Time Dependent Deformation During Indentation Testing

1996 ◽  
Vol 436 ◽  
Author(s):  
B. N. Lucas ◽  
W. C. Oliver ◽  
G. M. Pharr ◽  
J-L. Loubet

AbstractConstant loading rate/load indentation tests (1/P dP/dt) and constant rate of loading followed by constant load (CRL/Hold) indentation creep tests have been conducted on high purity electropolished indium. It is shown that for a material with a constant hardness as a function of depth, a constant (1/P dP/dt) load-time history results in a constant indentation strain rate (1/h dh/dt). The results of the two types of tests are discussed and compared to data in the literature for constant stress tensile tests. The results from the constant (1/P dP/dt) experiments appear to give the best correlation to steady-state uniaxial data.

1992 ◽  
Vol 7 (3) ◽  
pp. 627-638 ◽  
Author(s):  
V. Raman ◽  
R. Berriche

Constant load creep experiments were conducted using a depth-sensing indentation instrument with indentation depths in the submicron range. Experiments were conducted on polycrystalline Sn and sputtered Al films on Si substrates. The results show that the plastic depth versus time curves and the strain rate versus stress plots from these experiments are analogous to those obtained from conventional creep experiments using bulk specimens. The value of the stress exponent for Sn is close to the reported values from uniaxial creep tests. Tests on Al films showed that the stress exponent is dependent on the indentation depth and is governed by the proximity to the film/substrate interface. Load change experiments were also performed and the data from these tests were analyzed. It is concluded that indentation creep experiments may be useful in elucidating the deformation properties of materials and in identifying deformation mechanisms.


Geosciences ◽  
2019 ◽  
Vol 9 (2) ◽  
pp. 79 ◽  
Author(s):  
Christopher Thom ◽  
David Goldsby

Previous deformation experiments on halite have collectively explored different creep mechanisms, including dislocation creep and pressure solution. Here, we use an alternative to conventional uniaxial or triaxial deformation experiments—nanoindentation tests—to measure the hardness and creep behavior of single crystals of halite at room temperature. The hardness tests reveal two key phenomena: (1) strain rate-dependent hardness characterized by a value of the stress exponent of ~25, and (2) an indentation size effect, whereby hardness decreases with increasing size of the indents. Indentation creep tests were performed for hold times ranging from 3600 to 106 s, with a constant load of 100 mN. For hold times longer than 3 × 104 s, a transition from plasticity to power-law creep is observed as the stress decreases during the hold, with the latter characterized by a value of the stress exponent of 4.87 ± 0.91. An existing theoretical analysis allows us to directly compare our indentation creep data with dislocation creep flow laws for halite derived from triaxial experiments on polycrystalline samples. Using this analysis, we show an excellent agreement between our data and the flow laws, with the strain rate at a given stress varying by less than 5% for a commonly used flow law. Our results underscore the utility of using nanoindentation as an alternative to more conventional methods to measure the creep behavior of geological materials.


2016 ◽  
Vol 32 (6) ◽  
pp. 717-724 ◽  
Author(s):  
W. Wu ◽  
F. Qin ◽  
T. An ◽  
P. Chen

AbstractThrough-Silicon-Via (TSV) is considered to be the most potential solution for 3D electronic packaging, and the mechanical properties of TSV-Cu are critical for TSV reliability improving. In this paper, to make deeply understand the creep behavior of TSV-Cu, nanoindentation creep tests were conducted to obtain its creep parameters. At first, the TSV specimens were fabricated by means of a typical TSV manufacturing process. Then a combination programmable procedure of the constant indentation strain rate method and the constant load method was employed to study the creep behavior of TSV-Cu. To understand the influence of the previous loading schemes, including the different values of the indentation strain and the maximum depths, the nanoindentation creep tests under different loading conditions were conducted. The values of creep strain rate sensitivity m were derived from the corresponding displacement-holding time curves, and the mean value of m finally determined was 0.0149. The value of m is considered no obvious correlation with the different indentation strain rates and the maximum depths by this method. Furthermore, the mechanism for the room temperature creep was also discussed, and the grain boundaries might play an significant role in this creep behavior.


2003 ◽  
Vol 17 (08n09) ◽  
pp. 1608-1614
Author(s):  
Jin Hak Kim ◽  
Tatsuo Tabaru ◽  
Hisatoshi Hirai

Niobium-base in-situ composite Nb-18Si-5Mo-5Hf-2C (in mol%) was prepared and heat-treated at 2070 K for 20 hour. The uni-axile tensile tests at high temperature ranges and the constant load tensile creep tests at 1570 K were performed. The specimen tensile-tested at 1470 K exhibited the excellent UTS of 450 MPa, and the brittle to ductile transition temperature is between 1470 and 1670 K. The specimens creep tested showed good creep strength; the stress exponent is about 5. The tensile fracture surface of the in-situ composite is complex and attributed to cleavage of the Nb 5 Si 3, Nb ss / Nb 5 Si 3 interface separation, ductile rupture of the Nb ss and correlations of these. On the otherhand, the fracture surface of creep tested consists of intergranular above 150 MPa and transgranular below 120 MPa with severely deformed Nb ss .


