An Initial Investigation of the Electrical and Microstructural Properties of Au/Ti and Au/Pd/Ti Ohmic Contact Structures for AlGaAs/GaAs HBTs

1993 ◽  
Vol 318 ◽  
Author(s):  
Kuldip S. Sandhu ◽  
Anne E. Staton-Bevan ◽  
Bernard M. Henry ◽  
Mark A. Crouch ◽  
Sukhdev S. Gill
Keyword(s):  
Contact Structure ◽  
Contact Structures ◽  
Current Transport ◽  
Microstructural Properties ◽  
Semiconductor Interface ◽  
Diffusion Barrier Layer ◽  
Current Voltage ◽  
Specific Contact ◽  
Thermionic Field Emission ◽  
Contact Resistivities

ABSTRACTThe electrical and microstructural properties of Au/Ti and Au/Pd/Ti contacts to p+-GaAs (C-doped, 5×1018cm−3) were investigated. Current-voltage measurements as a function of temperature showed that the Ohmicity of the Au/Ti contact improved upon annealing. However, the annealed binary contact featured Au spiking into the GaAs making it unsuitable for HBT applications. The addition of a Pd diffusion barrier layer between the Au and Ti metallisation layers prevented spiking, but resulted in a decrease in the Ohmicity of the contact.For all the contact systems it was found that thermionic-field emission dominates the current transport mechanism across the metal-semiconductor interface between the temperature range 198K and 348K. The Au/Pd/Ti contact structure shows HBT potential, however higher epilayer doping levels will be required to produce satisfactory specific contact resistivities.

Current Transport Mechanisms in Au-Free Metallizations for CMOS Compatible GaN HEMT Technology

2020 ◽  
Vol 1004 ◽  
pp. 725-730
Author(s):  
Fabrizio Roccaforte ◽  
Monia Spera ◽  
Salvatore Di Franco ◽  
Raffaella Lo Nigro ◽  
Patrick Fiorenza ◽  
...  
Keyword(s):  
Barrier Height ◽  
Ohmic Contacts ◽  
Specific Contact Resistance ◽  
Current Transport ◽  
Large Area ◽  
Si Substrates ◽  
Ohmic Behavior ◽  
Specific Contact ◽  
Thermionic Field Emission

Gallium nitride (GaN) and its AlGaN/GaN heterostructures grown on large area Si substrates are promising systems to fabricate power devices inside the existing Si CMOS lines. For this purpose, however, Au-free metallizations are required to avoid cross contaminations. In this paper, the mechanisms of current transport in Au-free metallization on AlGaN/GaN heterostructures are studied, with a focus on non-recessed Ti/Al/Ti Ohmic contacts. In particular, an Ohmic behavior of Ti/Al/Ti stacks was observed after an annealing at moderate temperature (600°C). The values of the specific contact resistance ρc decreased from 1.6×104 Ω.cm2 to 7×105 Ω.cm2 with increasing the annealing time from 60 to 180s. The temperature dependence of ρc indicated that the current flow is ruled by a thermionic field emission (TFE) mechanism, with barrier height values of 0.58 eV and 0.52 eV, respectively. Finally, preliminary results on the forward and reverse bias characterization of Au-free tungsten carbide (WC) Schottky contacts are presented. This contact exhibited a barrier height value of 0.82 eV.

High Quality Non-Alloyed Pt Ohmic Contacts to P-Type GaN Using Two-Step Surface Treatment

1999 ◽  
Vol 595 ◽  
Author(s):  
Ja-Soon Jang ◽  
Seong-Ju Park ◽  
Tae-Yeon Seong
Keyword(s):  
Surface Treatment ◽  
Ohmic Contacts ◽  
Specific Contact Resistance ◽  
Transport Mechanisms ◽  
High Quality ◽  
Ammonium Sulfide ◽  
Current Voltage ◽  
Specific Contact ◽  
Thermionic Field Emission ◽  
P Type

