Effect of metal salt coating treatment on Bonding interface characteristics of A6061 / high tensile steel plate

2018 ◽  
Vol 2018.56 (0) ◽  
pp. 524
Author(s):  
Kohei OZAWA ◽  
Shinji KOYAMA ◽  
Masahiro INOUE ◽  
Shinichi NISHIDA
Keyword(s):  
Steel Plate ◽  
Metal Salt ◽  
Bonding Interface ◽  
Interface Characteristics ◽  
Salt Coating

scholarly journals Effect of Heating Process on Microstructure and Properties of 2205/Q235B Composite Interface

Metals ◽  
2019 ◽  
Vol 9 (10) ◽  
pp. 1027 ◽  
Author(s):  
Fengqiang Xiao ◽  
Dongpo Wang ◽  
Zhiming Gao ◽  
Lanju Zhou
Keyword(s):  
Steel Plate ◽  
Heating Temperature ◽  
Heating Process ◽  
Diffusion Distance ◽  
Metallurgical Bonding ◽  
Interface Characteristics ◽  
Composite Interface ◽  
Clad Steel ◽  
Interfacial Gap ◽  
Rolling Deformation

In this paper, the influence of heating process parameters on interface characteristics and mechanical properties of 2205/Q235B clad steel plate was systematically studied. The results showed that the interfacial gap of the 2205/Q235B composite blank was completely bonded by the mutual diffusion of elements under the action of temperature and metallurgical bonding is achieved. The shear strength of the air-cooled samples was only 114–132 MPa, which was far lower than that of water-quenched samples and rolling deformation samples and was unable to meet the requirements of engineering applications. With the increase in heating temperature and holding time, the diffusion distance of the Cr element gradually increased. After rolling deformation, the diffusion distance of the Cr element was significantly reduced to 4.1–10.2 μm. Rolling deformation of the specimen in the decarburization showed the lowest microhardness, and in combination with the microhardness of the interface is about 236–256 HV, which is between the hardness of Q235B and 2205. The 2205 stainless-steel shows the lowest corrosion rate and the best corrosion resistance when rolling at 1200 °C. It was found that the corrosion was the most significant in the side of Q235B near the bonding zone. The corrosion pit width increased gradually with increased heating temperature.

Solid-State Diffusion Bonding of Titanium by Using Metal Salt Coated Aluminum Sheet

2017 ◽  
Vol 741 ◽  
pp. 31-35
Author(s):  
Shinji Koyama ◽  
Van Phu Nguyen
Keyword(s):  
Solid State ◽  
Metal Salt ◽  
Bonding Temperature ◽  
High Strength ◽  
Bonding Process ◽  
Aluminum Surface ◽  
Solid State Diffusion ◽  
State Diffusion ◽  
Aluminum Surfaces ◽  
Salt Coating

In this study, the effect of metal salt coating processing of aluminum surface on the bond strength of the solid-state diffusion bonded interface of titanium and aluminum has been investigated by SEM observation of the interfacial microstructures and fractured surfaces after tensile test. Aluminum surfaces were coated by boiling in 5% aqueous solution of NaOH for 90 s and 98% formic acid for 60 s. Bonding process was performed at a bonding temperature of 713 ~ 773 K under a load of 12 MPa (for a bonding time of 900 s). As a result of the metal salt coating processing, high strength joint can be achieved with lower bonding temperature compared with unmodified joints. From this study, it is found out that metal salt coating processing is effective at removing oxide film and substitution to metal salt on the aluminum bonding surface.

BONDING INTERFACE CHARACTERISTICS OF STEELTO- ALUMINIUM EXPLOSION WELDS

2018 ◽  
pp. 46-48
Author(s):  
G. H. S. F. L. Carvalho ◽  
◽  
I. Galvão ◽  
R. M. Leal ◽  
A. Loureiro ◽  
...  
Keyword(s):  
Bonding Interface ◽  
Interface Characteristics

Metal Salt Coating Effect on Zn Insert Sheet for Liquid Phase Diffusion Bonding Strength of A7075

2018 ◽  
Vol 2018.56 (0) ◽  
pp. 522
Author(s):  
Yusuke FUJIMORI ◽  
Shinji KOYAMA ◽  
Masahiro INOUE ◽  
Shinichi NISHIDA
Keyword(s):  
Liquid Phase ◽  
Diffusion Bonding ◽  
Bonding Strength ◽  
Metal Salt ◽  
Phase Diffusion ◽  
Salt Coating

scholarly journals Research on Interface Characteristics and Mechanical Properties of 6061 Al Alloy and Q235a Steel by Hot Melt-Explosive Compression Bonding

