Performance and Reliability of thin Gate Dielectrics for VLSI: Materials and Processing Perspective
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AbstractCurrent trends are in the direction of submicron MOSFETs employing gate dielectrics in the thickness range of about 30 - 100A°. The performance and reliability of submicron MOSFETs can be improved by using high dielectric constant gate dielectric material. A new concept involving 2 or more dielectric material is proposed in this paper. In- situ rapid isothermal processing is proposed for the fabrication of thin gate dielectrics.
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2018 ◽
Vol 6
(9)
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pp. 2370-2378
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Keyword(s):
2016 ◽
Vol 2016
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pp. 1-6
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