AbstractTwo-step surface-treatment is introduced to obtain low resistance Pt contacts to ptype GaN. The first step is performed after the mesa etching process using buffered oxide etch (BOE) and ammonium sulfide [(NH4)2Sx]. This is followed by the second step using BOE. The Pt contact, which was treated sequentially using ultrasonically boiled BOE (10 min) and boiled (NH4)2Sx (10 min), produces a specific contact resistance of 3.0 (±3.8)×10-5 Ωcm2. However, the contact, that was simply BOE-treated, yields 3.1 (±1.1)×10-2 Ωcm2. This indicates that the two-step surface treatment is promising technique for obtaining high quality ohmic contacts to p-GaN. Investigation of the electronic transport mechanisms using current-voltage-temperature (I-V-T) data indicates that thermionic field emission is dominant in the surface-treated Pt contacts.

Comparison of Ni/Au, Pd/Au, and Cr/Au Metallizations for Ohmic Contacts to p-GaN

1996 ◽  
Vol 449 ◽  
Author(s):  
J. T. Trexler ◽  
S. J. Pearton ◽  
P. H. Holloway ◽  
M. G. Mier ◽  
K. R. Evans ◽  
...  
Keyword(s):  
Heat Treatment ◽  
Ohmic Contacts ◽  
Thermionic Emission ◽  
Specific Contact Resistance ◽  
Capping Layer ◽  
Dominant Conduction Mechanism ◽  
Current Voltage ◽  
Structural And Electronic Properties ◽  
Specific Contact ◽  
Thermionic Field Emission

ABSTRACTReactions between electron beam evaporated thin films of Ni/Au, Pd/Au, and Cr/Au on p-GaN with a carrier concentration of 9.8 × 1016 cm−3 were investigated in terms of their structural and electronic properties both as-deposited and following heat treatments up to 600°C (furnace anneals) and 900°C (RTA) in a flowing N2 ambient. Auger electron spectroscopy (AES) depth profiles were used to study the interfacial reactions between the contact metals and the p-GaN. The electrical properties were studied using room temperature current-voltage (1-V) measurements and the predominant conduction mechanisms in each contact scheme were determined from temperature dependent I-V measurements. The metallization schemes consisted of a 500 Å interfacial layer of Ni, Pd, or Cr followed by a 1000 Å capping layer of Au. All schemes were shown to be rectifying as-deposited with increased ohmic character upon heat treatment. The Cr/Au contacts became ohmic upon heating to 900°C for 15 seconds while the other schemes remained rectifying with lower breakdown voltages following heat treatment. The specific contact resistance of the Cr/Au contact was measured to be 4.3×10−1 Ωcm2. Both Ni and Cr have been shown to react with the underlying GaN above 400 °C while no evidence of a Pd:GaN reaction was seen. Pd forms a solid solution with the Au capping layer while both Ni and Cr tend to diffuse through the capping layer to the surface. All contacts were shown to have a combination of thermionic emission and thermionic field emission as their dominant conduction mechanism, depending on the magnitude of the applied reverse bias.

scholarly journals High Quality Non-Alloyed Pt Ohmic Contacts to P-Type GaN Using Two-Step Surface Treatment

2000 ◽  
Vol 5 (S1) ◽  
pp. 521-527
Author(s):  
Ja-Soon Jang ◽  
Seong-Ju Park ◽  
Tae-Yeon Seong
Keyword(s):  
Surface Treatment ◽  
Ohmic Contacts ◽  
Specific Contact Resistance ◽  
Transport Mechanisms ◽  
High Quality ◽  
Ammonium Sulfide ◽  
Current Voltage ◽  
Specific Contact ◽  
Thermionic Field Emission ◽  
P Type

Two-step surface-treatment is introduced to obtain low resistance Pt contacts to p-type GaN. The first step is performed after the mesa etching process using buffered oxide etch (BOE) and ammonium sulfide [(NH4)2Sx]. This is followed by the second step using BOE. The Pt contact, which was treated sequentially using ultrasonically boiled BOE (10 min) and boiled (NH4)2Sx (10 min), produces a specific contact resistance of 3.0 (±3.8)×10−5 Ωcm2. However, the contact, that was simply BOE-treated, yields 3.1 (±1.1)×10−2 Ωcm2. This indicates that the two-step surface treatment is promising technique for obtaining high quality ohmic contacts to p-GaN. Investigation of the electronic transport mechanisms using current-voltage-temperature (I-V-T) data indicates that thermionic field emission is dominant in the surface-treated Pt contacts.