Coatings ◽  
2020 ◽  
Vol 10 (11) ◽  
pp. 1031
Author(s):  
Yu-ling Sun ◽  
Hong-hao Ma ◽  
Ming Yang ◽  
Zhao-wu Shen ◽  
Ning Luo ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Steel Plate ◽  
Processing Method ◽  
Al Alloy ◽  
Test Results ◽  
Welding Interface ◽  
Interface Characteristics ◽  
Steel Composite ◽  
6061 Al Alloy ◽  
Hot Melt

In order to solve the shortcomings of the traditional explosion welding method for direct magnesia-aluminum alloy and steel welding, a processing method of groove hot casting plus explosion compression bonding (HCECB) was put forward, and the related theory of hot-melt metal plus explosion bonding was also proposed. Taking 6061 aluminum and Q235a steel as examples, the hot casting plus explosion compression test was carried out by the prefabrication of a dovetail groove on Q235a steel plate and the microstructure and mechanical properties of the interface were analyzed. The results showed that the 6061 aluminum/Q235a steel can be directly combined by the HCECB method. The interface is mainly irregularly microwave-shaped and straight-shaped with no defects, such as melting layer, holes and cracks, found. The hardness of the upper interface of the dovetail groove is larger than that far away from the welding interface, while the hardness of the lower interface is the same as that far away from the interface. The tensile and shear test results show that the shear strength is greater than 80 MPa, which meets the requirements of aluminum-steel composite plate bonding strength.

Solid-State Bonding of 5052 Aluminum Alloy/316L Stainless Steel by Using Organic Salt Formation/Decomposition Reaction

2016 ◽  
Vol 879 ◽  
pp. 2468-2472 ◽  
Author(s):  
Hiroki Saito ◽  
Shinji Koyama
Keyword(s):  
Stainless Steel ◽  
Aluminum Alloy ◽  
316L Stainless Steel ◽  
Metal Salt ◽  
Bonding Temperature ◽  
Decomposition Reaction ◽  
Organic Salt ◽  
Aluminum Surface ◽  
Coating Process ◽  
Salt Coating

The effect of metal salt coating process on the bond strength of the bonded interface of 5052 aluminum alloy and 316L stainless steel was investigated by SEM observations of interfacial microstructures and fractured surfaces. Aluminum alloy surfaces were coated by boiling in 5% aqueous solution of NaOH for 5 s and 98% formic acid and 99.7% acetic acid for 20 s and 20 s respectively. Bonding process was performed at bonding temperature of 733 ~ 773 K under a pressure of 20 MPa (bonding time of 900 s). From this study, it is found out that the bonded strength of the joint increased with the rise in bonding temperature with or without metal salt coating process. However, it is understood that with metal salt coating process, high strength joint can be achieved with lesser deformation and lower bonding temperature. From the experimental results, it is found out that metal salt generation processing is effective at removing oxide film and substitution to a metal salt on the aluminum surface.

scholarly journals Effect of Combined Hydrophilic Activation on Interface Characteristics of Si/Si Wafer Direct Bonding

Processes ◽  
2021 ◽  
Vol 9 (9) ◽  
pp. 1599
Author(s):  
Dongling Li ◽  
Xiaohan Cui ◽  
Mao Du ◽  
Ying Zhou ◽  
Fenfen Lan
Keyword(s):  
Bonding Strength ◽  
Energy State ◽  
Chemical Activation ◽  
Bonding Interface ◽  
Activation Process ◽  
Plasma Activation ◽  
Interface Characteristics ◽  
Wafer Direct Bonding ◽  
O2 Plasma ◽  
Si Wafer

Wafer direct bonding is an attractive approach to manufacture future micro-electro-mechanical system (MEMS) and microelectronic and optoelectronic devices. In this paper, a combined hydrophilic activated Si/Si wafer direct bonding process based on wet chemical activation and O2 plasma activation is explored. Additionally, the effect on bonding interface characteristics is comprehensively investigated. The mechanism is proposed to better understand the nature of hydrophilic bonding. The water molecule management is controlled by O2 plasma activation process. According to the contact angle measurement and FTIR spectrum analysis, it can be concluded that water molecules play an important role in the type and density of chemical bonds at the bonding interface, which influence both bonding strength and voids’ characteristics. When annealed at 350 °C, a high bonding strength of more than 18.58 MPa is obtained by tensile pulling test. Cross sectional SEM and TEM images show a defect-free and tightly bonded interface with an amorphous SiOx layer of 3.58 nm. This amorphous SiOx layer will induce an additional energy state, resulting in a lager resistance. These results can facilitate a better understanding of low-temperature hydrophilicity wafer direct bonding and provide possible guidance for achieving good performance of homogenous and heterogenous wafer direct bonding.

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