Bio Organic-Based Gate Dielectric Materials for Thin Film Transistors

2012 ◽  
Vol 1467 ◽  
Author(s):  
James G. Grote ◽  
Fahima Ouchen ◽  
Donna M. Joyce ◽  
Kristi M. Singh ◽  
Narayanan Venkat ◽  
...  

ABSTRACTThe potential of bio-dielectrics for thin film transistor applications was explored via the incorporation of titanium dioxide (TiO2) nanoparticles, rutile form, a high dielectric constant (ε) ceramic, in the deoxyribonucleic acid (DNA) bio-polymer. The DNA-ceramic hybrid films were fabricated from stable suspensions of the TiO2 nanoparticles in viscous, aqueous DNA solutions. Dielectric characterization revealed that the incorporation of TiO2 in DNA resulted in enhanced dielectric constant (14.3 at 1 kHz for 40 wt % TiO2) relative to that of DNA in the entire frequency range of 1 kHz-1 MHz. Variable temperature dielectric measurements, in the 20-80°C range, of the DNA-TiO2 films revealed that the ceramic additive stabilizes DNA against large temperature dependent variations in both ε and the dielectric loss factor tan δ. The bulk resistivity of the DNA-TiO2 hybrid films was measured to be two to three orders of magnitude higher than that of the control DNA films, indicating their potential for utilization as insulating dielectrics in transistor and capacitor applications.

Polymers ◽  
2020 ◽  
Vol 12 (5) ◽  
pp. 1058
Author(s):  
Yang-Yen Yu ◽  
Cheng-Huai Yang

High-transparency soluble polyimide with COOH and fluorine functional groups and TiO2-SiO2 composite inorganic nanoparticles with high dielectric constants were synthesized in this study. The polyimide and inorganic composite nanoparticles were further applied in the preparation of organic-inorganic hybrid high dielectric materials as the gate dielectric for a stretchable transistor. The optimal ratio of organic and inorganic components in the hybrid films was investigated. In addition, Jeffamine D2000 and polyurethane were added to the gate dielectric to improve the tensile properties of the organic thin film transistor (OTFT) device. PffBT4T-2OD was used as the semiconductor layer material and indium gallium liquid alloy as the upper electrode. Electrical property analysis demonstrated that the mobility could reach 0.242 cm2·V−1·s−1 at an inorganic content of 30 wt.%, and the switching current ratio was 9.04 × 103. After Jeffamine D2000 and polyurethane additives were added, the mobility and switching current could be increased to 0.817 cm2·V−1·s−1 and 4.27 × 105 for Jeffamine D2000 and 0.562 cm2·V−1·s−1 and 2.04 × 105 for polyurethane, respectively. Additives also improved the respective mechanical properties. The stretching test indicated that the addition of polyurethane allowed the OTFT device to be stretched to 50%, and the electrical properties could be maintained after stretching 150 cycles.


Coatings ◽  
2020 ◽  
Vol 10 (7) ◽  
pp. 698
Author(s):  
Junan Xie ◽  
Zhennan Zhu ◽  
Hong Tao ◽  
Shangxiong Zhou ◽  
Zhihao Liang ◽  
...  

The high dielectric constant ZrO2, as one of the most promising gate dielectric materials for next generation semiconductor device, is expected to be introduced as a new high k dielectric layer to replace the traditional SiO2 gate dielectric. The electrical properties of ZrO2 films prepared by various deposition methods and the main methods to improve their electrical properties are introduced, including doping of nonmetal elements, metal doping design of pseudo-binary alloy system, new stacking structure, coupling with organic materials and utilization of crystalline ZrO2 as well as optimization of low-temperature solution process. The applications of ZrO2 and its composite thin film materials in metal oxide semiconductor field effect transistor (MOSFET) and thin film transistors (TFTs) with low power consumption and high performance are prospected.


RSC Advances ◽  
2014 ◽  
Vol 4 (36) ◽  
pp. 18493-18502 ◽  
Author(s):  
Jagan Singh Meena ◽  
Min-Ching Chu ◽  
Ranjodh Singh ◽  
Chung-Shu Wu ◽  
Umesh Chand ◽  
...  

Low-temperature process PS-b-PMMA composite film as gate dielectric deposited over plastic substrate, which exhibits high surface energy, high air stability, very low leakage current and better dielectric constant compared to their conventional polymer dielectrics for use in ZnO–TFT applications.


RSC Advances ◽  
2017 ◽  
Vol 7 (78) ◽  
pp. 49353-49360 ◽  
Author(s):  
Jenner H. L. Ngai ◽  
Johnny K. W. Ho ◽  
Rocky K. H. Chan ◽  
S. H. Cheung ◽  
Louis M. Leung ◽  
...  

Micron-size organolead perovskite crystals grown on insulating polymeric surfaces as gate dielectric materials for high performance thin film transistors.


2018 ◽  
Vol 18 (11) ◽  
pp. 7566-7572 ◽  
Author(s):  
Weihua Wu ◽  
Kashif Javaid ◽  
Lingyan Liang ◽  
Jingjing Yu ◽  
Yu Liang ◽  
...  

2008 ◽  
Vol 8 (5) ◽  
pp. 2676-2679 ◽  
Author(s):  
B. J. Park ◽  
J. H. Sung ◽  
J. H. Park ◽  
J. S. Choi ◽  
H. J. Choi

Nanocomposite materials of poly(vinyl acetate) (PVAc) and organoclay were fabricated, in order to be utilized as dielectric materials of the organic thin film transistor (OTFT). Spin coating condition of the nanocomposite solution was examined considering shear viscosity of the composite materials dissolved in chloroform. Intercalated structure of the PVAc/clay nanocomposites was characterized using both wide-angle X-ray diffraction and TEM. Fracture morphology of the composite film on silicon wafer was also observed by SEM. Dielectric constant (4.15) of the nanocomposite materials shows that the PVAc/clay nanocomposites are applicable for the gate dielectric materials.


2006 ◽  
Vol 936 ◽  
Author(s):  
Jinghong Chen ◽  
Mehari Stifanos ◽  
Jan Nedbal ◽  
Ahila Krishnamoorthy ◽  
Emma Brouk ◽  
...  

ABSTRACTWe present recent advances on spin-on polymers as gate dielectric for thin film transistors. We have developed film type I with significantly improved dielectric properties. At a curing temperature of 250 °C, the dielectric constant is 3.46, the breakdown voltage is 4.10 MV/cm at 1 μA/cm2, the leakage current is 4.9 × 10−8 A/cm2 at 2.5 MV/cm, and the CV hysteresis is 3.4 V. At a curing temperature of 425 °C, the dielectric constant, the breakdown voltage, the leakage current, and the CV hysteresis are 3.2, 4.73 MV/cm, 2.6 × 10−8 A/cm2, and 0.44 V respectively.


2010 ◽  
Vol 97 (18) ◽  
pp. 183503 ◽  
Author(s):  
Jang-Yeon Kwon ◽  
Ji Sim Jung ◽  
Kyoung Seok Son ◽  
Kwang-Hee Lee ◽  
Joon Seok Park ◽  
...  

2007 ◽  
Vol 16 (4) ◽  
pp. 1145-1149 ◽  
Author(s):  
Lü Wen ◽  
Peng Jun-Biao ◽  
Yang Kai-Xia ◽  
Lan Lin-Feng ◽  
Niu Qiao-Li ◽  
...  

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