Current Transport in W and WSIX Ohmic Contacts to Ingan and Inn

1997 ◽  
Vol 468 ◽  
Author(s):  
C. B. Vartuli ◽  
S. J. Pearton ◽  
C. R. Abernathy ◽  
J. D. MacKenzie ◽  
M. L. Lovejoy ◽  
...  
Keyword(s):  
Room Temperature ◽  
Ohmic Contacts ◽  
Conduction Mechanism ◽  
Specific Resistance ◽  
Thermionic Emission ◽  
Contact Structures ◽  
Specific Contact Resistance ◽  
Current Transport ◽  
Deposited Metal ◽  
Specific Contact

ABSTRACTThe temperature dependence of the specific contact resistance of W and WSi0.44 contacts on n+ In0.55Ga0.35N and InN was measured in the range -50 °C to 125 °C. The results were compared to theoretical values for different conduction mechanisms, to further elucidate the conduction mechanism in these contact structures. The data indicates the conduction mechanism is field emission for these contact schemes for all but as-deposited metal to InN where thermionic emission appears to be the dominant mechanism. The contacts were found to produce low specific resistance ohmic contacts to InGaN at room temperature, ϱc ∼ 10-7 Ω ·cm2 for W and ϱc of 4× 10-7 Ω ·cm for WSix. InN metallized with W produced ohmic contacts with ϱc ∼ 10-6 Ω ·cm and ϱc ∼ 10-6 Ω ·cm. for WSix at room temperature.

Comparative Study of the Current Transport Mechanisms in Ni2Si Ohmic Contacts on n- and p-Type Implanted 4H-SiC

2014 ◽  
Vol 778-780 ◽  
pp. 665-668 ◽  
Author(s):  
Marilena Vivona ◽  
Giuseppe Greco ◽  
Salvatore di Franco ◽  
Filippo Giannazzo ◽  
Fabrizio Roccaforte ◽  
...  
Keyword(s):  
Temperature Dependence ◽  
Ohmic Contacts ◽  
Electrical Characterization ◽  
Nickel Silicide ◽  
Specific Contact Resistance ◽  
Current Transport ◽  
Specific Contact ◽  
Thermionic Field Emission ◽  
P Type

The knowledge of the temperature behavior of Ohmic contacts is an important issue to understand the device operation. This work reports an electrical characterization as a function of the temperature carried out on nickel silicide (Ni2Si) Ohmic contacts, used both for n-type and p-type implanted 4H-SiC layers. The temperature dependence of the specific contact resistance suggested that a thermionic field emission mechanism dominates the current transport for contacts on p-type material, whereas a current transport by tunneling is likely occurring in the contacts on n-type implanted SiC. Furthermore, from the temperature dependence of the electrical characteristics, the activation energies for Al and P dopants were determined, resulting of 145 meV and 35 meV, respectively. The thermal stability of the electrical parameters has been demonstrated upon a long-term (up to ~100 hours) cycling in the temperature range 200-400°C.

Autonomous Geometrical Mechanics

2018 ◽  
Author(s):  
Peter Mann
Keyword(s):  
Phase Space ◽  
Contact Structure ◽  
Invariant Tori ◽  
Time Dependent ◽  
Contact Structures ◽  
Natural Setting ◽  
Adiabatic Invariance ◽  
Jet Bundle ◽  
Integrability Theorem ◽  
Extended Phase

This chapter examines the structure of the phase space of an integrable system as being constructed from invariant tori using the Arnold–Liouville integrability theorem, and periodic flow and ergodic flow are investigated using action-angle theory. Time-dependent mechanics is formulated by extending the symplectic structure to a contact structure in an extended phase space before it is shown that mechanics has a natural setting on a jet bundle. The chapter then describes phase space of integrable systems and how tori behave when time-dependent dynamics occurs. Adiabatic invariance is discussed, as well as slow and fast Hamiltonian systems, the Hannay angle and counter adiabatic terms. In addition, the chapter discusses foliation, resonant tori, non-resonant tori, contact structures, Pfaffian forms, jet manifolds and Stokes’s theorem.

