Mechanical Properties of Ga1–xInxAs

1985 ◽  
Vol 53 ◽  
Author(s):  
S. Guruswamy ◽  
J.P. Hirth ◽  
K.T. Faber

ABSTRACTSubstantial solid solution strengthening of GaAs by In acting as InAs4 units has recently been predicted. This strengthening could account for the reduction of dislocation density in GaAs single crystals grown from the melt. High temperature hardness measurements up to 700ºC have been carried out on (100) GaAs and Ga0.9975 In0.0025 As wafers. Results show a significant strengthening effect in In—doped GaAs even at concentration levels of about 0.2 wt%. A temperature independent flow stress region is observed for both these alloys. The In—doped GaAs shows ahigher plateau stress level compared to the undoped GaAs. The results are consistent with the solid solution strengthening model.

1994 ◽  
Vol 364 ◽  
Author(s):  
Tohru Takahashi ◽  
Tadashi Hasegawa

AbstractTwo types of aluminum–titanium–iron–vanadium ( Al–Ti–Fe–V ) quarternary intermetallic compounds have been prepared by arc melting under argon atmosphere. Their compositions were nominally Al66Ti25Fe6V3 and Al66Ti25Fe3V6. These alloys are based on the iron–modified titanium trialuminide with L12 cubic structure. Vanadium addition up to about 6 mol% did not destroy the cubic symmetry, and L12 solid solution compounds were produced in these two Al–Ti–Fe–V quarternary alloys. Microstructure and mechanical properties have been investigated. It has been demonstrated that vanadium addition to iron–modified L12 titanium trialuminides can enhance their strength.


Author(s):  
Jing Wu ◽  
Mohammad S. Alam ◽  
KM Rafidh Hassan ◽  
Jeffrey C. Suhling ◽  
Pradeep Lall

Abstract Microstructural evolution occurs in lead free Sn-Ag-Cu (SAC) solder joints exposed to isothermal aging. Such changes lead to degradations in the mechanical properties and creep behavior of the solder, and can result in dramatic reductions in the board level reliability of lead-free electronic assemblies subjected to aging. In our recent research, Scanning Electron Microscopy (SEM) has been used to: (1) monitor aging induced microstructural changes occurring within fixed regions in selected lead-free solder joints, (2) create time-lapse imagery of the microstructure evolution, and (3) analyze the microstructural changes quantitatively and correlate to the observed mechanical behavior evolution. This approach has removed the limitations of many prior studies where aged and non-aged microstructures were taken from two different samples and could only be qualitatively compared. In our current study, the microstructural evolutions were observed in SAC305 (96.5Sn-3.0Ag-0.5Cu) and SAC_Q (SAC+Bi) exposed to isothermal conditions at T = 100 °C and 125 °C for several different regions from several different joints. The microstructures in several fixed regions of interest were recorded after predetermined time intervals of aging, which were 1 hour (up to 270 hours) and 250 hours (up to 7000 hours) for the long-term aging samples. The aging induced changes in microstructure have been correlated with the changes in mechanical behavior measured using uniaxial tensile testing. The area and diameter of each IMC particle were tracked during the aging process using the recorded images and imaging processing software. As expected, the analysis of the evolving SAC305 and SAC+X microstructures showed a significant amount of diffusion of silver and bismuth in the beta-tin matrix during aging. In particular, Ag3Sn particles coalesced during aging leading to a decrease in the number of particles. Any bismuth in the SAC+X microstructure was observed to quickly go into solution, resulting in solid solution strengthening. This primary occurred within the beta-Sn dendrites, but also in the Ag3Sn intermetallic rich regions between dendrites. The presence of bismuth in was also found to slow the diffusion process that coarsens the Ag3Sn IMC particles. The combination solid solution strengthening and a lower diffusion rate for Ag lead to reduced aging effects in the SAC+Bi alloy relative to the SAC305 solder alloy. The SAC_Q alloy was found to have significantly better high temperature mechanical properties relative to SAC305 at all prior aging conditions. In particular, the initial modulus and ultimate tensile strength of SAC305 experienced large degradations during high temperature aging, whereas the same properties of SAC_Q changed only slightly. These changes in mechanical behavior correlated well with the observed increases in the average IMC particle diameter and decreases in the number of IMC particles. The microstructural and material property degradations were especially large for SAC305 during the initial 50 hours of aging.


