittlement of Bi segregation. Since the quaternary Sn-38Bi-1.5Sb-0.7Ag solder provides a similar melting point as Sn-58Bi eutectic, this paper systematically investigated the properties of this solder from wettability, bulk tensile properties, interfacial microstructure in solder joints with a Cu substrate, interfacial evolution in joints during isothermal aging and the shear strength on ball solder joints with effect of aging conditions. The results were also compared with Sn-58Bi solder. The wettability of solder alloys was evaluated with wetting balance testing, and the quaternary Sn-38Bi-1.5Sb-0.7Ag solder had a better wettability than Sn-58Bi solder on the wetting time. Tensile tests on bulk solder alloys indicated that the quaternary Sn-38Bi-1.5Sb-0.7Ag solder had a higher tensile strength and similar elongation compared with Sn-58Bi solder due to the finely distributed SnSb and Ag3Sn intermetallics in the solder matrix. The tensile strength of solder decreased with a decrease in the strain rate and with an increase in temperature, while the elongation of solder was independent of the temperature and strain rate. When soldering with a Cu substrate, a thin Cu6Sn5 intermetallic compound (IMC) is produced at the interface in the solder joint. Measurement on IMC thickness showed that the quaternary Sn-38Bi-1.5Sb-0.7Ag had a lower IMC growth rate during the following isothermal aging. Ball shear test on solder joints illustrated that the quaternary Sn-38Bi-1.5Sb-0.7Ag solder joints had higher shear strength than Sn-58Bi solder joints. Compared with the serious deterioration on shear strength of Sn-58Bi joints from isothermal aging, the quaternary Sn-38Bi-1.5Sb-0.7Ag solder joints presented a superior high temperature stability. Therefore, the quaternary Sn-38Bi-1.5Sb-0.7Ag solder provides better performances and the possibility to replace Sn-58Bi solder to realize low temperature soldering.

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