Chapter 3 Redshift in Tellurite Glasses Doped with Eu3+ due to Heat Treatment

2021 ◽  
pp. 109-130
Author(s):  
I. V. García-Amaya ◽  
L. Castro-Arce ◽  
G. A. Limon-Reynosa ◽  
J. Manzanares-Martinez ◽  
M. C. Acosta-Enríque ◽  
...  
Keyword(s):  
Heat Treatment ◽  
Tellurite Glasses

Nano-silver enhanced luminescence of Er3+ ions embedded in tellurite glass, vitro-ceramic and ceramic: impact of heat treatment

RSC Advances ◽  
2016 ◽  
Vol 6 (37) ◽  
pp. 31136-31145 ◽  
Author(s):  
Hssen Fares ◽  
Wissal Stambouli ◽  
Habib Elhouichet ◽  
Bernard Gelloz ◽  
Mokhtar Férid
Keyword(s):  
Heat Treatment ◽  
Silver Nanoparticles ◽  
Tellurite Glass ◽  
Tellurite Glasses ◽  
Melt Quenching ◽  
Ag Nps ◽  
Nano Silver ◽  
Erbium Ions ◽  
Enhanced Luminescence

Tellurite glasses co-activated with erbium ions and silver nanoparticles (Ag NPs) are prepared using melt quenching technique.

The Precipitation of Si in AlCuSi Thin Films

1973 ◽  
Vol 31 ◽  
pp. 34-35 ◽  
Author(s):  
R. M. Anderson
Keyword(s):  
Electron Microscopy ◽  
Thin Films ◽  
Heat Treatment ◽  
Solid Solution ◽  
Integrated Circuit ◽  
Copper Film ◽  
Solution Concentration ◽  
X Ray ◽  
Silicon Thin Films ◽  
Before And After

Aluminum-copper-silicon thin films have been considered as an interconnection metallurgy for integrated circuit applications. Various schemes have been proposed to incorporate small percent-ages of silicon into films that typically contain two to five percent copper. We undertook a study of the total effect of silicon on the aluminum copper film as revealed by transmission electron microscopy, scanning electron microscopy, x-ray diffraction and ion microprobe techniques as a function of the various deposition methods.X-ray investigations noted a change in solid solution concentration as a function of Si content before and after heat-treatment. The amount of solid solution in the Al increased with heat-treatment for films with ≥2% silicon and decreased for films <2% silicon.

The influence of heat treatment on the fiber/matrix interface in a SiC-reinforced glassceramic

1988 ◽  
Vol 46 ◽  
pp. 742-743
Author(s):  
E. Bischoff ◽  
O. Sbaizero
Keyword(s):  
Heat Treatment ◽  
Aluminum Silicate ◽  
Lithium Aluminum ◽  
Interfacial Region ◽  
Specimen Preparation ◽  
Crack Wake ◽  
Pull Out ◽  
Annealed Material ◽  
Ultrasonic Drilling ◽  
Fiber Matrix Interface

Fiber or whisker reinforced ceramics show improved toughness and strength. Bridging by intact fibers in the crack wake and fiber pull-out after failure contribute to the additional toughness. These processes are strongly influenced by the sliding and debonding resistance of the interfacial region. The present study examines the interface in a laminated 0/90 composite consisting of SiC (Nicalon) fibers in a lithium-aluminum-silicate (LAS) glass-ceramic matrix. The material shows systematic changes in sliding resistance upon heat treatment.As-processed samples were annealed in air at 800 °C for 2, 4, 8, 16 and 100 h, and for comparison, in helium at 800 °C for 4 h. TEM specimen preparation of as processed and annealed material was performed with special care by cutting along directions having the fibers normal and parallel to the section plane, ultrasonic drilling, dimpling to 100 pm and final ionthinning. The specimen were lightly coated with Carbon and examined in an analytical TEM operated at 200 kV.