Current Transport in Ti/Al/Ni/Au Ohmic Contacts to GaN and AlGaN

2007 ◽  
Vol 556-557 ◽  
pp. 1027-1030 ◽  
Author(s):  
Ferdinando Iucolano ◽  
Fabrizio Roccaforte ◽  
Filippo Giannazzo ◽  
A. Alberti ◽  
Vito Raineri
Keyword(s):  
Contact Resistance ◽  
Field Emission ◽  
Ohmic Contacts ◽  
Theoretical Models ◽  
Specific Contact Resistance ◽  
Strong Increase ◽  
Current Transport ◽  
Electrical Characteristics ◽  
Structural And Electrical Properties ◽  
Specific Contact

In this work, the structural and electrical properties of Ti/Al/Ni/Au contacts on n-type Gallium Nitride were studied. An ohmic behaviour was observed after annealing above 700°C. The structural analysis showed the formation of an interfacial TiN layer and different phases in the reacted layer (AlNi, AlAu4, Al2Au) upon annealing. The temperature dependence of the specific contact resistance demonstrated that the current transport occurs through thermoionic field emission in the contacts annealed at 600°C, and field emission after annealing at higher temperatures. By fitting the data with theoretical models, a reduction of the Schottky barrier from 1.21eV after annealing at 600°C to 0.81eV at 800°C was demonstrated, together with a strong increase of the carrier concentration at the interface. The reduction of the contact resistance upon annealing was discussed by correlating the structural and electrical characteristics of the contacts.

Ultra-Low Resistance Ni-Based Contacts to n-InP: the Dependence of Contact Resistivity on the Condition of the Metal-Semiconductor Interface

1993 ◽  
Vol 318 ◽  
Author(s):  
Navid S. Fatemi ◽  
Victor G. Weizer
Keyword(s):  
Deposition Process ◽  
Atomic Ratio ◽  
Contact Resistivity ◽  
Semiconductor Interface ◽  
Near Surface ◽  
Process Use ◽  
Fold Reduction ◽  
Specific Contact ◽  
Order Of Magnitude ◽  
First Time

ABSTRACTNear-theoretical-minimum values of specific contact resistivity, ρc (in the mid-to-low E-8 Ω-cm2 range) have been achieved for Ni-based contacts to moderately doped (2E18 cm−3) n-type InP. In each case these values are an order of magnitude lower than those previously achieved. These ultra-low resistivities are shown to result when the metallurgical interaction rate between the contact metal and the semiconductor is sufficiently reduced. Several methods of reducing the metal-InP reaction rate and thus achieving lowered resistivity values are demonstrated. We show, for instance, that the introduction of a thin (100Å) Au layer at the metal-InP interface retards metal-semiconductor intermixing during sintering and results in a ten-fold reduction in pc. Another method consists of ensuring the perfection of the near-surface InP lattice prior to and during contact deposition process. Use of this technique has enabled us to fabricate, for the first time, Ni-only contacts with pc values in the low E-8 Ω-cm2 range. We present an explanation for these observations that is based upon the magnitude of the In-to-P atomic ratio at the metal-InP interface.

On the non-regularity of tangent sphere bundles

1978 ◽  
Vol 82 (1-2) ◽  
pp. 13-17 ◽  
Author(s):  
David E. Blair
Keyword(s):  
Riemannian Manifold ◽  
Large Class ◽  
Constant Curvature ◽  
Positive Constant ◽  
Contact Structure ◽  
Compact Riemannian Manifold ◽  
Contact Structures ◽  
Sphere Bundle ◽  
Contact Manifolds ◽  
Tangent Sphere

SynopsisClassically the tangent sphere bundles have formed a large class of contact manifolds; their contact structures are not in general regular, however. Specifically we prove that the natural contact structure on the tangent sphere bundle of a compact Riemannian manifold of non-positive constant curvature is not regular.

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