Patience Alone is not Enough – A Guide for the Preparation of Low-Defect Sections from Pure Copper
Abstract The preparation of metallographic sections from soft metals such as pure copper constitutes a particular challenge: the high degree of ductility promotes the formation of preparation artifacts and complicates the preparation of homogeneous, low-deformation surfaces. A metallographic preparation routine is therefore presented which has proven effective for pure copper and which can also be applied to additionally soft annealed samples. The subsequent removal of fine crystalline deformation layers is discussed and different setups for electropolishing and its optimization are presented.
2018 ◽
Vol 9
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pp. 1220-1227
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Keyword(s):
1976 ◽
Vol 46
(8)
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pp. 574-587
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Keyword(s):
1978 ◽
Vol 36
(2)
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pp. 86-87
1974 ◽
Vol 32
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pp. 450-451
Keyword(s):
1972 ◽
Vol 30
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pp. 606-607
1972 ◽
Vol 30
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pp. 60-61
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1975 ◽
Vol 33
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pp. 284-285
Keyword(s):
1968 ◽
Vol 26
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pp. 338-339