Strain-induced martensite effects on transgranular carbide precipitation in type 304 stainless steels

1991 ◽  
Vol 49 ◽  
pp. 604-605
Author(s):  
A.H. Advani ◽  
L.E. Murr ◽  
D. Matlock
Keyword(s):  
Heat Treatment ◽  
Grain Boundary ◽  
Stress Corrosion Cracking ◽  
Stainless Steels ◽  
Deformation Twin ◽  
Austenitic Stainless Steels ◽  
Carbide Precipitation ◽  
Strain Induced Martensite ◽  
Type 304

Thermomechanically induced strain is a key variable producing accelerated carbide precipitation, sensitization and stress corrosion cracking in austenitic stainless steels (SS). Recent work has indicated that higher levels of strain (above 20%) also produce transgranular (TG) carbide precipitation and corrosion simultaneous with the grain boundary phenomenon in 316 SS. Transgranular precipitates were noted to form primarily on deformation twin-fault planes and their intersections in 316 SS.Briant has indicated that TG precipitation in 316 SS is significantly different from 304 SS due to the formation of strain-induced martensite on 304 SS, though an understanding of the role of martensite on the process has not been developed. This study is concerned with evaluating the effects of strain and strain-induced martensite on TG carbide precipitation in 304 SS. The study was performed on samples of a 0.051%C-304 SS deformed to 33% followed by heat treatment at 670°C for 1 h.

Effect of a Complex Heat Treatment on the Structure of 300M Steel

1981 ◽  
Vol 39 ◽  
pp. 312-313
Author(s):  
R. Padmanabhan ◽  
W. E. Wood
Keyword(s):  
Heat Treatment ◽  
Metal Carbides ◽  
Austenite Grain Size ◽  
300M Steel ◽  
Heat Treated ◽  
Strain Fracture ◽  
Prior Austenite Grain Size ◽  
Short Time ◽  
Final Tempering ◽  
Similar Yield

Intermediate high temperature tempering prior to subsequent reaustenitization has been shown to double the plane strain fracture toughness as compared to conventionally heat treated UHSLA steels, at similar yield strength levels. The precipitation (during tempering) of metal carbides and their subsequent partial redissolution and refinement (during reaustenitization), in addition to the reduction in the prior austenite grain size during the cycling operation have all been suggested to contribute to the observed improvement in the mechanical properties. In this investigation, 300M steel was initially austenitized at 1143°K and then subjected to intermediate tempering at 923°K for 1 hr. before reaustenitizing at 1123°K for a short time and final tempering at 583°K. The changes in the microstructure responsible for the improvement in the properties have been studied and compared with conventionally heat treated steel. Fig. 1 shows interlath films of retained austenite produced during conventionally heat treatment.

Crystallization of MgO • Al2 • SiO2 • ZrO2 glasses

1986 ◽  
Vol 44 ◽  
pp. 440-441
Author(s):  
M. A. McCoy
Keyword(s):  
Mechanical Properties ◽  
Heat Treatment ◽  
Powder Processing ◽  
Glass Composition ◽  
Ceramic Powder ◽  
Transformation Toughening ◽  
Ceramic Powder Processing ◽  
Processing Techniques ◽  
Ceramic Matrices

Transformation toughening by ZrO2 inclusions in various ceramic matrices has led to improved mechanical properties in these materials. Although the processing of these materials usually involves standard ceramic powder processing techniques, an alternate method of producing ZrO2 particles involves the devtrification of a ZrO2-containing glass. In this study the effects of glass composition (ZrO2 concentration) and heat treatment on the morphology of the crystallization products in a MgO•Al2•SiO2•ZrO2 glass was investigated.

Microstructural Development in Nb-Ti Multifilamentary Superconductors During Processing

1985 ◽  
Vol 43 ◽  
pp. 190-191
Author(s):  
A. W. West
Keyword(s):  
Heat Treatment ◽  
Critical Current Density ◽  
Copper Matrix ◽  
Wire Drawing ◽  
Heat Treatments ◽  
Microstructural Development ◽  
Final Size ◽  
Density Values ◽  
The Wire ◽  
Multifilamentary Superconductors

The influence of the filament microstructure on the critical current density values, Jc, of Nb-Ti multifilamentary superconducting composites has been well documented. However the development of these microstructures during composite processing is still under investigation.During manufacture, the multifilamentary composite is given several heat treatments interspersed in the wire-drawing schedule. Typically, these heat treatments are for 5 to 80 hours at temperatures between 523 and 573K. A short heat treatment of approximately 3 hours at 573K is usually given to the wire at final size. Originally this heat treatment was given to soften the copper matrix, but recent work has shown that it can markedly change both the Jc value and microstructure of the composite.

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