Effect of Dislocation Core Spreading at Interfaces on Strength of Thin-films

2002 ◽  
Vol 17 (7) ◽  
pp. 1808-1813 ◽  
Author(s):  
Shefford P. Baker ◽  
Lin Zhang ◽  
Huajian Gao

Critical strain arguments are often used to model the thickness dependence of the strength of thin films on substrates. In these arguments, plastic deformation occurs when the stress in a film is high enough that the strain energy relieved by the introduction of a misfit dislocation is sufficient to generate the line energy of that misfit. Such models typically assume compact dislocation cores. However, experimental evidence suggests that, under certain circumstances, dislocation cores may spread out into the interface between the film and the substrate. If this happens, the energy of the misfit dislocation, and the critical stress needed for its propagation, will be lowered. In this paper, the effect of dislocation core spreading on the critical stress has been modeled. The effects of interface strength, film thickness, and misfit dislocation spacing are considered.

Author(s):  
Van-Trang Nguyen ◽  
Minh-Quy Le

We study through molecular dynamics finite element method with Stillinger-Weber potential the uniaxial compression of (0, 24) armchair and (31, 0) zigzag black phosphorene nanotubes with approximately equal diameters. Young's modulus, critical stress and critical strain are estimated with various tube lengths. It is found that under uniaxial compression the (0, 24) armchair black phosphorene nanotube buckles, whereas the failure of the (31, 0) zigzag one is caused by local bond breaking near the boundary.


2014 ◽  
Vol 104 (23) ◽  
pp. 232111 ◽  
Author(s):  
Santino D. Carnevale ◽  
Julia I. Deitz ◽  
John A. Carlin ◽  
Yoosuf N. Picard ◽  
Marc De Graef ◽  
...  

2014 ◽  
Vol 1679 ◽  
Author(s):  
O.G. Súchil ◽  
G. Abadal ◽  
F. Torres

ABSTRACTSelf-powered microsystems as an alternative to standard systems powered by electrochemical batteries are taking a growing interest. In this work, we propose a different method to store the energy harvested from the ambient which is performed in the mechanical domain. Our mechanical storage concept is based on a spring which is loaded by the force associated to the energy source to be harvested [1]. The approach is based on pressing an array of fine wires (fws) grown vertically on a substrate surface. For the fine wires based battery, we have chosen ZnO fine wires due the fact that they could be grown using a simple and cheap process named hydrothermal method [2]. We have reported previous experiments changing temperature and initial pH of the solution in order to determine the best growth [3]. From new experiments done varying the compounds concentration the best results of fine wires were obtained. To characterize these fine wires we have considered that the maximum load we can apply to the system is limited by the linear buckling of the fine wires. From the best results we obtained a critical strain of εc = 3.72 % and a strain energy density of U = 11.26 MJ/m3, for a pinned-fixed configuration [4].


1990 ◽  
Vol 195 ◽  
Author(s):  
T.E. Schlesinger ◽  
A. Gavrin ◽  
R.C. Cammarata ◽  
C.-L. Chien

ABSTRACTThe mechanical properties of sputtered Ni-Al2O3 granular thin films were investigated by low load microharaness testing. It was found that the microhardness of these films displayed a percolation threshold at a nickel volume fraction of about 0.6, below which the hardness is greatly enhanced. This behavior is qualitatively similar to the electrical and magnetic properties of these types of films. A percolation threshold in hardness can be understood as due to a change in the mechanism for plastic deformation.


Crystals ◽  
2018 ◽  
Vol 8 (12) ◽  
pp. 441 ◽  
Author(s):  
Xiao Zhuo ◽  
Jang Kim ◽  
Hyeon Beom

The technique of molecular statics (MS) simulation was employed to determine the crack growth resistance curve of Cu and Ni single crystals. Copper and Ni single crystal nanoplates with an edge crack subjected to a tensile displacement were simulated. Stress-displacement curves and snapshots of the atomic configuration corresponding to different displacement levels were presented to elucidate the deformation mechanism. It was observed that the edge crack propagated step by step in a brittle manner, and the amount of crack growth at each step was half the lattice parameter. Through an energy consideration, the critical strain energy release rate at the onset of crack propagation and the crack growth resistance were calculated. The crack growth resistance is larger than the critical strain energy release rate because of the crack growth effect.


1966 ◽  
Vol 88 (1) ◽  
pp. 82-86 ◽  
Author(s):  
R. G. Forman

This paper presents theoretical studies on the effect of plastic deformation on the strain energy release rate, G, of a plate under uniaxial tension with a central propagating crack. The linear elastic fracture mechanics solution for G is improved by using the Dugdale model for the crack and yielded region to obtain the axial rigidity of the plate. The axial rigidity is then used to obtain the solution for the strain energy release rate as the crack propagates. It is found that plastic deformation has a pronounced effect on G. A correction factor is presented for correcting the linear elastic solution for the strain energy release rate. The correction factor is found to depend upon the nominal (gross) stress to material yield stress ratio and the crack length to plate width ratio.


JOM ◽  
2010 ◽  
Vol 62 (12) ◽  
pp. 44-51 ◽  
Author(s):  
Ralph D. Nyilas ◽  
Stephan Frank ◽  
Ralph Spolenak

1989 ◽  
Vol 167 ◽  
Author(s):  
M. S. Hu

AbstractSolvent induced damage bands formed in residually strained polyimide thin films on different substrates have been studied. Microscopy studies have shown that these bands resemble crazes. A mechanics approach Is taken to understand the band formation phenomenon.The critical strain for damage formation has been identified. This strain decreases with increase in exposure time, but always exhibits a threshold value. In contrast to the cracking of brittle films, the critical strain has only a weak dependence on the film thickness over a wide range. This behavior obtains because the crazing of the polyimide films is nucleation controlled. Strain-enhanced diffusion of solvent into the films is considered to be responsible for the property degradation that leads to damage formation.


1993 ◽  
Vol 308 ◽  
Author(s):  
S.G.H. Anderson ◽  
I.-S. Yeo ◽  
P.S. Ho ◽  
S. Ramaswami ◽  
R. Cheung

ABSTRACTWafer curvature measurements of a trilayer (SiO2 / AlSiCu / Si) structure are compared to that predicted by a weighted sum of individual measurements of SiO2 and AlSiCu films on Si, and significant differences are found to exist for temperatures above 200°C. A straightforward analysis of the stresses in each layer has been modeled using an extension of a model by Feng et al. which assumes uniform plastic deformation throughout the Al. The modeling results suggest a straightforeward method for determining stresses in deformable thin films that are confined by elastic overlayers. A comparison of the stress-temperature behavior for unpassivated and passivated AlSiCu films reveals that the confined films exhibit less plastic deformation and both higher tension and compression during thermal cycling.


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