scholarly journals Nanoindentation Studies of Plasticity and Dislocation Creep in Halite

Geosciences ◽  
2019 ◽  
Vol 9 (2) ◽  
pp. 79 ◽  
Author(s):  
Christopher Thom ◽  
David Goldsby

Previous deformation experiments on halite have collectively explored different creep mechanisms, including dislocation creep and pressure solution. Here, we use an alternative to conventional uniaxial or triaxial deformation experiments—nanoindentation tests—to measure the hardness and creep behavior of single crystals of halite at room temperature. The hardness tests reveal two key phenomena: (1) strain rate-dependent hardness characterized by a value of the stress exponent of ~25, and (2) an indentation size effect, whereby hardness decreases with increasing size of the indents. Indentation creep tests were performed for hold times ranging from 3600 to 106 s, with a constant load of 100 mN. For hold times longer than 3 × 104 s, a transition from plasticity to power-law creep is observed as the stress decreases during the hold, with the latter characterized by a value of the stress exponent of 4.87 ± 0.91. An existing theoretical analysis allows us to directly compare our indentation creep data with dislocation creep flow laws for halite derived from triaxial experiments on polycrystalline samples. Using this analysis, we show an excellent agreement between our data and the flow laws, with the strain rate at a given stress varying by less than 5% for a commonly used flow law. Our results underscore the utility of using nanoindentation as an alternative to more conventional methods to measure the creep behavior of geological materials.

1992 ◽  
Vol 7 (3) ◽  
pp. 627-638 ◽  
Author(s):  
V. Raman ◽  
R. Berriche

Constant load creep experiments were conducted using a depth-sensing indentation instrument with indentation depths in the submicron range. Experiments were conducted on polycrystalline Sn and sputtered Al films on Si substrates. The results show that the plastic depth versus time curves and the strain rate versus stress plots from these experiments are analogous to those obtained from conventional creep experiments using bulk specimens. The value of the stress exponent for Sn is close to the reported values from uniaxial creep tests. Tests on Al films showed that the stress exponent is dependent on the indentation depth and is governed by the proximity to the film/substrate interface. Load change experiments were also performed and the data from these tests were analyzed. It is concluded that indentation creep experiments may be useful in elucidating the deformation properties of materials and in identifying deformation mechanisms.


2016 ◽  
Vol 32 (6) ◽  
pp. 717-724 ◽  
Author(s):  
W. Wu ◽  
F. Qin ◽  
T. An ◽  
P. Chen

AbstractThrough-Silicon-Via (TSV) is considered to be the most potential solution for 3D electronic packaging, and the mechanical properties of TSV-Cu are critical for TSV reliability improving. In this paper, to make deeply understand the creep behavior of TSV-Cu, nanoindentation creep tests were conducted to obtain its creep parameters. At first, the TSV specimens were fabricated by means of a typical TSV manufacturing process. Then a combination programmable procedure of the constant indentation strain rate method and the constant load method was employed to study the creep behavior of TSV-Cu. To understand the influence of the previous loading schemes, including the different values of the indentation strain and the maximum depths, the nanoindentation creep tests under different loading conditions were conducted. The values of creep strain rate sensitivity m were derived from the corresponding displacement-holding time curves, and the mean value of m finally determined was 0.0149. The value of m is considered no obvious correlation with the different indentation strain rates and the maximum depths by this method. Furthermore, the mechanism for the room temperature creep was also discussed, and the grain boundaries might play an significant role in this creep behavior.


2003 ◽  
Vol 795 ◽  
Author(s):  
Ming Dao ◽  
Hidenari Takagi ◽  
Masami Fujiwara ◽  
Masahisa Otsuka

ABSTRACT:Detailed finite-element computations and carefully designed indentation creep experiments were carried out in order to establish a robust and systematic method to accurately extract creep properties during indentation creep tests. Finite-element simulations confirmed that, for a power law creep material, the indentation creep strain field is indeed self-similar in a constant-load indentation creep test, except during short transient periods at the initial loading stage and when there is a deformation mechanism change. Self-similar indentation creep leads to a constitutive equation from which the power-law creep exponent, n, the activation energy for creep, Qc and so on can be evaluated robustly. Samples made from an Al-5.3mol%Mg solid solution alloy were tested at temperatures ranging from 573 K to 773 K. The results are in good agreement with those obtained from conventional uniaxial creep tests in the dislocation creep regime.


1993 ◽  
Vol 115 (2) ◽  
pp. 200-203 ◽  
Author(s):  
Z. Xia ◽  
F. Ellyin

Constant strain-rate plastic straining followed by creep tests were conducted to investigate the effect of prior plastic straining on the subsequent creep behavior of 304 stainless steel at room temperature. The effects of plastic strain and plastic strain-rate were delineated by a specially designed test procedure, and it is found that both factors have a strong influence on the subsequent creep deformation. A creep model combining the two factors is then developed. The predictions of the model are in good agreement with the test results.


