Effects of Annealing on The Structure of Ta2N Thin Films Deposited on Al2O3

1994 ◽  
Vol 357 ◽  
Author(s):  
James E. Angelo ◽  
N.R. Moody ◽  
S.K. Venkataraman ◽  
W.W. Gerberich

AbstractThe microstructure of Ta2N thin films deposited by d.c. magnetron sputtering on (1120) surface of Al2O3 is investigated using transmission electron microscopy. The effects of exposing the thin film structure to a 600°C air environment are also explored. It will be shown that under the standard deposition conditions, stresses exist in the thin film structure which leads to the formation of a textured structure in the as-deposited Ta2N. Exposure of the thin film structure to an air environment transforms the Ta2N to Ta2O5 in the orthorhombic structure. In addition, evidence for a epitaxial relationship between the Ta2O5 and Al2O3 will be presented.

1989 ◽  
Vol 4 (4) ◽  
pp. 755-758 ◽  
Author(s):  
J. Yahalom ◽  
D. F. Tessier ◽  
R. S. Timsit ◽  
A. M. Rosenfeld ◽  
D. F. Mitchell ◽  
...  

Copper/nickel multilayered thin-films prepared by electrodeposition have been examined in cross section by electron energy loss spectroscopy and high-resolution transmission electron microscopy. The results of the examinations provide the first direct experimental evidence of the large composition modulation across successive layers in the thin-film structure and the coherent nature of Cu/Ni interfaces.


Author(s):  
L. Tang ◽  
G. Thomas ◽  
M. R. Khan ◽  
S. L. Duan

Cr thin films are often used as underlayers for Co alloy magnetic thin films, such as Co1, CoNi2, and CoNiCr3, for high density longitudinal magnetic recording. It is belived that the role of the Cr underlayer is to control the growth and texture of the Co alloy magnetic thin films, and, then, to increase the in plane coercivity of the films. Although many epitaxial relationship between the Cr underlayer and the magnetic films, such as ﹛1010﹜Co/ {110﹜Cr4, ﹛2110﹜Co/ ﹛001﹜Cr5, ﹛0002﹜Co/﹛110﹜Cr6, have been suggested and appear to be related to the Cr thickness, the texture of the Cr underlayer itself is still not understood very well. In this study, the texture of a 2000 Å thick Cr underlayer on Nip/Al substrate for thin films of (Co75Ni25)1-xTix dc-sputtered with - 200 V substrate bias is investigated by electron microscopy.


1996 ◽  
Vol 452 ◽  
Author(s):  
U. Klement ◽  
D. Horst ◽  
F. Ernst

AbstractThe objective of this work is to find a material to replace amorphous hydrogenated silicon used as photosensitive part in the “retina” of an “electronic eye”. For that reason, ZnS, ZnSe, CdS and CdSe were chosen for investigations. Thin films, prepared by chemical vapour deposition, were characterized by transmission electron microscopy. The observed microstructures were correlated with the optoelectronic properties of these materials. CdSe was found to be the most promising material for our application. Hence, the influence of a dielectric interlayer and the effects of additional annealing treatments were analyzed for CdSe and will be discussed with respect to the optimization of the material.


2000 ◽  
Vol 6 (S2) ◽  
pp. 462-463
Author(s):  
G. Y. Yang ◽  
V. Nagarajan ◽  
Z. L. Wang ◽  
Y. H. Li ◽  
R. Ramesh

Pb(Mg1/3Nb2/3)O3 (PMN)- and its solid solution with PbTiO3 (PT) is one of the lead-based relaxor ferroelectrics and has been the most widely studied materials because of their high dielectric constants and high electrostrictive coefficients. The potential impact of the thin film ferroelectric relaxors in the integrated actuators and sensing applications has stimulated research on the growth and characterization of thin films. Thin films have been made by pulsed-laser deposition (PLD), sol-gel and metalrganic chemical-vapor deposition. It is known that electrical properties may be strongly influenced by the microstructure of films and the interface structures between different phase in such heterostructure systems. In this paper, we report the investigation of interfacial mismatch and interface structure of epitaxial Pb(Mg1/3Nb2/3)O3 (90%)- PbTiO3 (10%) relaxor thin film by high resolution transmission electron microscopy (HRTEM).Thin film capacitors of Pb(Mg1/3Nb2/3)O3 (90%) - PbTiO3 (10%) (PMN-PT) were grown by PLD on (100)-oriented LaA1O3 (LAO) substrates. La0.5Sr0.5CoO3 (LSCO) layer was deposited as electrode. Cross-sectional transmission electron microscopy samples were prepared following the traditional procedures including cutting, gluing, polishing and ion milling.


