Effect of Machining of Small Tools by Means of Focused Ion Beam

2012 ◽  
Vol 565 ◽  
pp. 588-593
Author(s):  
Kohichi Miura ◽  
Syou Satoh ◽  
Takazo Yamada ◽  
Hwa Soo Lee
Keyword(s):  
Experimental Evaluation ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Cutting Edge ◽  
Geometrical Shape ◽  
Geometrical Shapes ◽  
Micro Holes ◽  
Made In ◽  
The Ideal

Micro holes which diameters are more than 0.1 mm are mechanically machined.　However since the ideal sharp cutting edges are difficult to be made in micro drills, fine geometrical shape of micro holes is difficult to be obtained. In this study, the influence of the geometrical shape of cutting edge is experimentally discussed. In order to carry out experimental evaluation, focused ion beam is used to make the geometrical shapes of micro drills.

FIB Micromachining and Nano-Structure Fabrication

1999 ◽  
Author(s):  
Raymond A. Lee ◽  
Patrick J. Wolpert
Keyword(s):  
High Precision ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Biological Applications ◽  
Optical Lens ◽  
Nano Structure ◽  
Beam System ◽  
Afm Tips ◽  
Established Technique ◽  
Made In

Abstract FIB Micromachining has long been an established technique, but until recently it has been overshadowed by the more mainstream semiconductor application of the Focused Ion Beam system. Nano- Structure fabrication using the FIB system has become more popular recently due to several factors. The need for sub-micron structures have grown significantly due to a need for enhanced optical and biological applications. Another reason for the growth in micromachining is the improvement made in the ability of FIB systems to produce geometric shapes with high precision. With the latest high-end FIB systems, it is possible to produce microstructures with tens of nano-meters of precision. Optical lens, AFM tips, and nano-apertures are all part of the growing application for FIB Micromachining. This paper will discuss the ability and limitations of the FIB system and some possible application for FIB Micromachining.

Cutting-Edge Sample Preparation from FIB to Ar Concentrated Ion Beam Milling of Advanced Semiconductor Devices

2020 ◽  
Author(s):  
C.S. Bonifacio ◽  
P. Nowakowski ◽  
R. Li ◽  
M.L. Ray ◽  
P.E. Fischione ◽  
...  
Keyword(s):  
Sample Preparation ◽  
Failure Analysis ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Semiconductor Devices ◽  
Specific Area ◽  
Cutting Edge ◽  
Preparation Technique ◽  
Ion Milling ◽  
Sample Preparation Technique

Abstract Fast and accurate examination from the bulk to the specific area of the defect in advanced semiconductor devices is critical in failure analysis. This work presents the use of Ar ion milling methods in combination with Ga focused ion beam (FIB) milling as a cutting-edge sample preparation technique from the bulk to specific areas by FIB lift-out without sample-preparation-induced artifacts. The result is an accurately delayered sample from which electron-transparent TEM specimens of less than 15 nm are obtained.

Indentation plastic displacement field: Part I. The case of soft films on hard substrates

1999 ◽  
Vol 14 (6) ◽  
pp. 2196-2203 ◽  
Author(s):  
T. Y. Tsui ◽  
Joost Vlassak ◽  
William D. Nix
Keyword(s):  
Plastic Deformation ◽  
Cross Sections ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Porous Titanium ◽  
Titanium Layer ◽  
Plastic Deformation Behavior ◽  
Plastic Displacement ◽  
Film Substrate ◽  
Made In

The plastic deformation behavior of Knoop indentations made in a soft, porous titanium/aluminum multilayered thin film on a hard silicon substrate is studied through use of the focused-ion-beam milling and imaging technique. Pileup is observed for indentations with depths larger than 30% of the total film thickness. Analysis of the indentation cross sections shows that plastic deformation around the indentation is partly accommodated by the closing of the pores within the multilayers. This densification process reduces the amount of pileup formed below that predicted by finite element simulations. Experimental results show that the pileup is formed by an increase of the titanium layer thickness near the edges of the indentation. The thickness increase is largest near the film/substrate interface and decreases toward the surface of the multilayered film. The amount of normal compression near the center of the indenter is characterized, and it is demonstrated that the deformation becomes more nonuniform with increasing indentation depth.