2003 ◽  
Vol 795 ◽  
Author(s):  
Ming Dao ◽  
Hidenari Takagi ◽  
Masami Fujiwara ◽  
Masahisa Otsuka

ABSTRACT:Detailed finite-element computations and carefully designed indentation creep experiments were carried out in order to establish a robust and systematic method to accurately extract creep properties during indentation creep tests. Finite-element simulations confirmed that, for a power law creep material, the indentation creep strain field is indeed self-similar in a constant-load indentation creep test, except during short transient periods at the initial loading stage and when there is a deformation mechanism change. Self-similar indentation creep leads to a constitutive equation from which the power-law creep exponent, n, the activation energy for creep, Qc and so on can be evaluated robustly. Samples made from an Al-5.3mol%Mg solid solution alloy were tested at temperatures ranging from 573 K to 773 K. The results are in good agreement with those obtained from conventional uniaxial creep tests in the dislocation creep regime.


Author(s):  
Mauro M. de Oliveira ◽  
Antônio A. Couto ◽  
Gisele F. C. Almeida ◽  
Danieli A. P. Reis ◽  
Nelson B. de Lima ◽  
...  

Abstract: The Inconel 625 is a nickel-based alloy has been widely used in the high-temperature application. The Inconel 625 exhibits unstable plastic flow at elevated temperature characterized by serrated yielding, known as Portevin-Le Chatelier effect. The aim of this work is to evaluate the mechanical properties at high temperatures of the Inconel 625. The tensile tests were performed in the temperature range of room temperature until 1000 °C and strain rate of 2x10^-4 to 2x10^-3 s^-1. The creep tests were performed in the temperature range of 600-700 °C, in the stress range of 500-600 MPa in a constant load mode. The surface fracture was observed by optical and scanning electron microscopy. Serrated stress-strain behavior was observed in the curves obtained at 200 to 700 °C, which was associated with the dynamic strain aging effect. The yield strength and the elongation values show an anomalous behavior as a function of the test temperature. An intergranular cracking was observed specimen tensile tested at 500 °C that can be attributed to the decohesion of the carbides along the grain boundaries. The fracture surface of the specimen tensile tested at 700 °C showed the predominance of transgranular cracking with tear dimples with a parabolic shape.


2005 ◽  
Vol 20 (8) ◽  
pp. 2094-2100 ◽  
Author(s):  
Michelle L. Oyen

Elastic-viscoelastic correspondence, utilizing Boltzmann integral operators, was used to generate displacement–time solutions for spherical indentation testing of viscoelastic materials. Solutions were found for creep following loading at a constant loading rate and compared with step-loading solutions. Experimental creep tests were performed with different loading rate–peak load level combinations on glassy and rubbery polymeric materials. The experimental data were fit to the spherical indentation ramp–creep solutions to obtain values of shear modulus and time-constants; good agreement was found between the experimental results and known modulus values. A multiple ramp-and-hold protocol was examined for the measurement of creep responses at several loads (and depths) within the same test. Emphasis is given to the use of multiple experiments (or multiple levels within a single experiment) to test a priori assumptions made in the correspondence solutions regarding linear viscoelastic material behavior and the creep function.


1999 ◽  
Vol 14 (10) ◽  
pp. 4075-4086 ◽  
Author(s):  
S. Shimizu ◽  
T. Yanagimoto ◽  
M. Sakai

The indentation load P versus depth h curves are examined to investigate the time-dependent surface deformation of viscoelastic materials. The viscoelastic P–h curves significantly depend on the temperature of measurement and the penetration rate of indentation. Sneddon's elastic solution of a conical indentation is extended to a viscoelastic one for a conical or a pyramidal indentation in terms of the hereditary integral. Several types of viscoelastic problems are discussed in relation to the test techniques and analyses for determining the relaxation modulus E(t) and the creep compliance D(t). The superposition rules of time–temperature, penetration depth–temperature, and penetration depth–penetration rate are examined. The viscoelastic indentation tests (constant rate penetration test and constant load creep test) of amorphous Se are conducted at temperatures from 10 to 42 °C. The theoretical considerations and the test results encourage pyramidal indentation as an efficient microprobe for the viscoelastic characterization, in particular, of extremely small-size test specimens and ceramic, metal, and polymer thin films coated on substrate.


1990 ◽  
Vol 188 ◽  
Author(s):  
V. Raman ◽  
R. Berriche

ABSTRACTTin films were deposited on silicon substrates by RF diode sputtering and the growth behavior of these films were characterized by scanning electron microscopy. The time dependent plastic flow behavior in these films were examined by performing indentation tests using a dcpth-scnsing hardness testing machine. Individual indentation experiments with different constant load segments were conducted and the creep characteristics of both sputtered films and bulk Sn were examined. The stress exponents determined from these tests were compared with those determined for bulk Sn from conventional creep tests. The influence of the substrate material on the creep properties of the film are described.


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