2007 ◽  
Vol 546-549 ◽  
pp. 509-511
Author(s):  
Ying Ying Zhong ◽  
Shu Fang Xu ◽  
Xin Ming Zhang ◽  
Tian Cai Guo ◽  
Yun Lai Deng

Nano-indentation technique was used to survey creep stress exponent of ZM6 (Mg-2.8Nd-0.7Zn-0.6Zr) alloy at room temperature. The results showed that average press creep stress exponent of ZM6 alloy was about 89.75, and independent of strain rate and hardness, which has been verified by linear relationship of the double logarithmic plots between strain rate ( ε& ) and hardness (H ) measured by a nano-indentation equipment with constant load of 500mN.


2007 ◽  
Vol 353-358 ◽  
pp. 533-536
Author(s):  
Bong Min Song ◽  
Jong Yup Kim ◽  
Joon Hyun Lee

Creep testing of Alloy 718 has been carried out at various loads in the temperature range near 650°C in constant load control mode in order to understand how to predict the creep behavior including tertiary creep. The test results have been used for evaluating the existed models, such as Theta projection and Omega method that have been widely used for predicting long term creep strain and rupture time. After determining variables and material parameters of each method with the test results, estimated creep data from each model have been compared with the each measured creep data from the creep tests. The root cause of the discrepancy between estimated and measured data has been analyzed in order to improve the existed methods. The reliability of the improved model has been evaluated in relation to creep data.


1996 ◽  
Vol 436 ◽  
Author(s):  
B. N. Lucas ◽  
W. C. Oliver ◽  
G. M. Pharr ◽  
J-L. Loubet

AbstractConstant loading rate/load indentation tests (1/P dP/dt) and constant rate of loading followed by constant load (CRL/Hold) indentation creep tests have been conducted on high purity electropolished indium. It is shown that for a material with a constant hardness as a function of depth, a constant (1/P dP/dt) load-time history results in a constant indentation strain rate (1/h dh/dt). The results of the two types of tests are discussed and compared to data in the literature for constant stress tensile tests. The results from the constant (1/P dP/dt) experiments appear to give the best correlation to steady-state uniaxial data.


10.30544/101 ◽  
2015 ◽  
Vol 21 (2) ◽  
pp. 115-126 ◽  
Author(s):  
Mohsen Yousefi ◽  
Mehdi Dehnavi ◽  
S.M. Miresmaeili

The effects of 1.5, 2.5 and 3.5 wt.% Cu additions on the microstructure and creep behavior of the as-cast Al-9Si alloy were investigated by impression tests. The tests were performed at temperature ranging from 493 to 553 K and under punching stresses in the range 300 to 414 MPa for dwell times up to 3000 seconds. The results showed that, for all loads and temperatures, the Al–9Si–3.5Cu alloy had the lowest creep rates and thus, the highest creep resistance among all materials tested. This is attributed to the formation of hard intermetallic compound of Al2Cu, and higher amount of α-Al2Cu eutectic phase. The stress exponent and activation energy are in the ranges of 5.2- 7.2 and 115 -150 kJ/ mol, respectively for all alloys. According to the stress exponent and creep activation energies, the lattice and pipe diffusion- climb controlled dislocation creep were the dominant creep mechanism.


2019 ◽  
Vol 141 (4) ◽  
Author(s):  
Aditya Gokhale ◽  
R. Sarvesha ◽  
Rajesh Prasad ◽  
Sudhanshu S. Singh ◽  
Jayant Jain

Abstract The study presents the anisotropy in the indentation creep response of zinc. Indentation creep tests were conducted on grains with three different orientations, namely, 〈0001〉, ⟨112¯0⟩, and ⟨101¯0⟩. Indentation creep along the 〈c〉 axis showed a pronounced creep exhibiting a 25% higher creep displacement as compared with indentation perpendicular to the 〈c〉 axis. However, the recovery observed was the highest for basal-oriented grains wherein a recovery of 50% to its indented depth was observed, whereas for ⟨112¯0⟩ the recovery observed was 30%. The stress exponent, n, was obtained by employing two different approaches for each of the orientations and a difference in the stress exponent value was also observed, highlighting the anisotropic creep response. Basal and non-basal oriented grains showed a lower (n ≅ 1.6) and higher stress exponent (n ≅ 5), respectively, highlighting the different operable creep mechanism. Surface topography using atomic force microscope (AFM) revealed twinning and sink-in for ⟨112¯0⟩ and ⟨101¯0⟩, whereas uniform pile up was observed for basal grain.


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