Modeling and Simulation of Focused Ion Beam Based Single Digital Nano Hole Fabrication for DNA and Macromolecule Characterization

2008 ◽  
Author(s):  
Jack Zhou ◽  
Guoliang Yang
Keyword(s):  
Thin Film ◽  
Focused Ion Beam ◽  
Electrochemical Etching ◽  
Ion Beam ◽  
Machining Process ◽  
Single Digit ◽  
Nano Fabrication ◽  
Dna And Rna ◽  
Epitaxial Deposition ◽  
Micro Holes

In this paper we describe a top down nano-fabrication method to make single-digit nanoholes that we aim to use for DNA and RNA characterization. There are three major steps towards the fabrication of a single-digit nanohole. 1) Preparing the freestanding thin film by epitaxial deposition and electrochemical etching. 2) Making sub-micro holes (0.2 μm to 0.02μm) by focused ion beam (FIB), electron beam (EB), atomic force microscope (AFM), or other methods. 3) Reducing the hole to less than 10 nm by epitaxial deposition, FIB or EB induced deposition. One specific aim for this paper is to model, simulate and control the focused ion beam machining process to fabricate holes which can reach single-digit nanometer scale on solid-state thin films. Preliminary work has been done on the thin film (30 nm in thickness) preparation, sub-micron hole fabrication, and ion beam induced deposition, and results are presented.

Indentation plastic displacement field: Part II. The case of hard films on soft substrates

1999 ◽  
Vol 14 (6) ◽  
pp. 2204-2209 ◽  
Author(s):  
T. Y. Tsui ◽  
Joost Vlassak ◽  
William D. Nix
Keyword(s):  
Plastic Deformation ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Mechanical Damage ◽  
Multilayered Film ◽  
Milling Method ◽  
Bulk Substrate ◽  
Small Change ◽  
Plastic Displacement ◽  
Made In

The plastic displacements around Knoop indentations made in hard titanium/aluminum multilayered films on soft aluminum alloy substrates have been studied. Indentations were cross-sectioned and imaged using focused-ion-beam (FIB) milling and high-resolution scanning electron microscopy (SEM), respectively. The FIB milling method has the advantage of removing material in a localized region without producing mechanical damage to the specimen. The micrographs of the cross-sectioned indentations indicate that most of the plastic deformation around the indentation is dominated by the soft aluminum substrate. There is a very small change in the multilayered film thickness around the indentation—less than 10%. The plastic deformation of the thin film resembles a membrane being deflected by a localized pressure gradient across the membrane. Stress-induced voids are also observed in the multilayered film, especially in the area around the indentation apex. The density and the size of the voids increase with indentation depth. Indentation sink-in effects are observed in all of the indentations inspected. Based on the experimental results, the amount of sink-in of the hard film–soft substrate composite is larger than the bulk substrate and film alone. This is confirmed by the finite element analyses conducted in this work.

Controlling parameters of focused ion beam (FIB) on high aspect ratio micro holes milling

2013 ◽  
Vol 19 (12) ◽  
pp. 1873-1888 ◽  
Author(s):  
Fatin Syazana Jamaludin ◽  
Mohd Faizul Mohd Sabri ◽  
Suhana Mohd Said
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Micro Holes

Machining of Acrylic Resin Using Monocrystalline Diamond Endmill with Cutting Edges Formed by Focused Ion Beam

2013 ◽  
Vol 7 (6) ◽  
pp. 638-643
Author(s):  
Tsunehisa Suzuki ◽  
◽  
Hiroshi Saito
Keyword(s):  
Surface Roughness ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Acrylic Resin ◽  
Rake Angle ◽  
Cutting Edge ◽  
Cutting Resistance ◽  
Depth Direction ◽  
Beam Technique ◽  
Monocrystalline Diamond

The cutting edge of a single-blade monocrystalline diamond endmill was formed using the Focused Ion Beam technique (FIB): the cutting edge was mechanically polished to a rake angle of -70° and then formed to a rake angle of 0° by FIB sputtering. The performance of the diamond endmill was evaluated for the machining of acryl resin. Grooves were cut into optical acrylic resin with the resulting endmill; characteristics such as the surface roughness, cutting resistance, and chip shape were evaluated. The improved sharpness of the cutting edge reduced the surface roughness and cutting force in the depth direction. The surface roughness did not fluctuate even under the conditions of a fast feed rate and deep cutting depth. A cutter mark was observed on the finished surface, and flowing chips were generated unlike the performance of the -70° rake angle cutter.

Nanosurface Fabrication of Hard Brittle Materials by Structured Tool Imprinting

2004 ◽  
Vol 126 (4) ◽  
pp. 760-765 ◽  
Author(s):  
Masahiko Yoshino ◽  
Sivanandam Aravindan
Keyword(s):  
Focused Ion Beam ◽  
Diamond Tool ◽  
Ion Beam ◽  
Brittle Materials ◽  
Geometrical Shape ◽  
Structured Surfaces ◽  
Ductile Mode ◽  
Depth Analysis ◽  
Quartz Wafer ◽  
Ductile To Brittle Transition

This paper reports on nanosurface fabrication of hard brittle materials by structured diamond tool imprinting. Ultrafine structured surfaces were fabricated on soda glass, firelite glass, quartz glass, quartz wafer, and silicon. A specially designed and developed nanoindentation tester and a structured diamond tool machined by Focused Ion Beam (FIB) are used for the generation of such surfaces. Imprinted marks and the ultrafine structures are analyzed for their geometrical shape and accuracy. Load-depth analysis on the formed surfaces was carried out. Critical depth, at which ductile-to-brittle transition in deformation occurs, was assessed for the hard brittle materials. Limits of ductile mode indentation for hard brittle materials were discussed in detail. Variation in the depth of structures in an imprinted mark was studied.