1987 ◽  
Vol 108 ◽  
Author(s):  
D. Goyal ◽  
W. Ng ◽  
A. H. King ◽  
J. C. Bilello

ABSTRACTWe have used synchrotron x-ray topographic techniques to study the stresses in thin films formed upon silicon substrates either by evaporation or sputtering. It is found that the film stress generally decreases with increasing film thickness for evaporated films, but film delamination occurs at a well defined film thickness. Transmission electron microscope studies have been performed on the same specimens in order to reveal what mechanisms are involved with the delamination of the films.


1987 ◽  
Vol 104 ◽  
Author(s):  
J. M. Gibson

ABSTRACTThe growth of the epitaxial silicides NiSi2 and CoSi2 on Si is discussed from observations made by in-situ transmission electron microscopy. In particular, we observe the occurrence of epitaxial metastable phases which arise from the dominance of interface energy in extremely thin films. Such phases relate to the thickness dependence of the microstructure in these silicides and may be expected to occur in many binary and more complex thin film systems.


2015 ◽  
Vol 6 ◽  
pp. 336-342 ◽  
Author(s):  
Jacques Perrin Toinin ◽  
Alain Portavoce ◽  
Khalid Hoummada ◽  
Michaël Texier ◽  
Maxime Bertoglio ◽  
...  

In this work a novel process allowing for the production of nanoporous Ge thin films is presented. This process uses the combination of two techniques: Ge sputtering on SiO2 and dopant ion implantation. The process entails four successive steps: (i) Ge sputtering on SiO2, (ii) implantation preannealing, (iii) high-dose dopant implantation, and (iv) implantation postannealing. Scanning electron microscopy and transmission electron microscopy were used to characterize the morphology of the Ge film at different process steps under different postannealing conditions. For the same postannealing conditions, the Ge film topology was shown to be similar for different implantation doses and different dopants. However, the film topology can be controlled by adjusting the postannealing conditions.


2013 ◽  
Vol 845 ◽  
pp. 221-225
Author(s):  
Zulhelmi Alif Abdul Halim ◽  
Muhammad Azizi Mat Yajid ◽  
Zulkifli Mohd Rosli ◽  
Riyaz Ahmad Mohamad Ali

The growth of intermetallic phases in Al/Cu bilayers thin film having 2/3 layer thickness ratios were characterized by X-ray powder diffraction (XRD), energy dispersive X-ray (EDX) and transmission electron microscopy (TEM). In annealing temperature of 200 °C, the growth is controlled by Cu diffusion which resulted to formation of θ-Al2Cu, η-AlCu, ζ-Al3Cu4 and γ-Al4Cu9 phase.


Author(s):  
Shang Hsien Rou

New and interesting physical phenomena are being observed via thin film depositions using a variety of processing techniques in different material systems. The present study describes Pb-Zr-Ti-O pyrochlore thin films which were deposited onto (100) MgO substrates using an ion beam sputtering technique. These films are of interest because of their unique microstructure which may provide valuable information in better understanding the epitaxial growth of thin films. Characterization were performed using conventional transmission electron microscopy (TEM) and high resolution transmission electron microscopy (HRTEM). Special TEM sample preparation procedures have been developed, which will be reported elsewhere.The as-deposited pyrochlore thin film is near epitaxial and is oriented with both (100) and (111) parallel to the (100) of the MgO substrate. Figure 1(a) shows the selected area diffraction pattern (SADP) of the pyrochlore thin film taken parallel to the [100] zone axis of the substrate.


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