Silicon Nitride Tools Coated With Tic Or Tin Composite Diamond Structures

1995 ◽  
Vol 415 ◽  
Author(s):  
W.D. Fan ◽  
K. Jagannadham ◽  
J. Narayan
Keyword(s):  
Vapor Deposition ◽  
Physical Vapor Deposition ◽  
Diamond Films ◽  
Chemical Vapor ◽  
Diamond Coating ◽  
Diamond Coatings ◽  
Adhesion Properties ◽  
Tin Films ◽  
Composite Diamond ◽  
Diamond Paste

ABSTRACTComposite diamond coatings on Si3N4 substrates have been developed to minimize stresses/strains and improve wear and adhesion properties. The coatings consist of a first layer of discontinuous diamond crystallites which are anchored to the Si3N4 substrate by a second interposing layer of TiC or TiN film. A top third layer of continuous diamond film is grown epitaxially on the first layer. The diamond films and TiC or TiN films were deposited using hot filament chemical vapor deposition and laser physical vapor deposition, respectively. The TiC and TiN films were examined by X-ray diffraction. The diamond films were characterized by scanning electron microscopy and Raman spectroscopy. Adhesion of the diamond coatings was investigated using overlap polishing with diamond paste, wear against Al-12.5%Si alloy, and pull-test. The results show that after introducing an interposing layer of TiC or TiN, adhesion of diamond coatings on Si3N4 substrates is improved significantly. After polishing test against diamond paste for 4 hours, only 30% of diamond was retained with single diamond coating while 80% of diamond was found with TiN composite diamond coating. The mechanism of improvement of adhesion is discussed.

Diamond-ceramic composite tool coatings

1994 ◽  
Vol 9 (11) ◽  
pp. 2850-2867 ◽  
Author(s):  
W.D. Fan ◽  
X. Chen ◽  
K. Jagannadham ◽  
J. Narayan
Keyword(s):  
Wear Resistance ◽  
Diamond Film ◽  
Vapor Deposition ◽  
Physical Vapor Deposition ◽  
Thermal Stresses ◽  
Diamond Films ◽  
Chemical Vapor ◽  
Diamond Coatings ◽  
Composite Layers ◽  
Composite Diamond

We have developed multilayer composite diamond coatings with improved adhesion and wear resistance on WC(Co) tool substrates. The coatings consist of a first layer of discontinuous diamond crystallites that are anchored to the WC(Co) substrate by an interposing layer of ceramic films. These films consist of TiC, TiN, SiC, Si3N4 or WC deposited to provide a conformal coverage on the first layer of diamond. A second or final layer of continuous diamond film is deposited to provide the cutting edge of the tool. The diamond film in the composite layers is deposited by hot filament chemical vapor deposition (HFCVD) and the interposing layer is deposited by laser physical vapor deposition (LPVD). The different parameters associated with the deposition of diamond and interposing layers are optimized to improve the adhesion and wear resistance. We have studied the adhesion characteristics by indentation tests in which the critical load for peeling of the diamond films is determined. Adhesion and wear resistance of the films are also tested using an overlap polishing on diamond paste with 5–6 μm particle size. The diamond and interposing layers in the composite are characterized by scanning electron microscopy and Raman spectroscopy. Results of improvement in adhesion and wear resistance are correlated with the quality of the diamond film and the interposing layer. Better accommodation of thermal stresses and strains in the composite layers has been shown to be responsible for improvement in the adhesion and wear resistance of the composite diamond films.

Highly adherent diamond coatings deposited onto WC-Co cemented carbides via barrier interlayers

1998 ◽  
Vol 13 (10) ◽  
pp. 2841-2846 ◽  
Author(s):  
J. M. Lopez ◽  
V. G. Babaev ◽  
V. V. Khvostov ◽  
J. M. Albella
Keyword(s):  
Vapor Deposition ◽  
Chemical Vapor ◽  
Cemented Carbides ◽  
Bonding Layer ◽  
Diamond Coating ◽  
Diamond Coatings ◽  
Diamond Deposition ◽  
Fine Grained ◽  
High Adhesion ◽  
Bond Layer

Diamond coatings have been deposited by plasma enhanced chemical vapor deposition (PCVD) onto WC-Co cemented carbides by use of specially developed barrier interlayers, well compatible with cemented carbides. The barrier interlayer comprises a Ti-based layer adjacent to the substrate, which completely prevents both substrate decarburization and Co diffusion from the substrate, and a diamond-bonding layer needed to obtain high adhesion to the diamond coating. The diamond-bond layer is obtained by seeding the surface with nanograined diamond particles by laser ablation. Diamond deposition under controlled parameters allows one to obtain fine-grained and uniform diamond coatings. The diamond coating obtained in this way has a high adhesion to the cemented carbide substrate due to the enhanced interaction through the nanograined diamond interlayer.