Quantitative Microstructural Analysis of Nanocrystalline Surface Layer Induced by a Modified Cutting Process

2013 ◽  
Vol 769 ◽  
pp. 109-115 ◽  
Author(s):  
Volker Schulze ◽  
Frederik Zanger ◽  
Florian Ambrosy
Keyword(s):  
Surface Layer ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Microstructural Analysis ◽  
Cutting Edge ◽  
Depth Of Cut ◽  
Surface Layers ◽  
Workpiece Material ◽  
Cutting Edge Radius ◽  
Edge Radius

Present work analyzes the influence of process and modified geometry parameters of an orthogonal final machining process (finishing) on the nanocrystalline surface layers generation by quantitative microstructural analysis. Thereby, AISI 4140 (German Steel 42CrMo4) in a state quenched and tempered at 450°C is used as workpiece material. Metallic materials used in technical applications are polycrystalline in nature and are composed of a large number of grains which are separated by grain boundaries. The grain size has a strong influence on the mechanical material properties. Metallic parts with a severe nanocrystalline grain refinement in the near-surface area show many beneficial properties. Such surface layers considerably influence the friction and wear characteristics of the workpiece in a subsequent usage as design elements working under tribological loads due to their extreme superplastic properties. The tribologically induced surface layers formation already starts during the manufacturing of the components, by leading to a change of workpiece material near the surface. Particularly when the depth of cut h becomes of the same order as the cutting edge radius rß, the ploughing process becomes increasingly important and strongly influences the chip formation process. The plastic zone depth within the surface layer is especially influenced by the design of the microgeometry of the cutting tools and increases almost linearly with the ratio of cutting edge radius rß to depth of cut h. The plastic zone is hereby approximately of the same order of magnitude as the cutting edge radius rß. Parameters that are studied and taken into account in the manufacturing process are cutting edge radius rß, depth of cut h and cutting velocity vc. Variations of cutting depth h are performed in a range of 30 to 100 µm and variations of cutting edge radius rß are executed in a range of 30 to 150 µm. The microgeometries of the tools are preconditioned by abrasive grinding with a drag finishing machine and observed by a confocal light microscope. A cutting velocity vc of 25 and 150 m/min is applied. The evaluation of the manufacturing process is carried out by detailed analyses of the microstructural conditions in the surface layer after processing using a Focused Ion Beam system. These material characterizations provide information about the surface engineering concerning the microstructural changes in the workpiece surface layer due to machining. Hereby, the grain size analysis is investigated by a line method based on the characterization of portions of several test-lines positioned across the two dimensional Focused Ion Beam images.

AEM investigation of ZrO2 solid solution formation in ZrO2/mullite composites

1984 ◽  
Vol 42 ◽  
pp. 408-409
Author(s):  
T. R. Dinger
Keyword(s):  
Solid Solution ◽  
Ion Beam ◽  
Analytical Electron Microscopy ◽  
Transformation Toughening ◽  
Solid Solution Formation ◽  
Solution Formation ◽  
Propagating Crack ◽  
Analytical Electron ◽  
Microcrack Toughening ◽  
Made In

Zirconia (ZrO2) is often added to ceramic compacts to increase their toughness. The mechanisms by which this toughness increase occurs are generally accepted to be those of transformation toughening and microcracking. The mechanism of transformation toughening is based on the presence of metastable tetragonal ZrO2 which transforms to the monoclinic allotrope when stressed by a propagating crack. The decrease in volume which accompanies this transformation effectively relieves the applied stress at the crack tip and toughens the material; microcrack toughening arises from the deflection of a propagating crack around sharply angular inclusions.These mechanisms, however, do not explain the toughness increases associated with the class of composites investigated here. Analytical electron microscopy (AEM) has been used to determine whether solid solution effects could be the cause of this increased toughness. Specimens of a mullite (3Al2O3·2SiO2) + 15 vol. % ZrO2 were prepared by the usual technique of mechanical thinning followed by ion beam milling. All observations were made in a Philips EM400 TEM/STEM microscope fitted with EDXS and EELS spectrometers.

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