1986 ◽  
Vol 1 (1) ◽  
pp. 60-67 ◽  
Author(s):  
S. C. Huang ◽  
C. L. Briant ◽  
K.-M. Chang ◽  
A. I. Taub ◽  
E. L. Hall

The effect of carbon on the mechanical properties of ordered, face-center-cubic Ni3Al has been studied. It has been found that carbon provides no ductihzation to the intermetallic compound, but exerts a large solid solution strengthening effect. The strengthening rate measured is Δσy/ΔC∼0.5G per atom percent carbon, where G is the Ni3Al shear modulus. Auger analysis and lattice parameter measurements were also carried out. The results are discussed with respect to the nature of carbon in grain boundary regions and in the bulk.


Entropy ◽  
2020 ◽  
Vol 22 (3) ◽  
pp. 282 ◽  
Author(s):  
Li Xiang ◽  
Wenmin Guo ◽  
Bin Liu ◽  
Ao Fu ◽  
Jianbo Li ◽  
...  

A series of TaNbVTiAlx (x = 0, 0.2, 0.4, 0.6, 0.8, and 1.0) refractory high-entropy alloys (RHEAs) with high specific strength and reasonable plasticity were prepared using powder metallurgy (P/M) technology. This paper studied their microstructure and compression properties. The results show that all the TaNbVTiAlx RHEAs exhibited a single BCC solid solution microstructure with no elemental segregation. The P/M TaNbVTiAlx RHEAs showed excellent room-temperature specific strength (207.11 MPa*cm3/g) and high-temperature specific strength (88.37 MPa*cm3/g at 900 °C and 16.03 MPa*cm3/g at 1200 °C), with reasonable plasticity, suggesting that these RHEAs have potential to be applied at temperatures >1200 °C. The reasons for the excellent mechanical properties of P/M TaNbVTiAl0.2 RHEA were the uniform microstructure and solid solution strengthening effect.


2015 ◽  
Vol 817 ◽  
pp. 307-311 ◽  
Author(s):  
Peng Chao Zhang ◽  
Jin Chuan Jie ◽  
Yuan Gao ◽  
Tong Min Wang ◽  
Ting Ju Li

The Cu-Cr and Cu-Cr-Ti alloy plates were prepared by vacuum melting and plastic deformation. The effect of slight Ti element on microstructure and mechanical properties of Cu-Cr alloy was discussed. The result shows that Cr particles with spherical shape precipitated from Cu matrix after aging. Plenty Ti atoms dissolved in the vicinity of Cr particles and there were still parts of solid solution Ti atoms in other regions. Improvements in peak hardness and softening resistance were achieved with the addition of Ti element in Cu-Cr alloy. The addition of 0.1 wt.% Ti element makes Cu-Cr alloy possess tensile strength of 565 MPa and hardness of 185.9 HV after aging at 450 °C for 120 min, which can be attributed to multiple strengthening mechanisms, i.e. work hardening, solid solution strengthening and precipitation strengthening.


2020 ◽  
Vol 51 (12) ◽  
pp. 6195-6206 ◽  
Author(s):  
S. Giese ◽  
A. Bezold ◽  
M. Pröbstle ◽  
A. Heckl ◽  
S. Neumeier ◽  
...  

AbstractThe creep resistance of single-crystalline Ni-base superalloys at elevated temperatures depends among others on solid solution strengthening of the γ-matrix. To study the influence of various solid solution strengtheners on the mechanical properties, a series of Ni-base superalloys with the same content of different alloying elements (Ir, Mo, Re, Rh, Ru, W) or element combinations (MoW, ReMo, ReW) was investigated. Nanoindentation measurements were performed to correlate the partitioning behavior of the solid solution strengtheners with the hardness of the individual phases. The lowest γ′/γ-hardness ratio was observed for the Re-containing alloy with the strongest partitioning of Re to the γ-matrix. As a result of the creep experiments in the high-temperature/low-stress regime (1373 K (1100 °C)/140 MPa), it can be concluded that solid solution hardening in the γ-phase plays an essential role. The stronger the partitioning to the γ-phase and the lower the interdiffusion coefficient of the alloying element, the better the creep resistance. Therefore, the best creep behavior is found for alloys containing high contents of slow-diffusing elements that partition preferably to the γ-phase, particularly Re followed by W and Mo.


1996 ◽  
Vol 459 ◽  
Author(s):  
Yu.I. Chumlyakov ◽  
I. V. Kireeva ◽  
G. S. Kapasova ◽  
E. I. Litvinova

ABSTRACTIt was experimentally shown that the achievement of a high deforming stress level due to dispersion hardening and solid solution strengthening of FCC single crystals with a low stacking-fault energy leads to the deformation mechanism changing from slip to twinning, the dependence of mechanical properties on a crystal orientation and a sign of applied stresses. During deformation by twinning at T<150–300K effects of pseudoelasticity associated with elastic twinning is observed.


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