Improvement of Adhesion of Diamond Coatings to WC(CO) Tool Substrates

1994 ◽  
Vol 363 ◽  
Author(s):  
W. D. Fan ◽  
K. Jagannadham ◽  
J. Narayan
Keyword(s):  
Diamond Film ◽  
Vapor Deposition ◽  
Physical Vapor Deposition ◽  
Composite Coatings ◽  
Composite Layer ◽  
Chemical Vapor ◽  
Wear Test ◽  
Ceramic Coatings ◽  
Diamond Coatings ◽  
Composite Layers

AbstractAdhesion of diamond coatings to cutting tool substrates is an important property that is needed to replace the polycrystalline diamond tools (PCD) in machine tool applications. The improvement in adhesion of diamond on WC(Co) tool substrates is brought about by formation of a composite layer. Composite layers made up of TiC or TiN and diamond were formed by laser physical vapor deposition of ceramic coatings and hot filament chemical vapor deposition of diamond films. A first layer of discontinuous diamond film on WC is embedded in the ceramic coatings followed by growth of a continuous diamond film that maintains continuity with the first diamond layer. The composite coatings were characterized by SEM and Raman spectroscopy. Adhesion and wear resistance of the diamond coatings were measured using a polishing wear test. The mechanisms of improvement in adhesion were analyzed by finite element modeling. Results show that TiC composite layers improve the adhesion of diamond coatings significantly. This improvement is considered to arise from the modification of the thermal stress at the interface between the diamond film and the WC(Co) tool substrate.

Growth of Nanocrystalline Diamond Films on Co-Cemented Tungsten Carbide Substrates by Hot Filament CVD

2004 ◽  
Vol 471-472 ◽  
pp. 52-58 ◽  
Author(s):  
Fang Hong Sun ◽  
Zhi Ming Zhang ◽  
H.S. Shen ◽  
Ming Chen
Keyword(s):  
Electron Microscopy ◽  
Surface Roughness ◽  
Raman Spectroscopy ◽  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Diamond Films ◽  
Chemical Vapor ◽  
Nanocrystalline Diamond ◽  
Composite Diamond ◽  
Hot Filament

Nanocrystalline diamond films were deposited on Co-cemented carbide substrates using CH4/H2/Ar gas mixture by hot filament chemical vapor deposition (HFCVD) technique. The evidence of nanocrystallinity, smoothness and purity was obtained by characterizing the sample with scanning electron microscopy (SEM), X-ray diffraction (XRD), Raman spectroscopy, atomic force microscopy (AFM), high-resolution transmission electron microscopy (HR-TEM) and selected-area electron diffraction (SAED). A new process was used to deposit composite diamond films by a two-step chemical vapor deposition procedure including first the deposition of the rough polycrystalline diamond and then the smooth fine-grained nanocrystalline diamond. The results show that the film consists of nanocrystalline diamond grains with sizes range from 20 to 80 nm. The Raman spectroscopy, XRD pattern, HR-TEM image and SAED pattern of the films indicate the presence of nanocrystalline diamond. Surface roughness is measured as Ra<100nm by AFM. Smooth nanocrystalline diamond layers can be deposited on conventional microcrystalline diamond layers using a two-step chemical vapor deposition by regulating the deposition parameters. These composite diamond films with the multiplayer (nanocrystalline/microcrystalline) structure have low surface roughness and high adhesive strength on WC-Co substrates. The diamond-coated tools and drawing dies with these composite coatings display excellent performances in the practical application.

Chemical Vapor Deposition of TiN for Sub-0.5 μm ULSI Circuits

MRS Bulletin ◽  
1995 ◽  
Vol 20 (11) ◽  
pp. 38-41 ◽  
Author(s):  
M. Eizenberg
Keyword(s):  
Diffusion Barrier ◽  
Vapor Deposition ◽  
Physical Vapor Deposition ◽  
Low Cost ◽  
Chemical Vapor ◽  
Barrier Properties ◽  
Antireflection Coating ◽  
Barrier Material ◽  
Tin Films ◽  
Aspect Ratios

Titanium nitride (TiN) has been recognized as an excellent barrier material in various metallization structures of advanced microelectronic devices. TiN serves as a nucleation/glue layer as well as a barrier against WF6 attack in W plug filling. It serves as a diffusion barrier during or after high-temperature Al reflow processing for contact and via filling. TiN is considered as a diffusion-barrier material for Cu metallization as well. In addition, it is utilized as an antireflection coating layer, especially on top of Al, an application that will not be discussed in this article.TiN films must conform to the extreme topographies used in devices in order to guarantee void-free plug formation as well as Jow junction leakage. This should be achieved with the thinnest films possible in order to reduce interconnect stack thickness and to lower contact or via resistance. (The TiN resistivity is higher than that of the other components of the metallization—Ti, Al, or W.) In addition, the good barrier properties must be retained following various thermal cycles used in multilevel metallization. Finally, the metallization must be manufacturing-worthy, namely, it should be reliable and reproducible, it should have a very low particle content, and it should have a low cost of ownership.At present, TiN is mainly deposited by physical vapor deposition (PVD) via reactive sputtering. However, the poor conformality of sputtered TiN films over extreme topography limits the use of this deposition technique for deep sub-0.5 μm applications, especially those with features that have high aspect ratios.

