scholarly journals Effects of CMP Retaining Ring Material on the Performance of Wafer Polishing

Author(s):  
Ki-Won Park ◽  
◽  
Eun-young Kim ◽  
Dong-Sam Park
1990 ◽  
Vol 26 (3-4) ◽  
pp. 245-251 ◽  
Author(s):  
M.C. Sun ◽  
C.H. Guo ◽  
Z.Z. Zheng ◽  
Z.M. Ma

2012 ◽  
Vol 455-456 ◽  
pp. 369-373
Author(s):  
Qian Zhang ◽  
Song Feng Tian ◽  
Lin Tie Fang ◽  
Dong Dong Ma

In hydrogen-cooled generator, the quality of hydrogen environment directly affects generator’s operating especially the retaining ring. In order to research the relationship between the hydrogen environment and stress corrosion of material, the metallographic analysis is held for retired retaining ring of a power plant. There were intergranular and transcrystalline cracks, similar with hydrogen embrittlement. Designed generating system of occurrence for wet hydrogen, hydrogen charging is operated to retaining ring material used in tensile test, and then observed fracture by scanning electron microscope. The results showed that fracture was including cleavage, dimple and secondary crack caused by hydrogen-induced lagging plastic deformation.


1984 ◽  
Vol 75 ◽  
pp. 599-602
Author(s):  
T.V. Johnson ◽  
G.E. Morfill ◽  
E. Grun

A number of lines of evidence suggest that the particles making up the E-ring are small, on the order of a few microns or less in size (Terrile and Tokunaga, 1980, BAAS; Pang et al., 1982 Saturn meeting; Tucson, AZ). This suggests that a variety of electromagnetic and plasma affects may be important in considering the history of such particles. We have shown (Morfill et al., 1982, J. Geophys. Res., in press) that plasma drags forces from the corotating plasma will rapidly evolve E-ring particle orbits to increasing distance from Saturn until a point is reached where radiation drag forces acting to decrease orbital radius balance this outward acceleration. This occurs at approximately Rhea's orbit, although the exact value is subject to many uncertainties. The time scale for plasma drag to move particles from Enceladus' orbit to the outer E-ring is ~104yr. A variety of effects also act to remove particles, primarily sputtering by both high energy charged particles (Cheng et al., 1982, J. Geophys. Res., in press) and corotating plasma (Morfill et al., 1982). The time scale for sputtering away one micron particles is also short, 102 - 10 yrs. Thus the detailed particle density profile in the E-ring is set by a competition between orbit evolution and particle removal. The high density region near Enceladus' orbit may result from the sputtering yeild of corotating ions being less than unity at this radius (e.g. Eviatar et al., 1982, Saturn meeting). In any case, an active source of E-ring material is required if the feature is not very ephemeral - Enceladus itself, with its geologically recent surface, appears still to be the best candidate for the ultimate source of E-ring material.


2000 ◽  
Vol 613 ◽  
Author(s):  
Sun Hyuk Bae ◽  
Jae-Hyun So ◽  
Seung-Man Yang ◽  
Do Hyun Kim

ABSTRACTSilica slurry used as abrasives in wafer polishing process is made by dispersing silica particles in an alkali solution. Since commercially available colloidal or fumed silica particles need some modifications to be directly used as abrasive slurry due to their small sizes, irregular shapes or broad size distribution, we have prepared silica abrasives by particle growth of fumed silica or colloidal silica as seeds by sol-gel method. Silica slurries prepared by this step-wise growth from commercial seeds were tested using one-armed polisher for the comparison with commercial slurries and showed the performance comparable to commercial slurries. Microstructures of polishing slurries were investigated using transmission electron microscopy and ARES rheometer. From the result, stability of the slurry was found to be more important than the primary particle sizes for the polishing performance.


2008 ◽  
Vol 389-390 ◽  
pp. 493-497 ◽  
Author(s):  
Sung Chul Hwang ◽  
Jong Koo Won ◽  
Jung Taik Lee ◽  
Eun Sang Lee

As the level of Si-wafer surface directly affects device line-width capability, process latitude, yield, and throughput in fabrication of microchips, it needs to have ultra precision surface and flatness. Polishing is one of the important processing having influence on the surface roughness in manufacturing of Si-wafers. The surface roughness in wafer polishing is mainly affected by the many process parameters. For decreasing the surface roughness, the control of polishing parameters is very important. In this paper, the optimum condition selection of ultra precision wafer polishing and the effect of polishing parameters on the surface roughness were evaluated by the statistical analysis of the process parameters.


2018 ◽  
Vol 7 (4.26) ◽  
pp. 190 ◽  
Author(s):  
Nur Fatin Izzati Ibrahim ◽  
Ruslizam Daud ◽  
Muhammad Khairul Ali Hassan ◽  
Noor Ali Hassan ◽  
Noor Alia Md Zain ◽  
...  

Axial stiffness is the most important factor in stability. It is known that any changes in the diameter of any components of the frame will either increase or decrease the axial stiffness of the fixation. The model of implant and bone will be variety as the variables changes. Current studies states that ring stability are one of the most important factors in ensuring fractured bones to have a successful re-union. In circular external fixation, the stability of the pin-bone interaction is influenced by the stability of the fixation frame where the major component is the rings. The objective is to study the finite element analysis (FEA) of the external fixator assembled in human diaphysis under compression force with different materials of the exoskeleton which are stainless steel, titanium alloy, magnesium alloy and carbon fiber. The results obtained show the mechanical strength of each material where it will be used to compare the value of von-Mises stress, stiffness and total deformation to acquire the best suitable ring diameter and material. Based on the result, as the diameter of the ring increases, the stiffness of the ring will be decreased. 


2020 ◽  
Vol 2020 ◽  
pp. 1-6
Author(s):  
Jia-Qi Zong ◽  
Wei-Xiao Ji ◽  
Chang-Wen Zhang ◽  
Ping Li ◽  
Pei-Ji Wang

The nodal ring material has recently attracted wide attention due to its singular properties and potential applications in spintronics. Here, two-dimensional Zn3C6S6 is calculated and discussed by using first-principle calculations. We found that two-dimensional Zn3C6S6 can generate a nodal ring at 10% compressive strain, and the existence of the ring is proved by a partial charge density map. And as the compressive strain increases, the nodal ring does not disappear. At the same time, the stability of the electron-orbit coupling to the nodal ring is applied. Our findings indicate that the two-dimensional Zn3C6S6 is promising in new electronic and spintronic applications.


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