DIAMOND DEPOSITION ON WC/Co ALLOY WITH A MOLYBDENUM INTERMEDIATE LAYER

2005 ◽  
Vol 12 (04) ◽  
pp. 499-504
Author(s):  
SHA LIU ◽  
ZHI-MING YU ◽  
DAN-QING YI
Keyword(s):  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Intermediate Layer ◽  
Diamond Films ◽  
Chemical Vapor ◽  
Cvd Diamond ◽  
Diamond Growth ◽  
Diamond Coatings ◽  
Sputter Deposited ◽  
Diamond Grain

It is known that in the condition of chemical vapor deposition (CVD) diamond process, molybdenum is capable of forming carbide known as the "glue" which promotes growth of the CVD diamond, and aids its adhesion by (partial) relief of stresses at the interface. Furthermore, the WC grains are reaction bonded to the Mo 2 C phase. Therefore, molybdenum is a good candidate material for the intermediate layer between WC–Co substrates and diamond coatings. A molybdenum intermediate layer of 1–3 μm thickness was magnetron sputter-deposited on WC/Co alloy prior to the deposition of diamond coatings. Diamond films were deposited by hot filament chemical vapor deposition (HFCVD). The chemical quality, morphology, and crystal structure of the molybdenum intermediate layer and the diamond coatings were characterized by means of SEM, EDX, XRD and Raman spectroscopy. It was found that the continuous Mo intermediate layer emerged in spherical shapes and had grain sizes of 0.5–1.5 μm after 30 min sputter deposition. The diamond grain growth rate was slightly slower as compared with that of uncoated Mo layer on the WC–Co substrate. The morphologies of the diamond films on the WC–Co substrate varied with the amount of Mo and Co on the substrate. The Mo intermediate layer was effective to act as a buffer layer for both Co diffusion and diamond growth.

Adherent diamond coating deposited on Ti by ultrasonic after carbonization pretreatment

2019 ◽  
pp. 095440541988478
Author(s):  
Jiye Gao ◽  
Feng Xu ◽  
Zhenyu Ma ◽  
Lili Shi ◽  
Xue Wang ◽  
...  
Keyword(s):  
Chemical Vapor Deposition ◽  
Titanium Carbide ◽  
Vapor Deposition ◽  
Film Growth ◽  
High Surface ◽  
Chemical Vapor ◽  
Porous Titanium ◽  
Diamond Coating ◽  
Diamond Coatings ◽  
Hot Filament

The adhesion of wear-resistant diamond coating deposited on titanium was weakened by the porous titanium carbide interlayer, which was formed before film growth. In order to enhance substrate-coating adherence, a new pretreatment method was presented: Ti substrates were carbonized by hot filament chemical vapor deposition system, and then the carbonized substrates were ultrasonically vibrated using diamond micro-powder suspension. Diamond coatings were deposited by hot filament chemical vapor deposition as well. The effect of carbonization time on adhesion was investigated. The carbonized substrates and the interface between diamond coatings and substrates were characterized. The results showed that as the carbonization time increases, porous structures and cracks appear and increase on the surface of the substrate. The carbonized substrates possess high surface energy and thus the nucleation is promoted. After deposition, a dense and thin titanium carbide was observed. Ultrasonic after carbonization pretreatment can significantly enhance the adhesion of Ti-based diamond coatings by promoting nucleation and suppressing the formation of porous titanium carbide.

A Comparative Study of Residual Stresses in Single and Multilayer Composite Diamond Coatings

1997 ◽  
Vol 505 ◽  
Author(s):  
K. Jagannadham ◽  
T. R. Watkins
Keyword(s):  
Residual Stresses ◽  
Diamond Films ◽  
Chemical Vapor ◽  
Diamond Coatings ◽  
Ray Method ◽  
X Ray ◽  
Molybdenum Substrate ◽  
Composite Diamond ◽  
Hot Filament ◽  
Mechanisms Of Adhesion

ABSTRACTResidual stresses in four types of diamond films deposited by hot filament chemical vapor deposition on molybdenum substrate, three types on tungsten carbide or silicon nitride substrate are measured. Residual stresses are determined by X-ray method and Raman spectroscopy. The results from both these techniques are compared and conclusions are made on the mechanisms of adhesion of diamond films to the different substrates.

Residual Stresses in Single and Multilayer Composite Diamond Coatings

1996 ◽  
Vol 458 ◽  
Author(s):  
K. Jagannadham ◽  
T. R. Watkims ◽  
J. Narayan
Keyword(s):  
Residual Stresses ◽  
Single Layer ◽  
Chemical Vapor ◽  
Diamond Coating ◽  
Diamond Coatings ◽  
X Ray Diffraction ◽  
X Ray ◽  
Different Types ◽  
Composite Diamond ◽  
Hot Filament

ABSTRACTResidual stresses were measured in different types of diamond coatings deposited onto molybdenum substrates by hot filament chemical vapor deposition. The types of coatings examined include a continuous single layer diamond coating and a continuous multilayer diamond composite coating with an aluminum nitride embedding layer. The stresses were determined by X-ray diffraction and Raman spectroscopy and compared.

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