The Transition Between Amorphous Regrowth and Explosive Crystallization

1986 ◽  
Vol 74 ◽  
Author(s):  
J. J. P. Bruines ◽  
R. P. M. van Hal ◽  
B. H. Koek ◽  
M. P. A. Viegers ◽  
H. M. J. Boots
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Temperature Distribution ◽  
Laser Pulses ◽  
Si Substrate ◽  
Time Resolved ◽  
Explosive Crystallization ◽  
Transmission Electron ◽  
Amorphous Si ◽  
Substrate Temperatures

AbstractThe transition between amorphous regrowth and explosive crystallization of a 220nm thick amorphous Si layer on a crystalline Si substrate has been studied using time-resolved reflectivity, transmission electron microscopy, and Rutherford backscattering spectroscopy. Upon irradiation by 7.5ns FWHM pulses from a frequency-doubled Nd:YAG laser, interferences in the reflectivity indicate growth of amorphous Si from the surface. The observation of a narrow Cu peak, buried below the surface, points towards solidification from both the rear and the front. Transmission electron microscopy studies revealed the occurrence of small patches of polycrystalline Si. The relative amount of this polycrystalline Si is increased by longer laser pulses, higher substrate temperatures, and thicker amorphous Si layers. The results are discussed in terms of the temperature distribution and the time available for the nucleation of polycrystalline Si at the liquid-solid interface.

scholarly journals Ion Beam Annealing of Si Co-Implanted with Ga and As

1989 ◽  
Vol 157 ◽  
Author(s):  
S. P. Withrow ◽  
O. W. Holland ◽  
S. J. Pennycook ◽  
J. Pankove ◽  
A. Mascarenhas
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Epitaxial Growth ◽  
Solid Phase ◽  
Ion Beam ◽  
Ion Pairing ◽  
Si Substrate ◽  
Transmission Electron ◽  
Amorphous Si

ABSTRACTIon beam annealing of amorphous Si(100) layers formed by co-implantation of overlapping Ga and As distributions is studied. Annealing was done using 750 keV Si+ ions with the Si substrate held at 300°C. The samples were characterized using 2.0 and 5.0 MeV He+ backscattering/channeling as well as by transmission electron microscopy (TEM). Crystallization of the amorphous Si layer occurs during irradiation via solid-phase-epitaxial growth without impurity precipitation or segregation. Both the Ga and As are mainly substitutional in the Si lattice, even at concentrations in excess of 7 at. % for each species. These results are attributed to compensation effects, most likely through ion pairing of the dopants.

A crystallographic analysis of the CoSi/Si(111) interface using Transmission Electron Microscopy

1990 ◽  
Vol 48 (4) ◽  
pp. 574-575
Author(s):  
A.C. Daykin ◽  
C.J. Kiely ◽  
R.C. Pond ◽  
J.L. Batstone
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Defect Structure ◽  
Room Temperature ◽  
Theoretical Method ◽  
Crystallographic Analysis ◽  
Si Substrate ◽  
Transmission Electron ◽  
Theoretical Predictions

When CoSi2 is grown onto a Si(111) surface it can form in two distinct orientations. A-type CoSi2 has the same orientation as the Si substrate and B-type is rotated by 180° degrees about the [111] surface normal.One method of producing epitaxial CoSi2 is to deposit Co at room temperature and anneal to 650°C.If greater than 10Å of Co is deposited then both A and B-type CoSi2 form via a number of intermediate silicides .The literature suggests that the co-existence of A and B-type CoSi2 is in some way linked to these intermediate silicides analogous to the NiSi2/Si(111) system. The phase which forms prior to complete CoSi2 formation is CoSi. This paper is a crystallographic analysis of the CoSi2/Si(l11) bicrystal using a theoretical method developed by Pond. Transmission electron microscopy (TEM) has been used to verify the theoretical predictions and to characterise the defect structure at the interface.

Photo Modified Growth of GaAs by Chemical Beam Epitaxy

1998 ◽  
Vol 510 ◽  
Author(s):  
R. Jothilingam ◽  
T. Farrell ◽  
T.B. Joyce ◽  
P.J. Goodhew
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Growth Rate ◽  
Electrical Power ◽  
Xenon Lamp ◽  
Chemical Beam Epitaxy ◽  
Cross Sectional ◽  
Transmission Electron ◽  
Substrate Temperatures ◽  
Laser Reflectometry

AbstractWe report the photo modified growth of GaAs by chemical beam epitaxy at substrate temperatures in the range 335 to 670°C using triethygallium (TEG) and arsine. A mercury-xenon lamp (electrical power 200 W) provided the irradiation for the photoassisted growth. The growth was monitored in real time by laser reflectometry (LR) using a 670 nm semiconductor laser, and the optically determined growth rate agreed with that obtained from the layer thickness measured by cross sectional transmission electron microscopy. The observed photo-enhancement of the growth rate at low substrate temperatures and inhibition at high substrate temperatures is thermal in origin, consistent with raising the substrate temperature by 10±3°C. Cross sectional transmission electron microscopy showed that the photoassisted layers are essentially free from dislocations

Structural Properties of Amorphous Silicon Produced by Electron Irradiation

1999 ◽  
Vol 557 ◽  
Author(s):  
J. Yamasaki ◽  
S. Takeda
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Distribution Function ◽  
Structural Properties ◽  
Electron Irradiation ◽  
Low Temperatures ◽  
Crystalline Silicon ◽  
Transmission Electron ◽  
Amorphous Si ◽  
Means Of Transmission

AbstractThe structural properties of the amorphous Si (a-Si), which was created from crystalline silicon by 2 MeV electron irradiation at low temperatures about 25 K, are examined in detail by means of transmission electron microscopy and transmission electron diffraction. The peak positions in the radial distribution function (RDF) of the a-Si correspond well to those of a-Si fabricated by other techniques. The electron-irradiation-induced a-Si returns to crystalline Si after annealing at 550°C.

scholarly journals Characterization of Gaas/Si/GaAs Heterointerfaces

1989 ◽  
Vol 148 ◽  
Author(s):  
Zuzanna Liliental-Weber ◽  
Raymond P. Mariella
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Low Temperature ◽  
Defect Density ◽  
Si Substrate ◽  
Reverse Polarity ◽  
Si Substrates ◽  
Transmission Electron ◽  
Metal Semiconductor Metal

ABSTRACTTransmission electron microscopy of GaAs grown on Si for metal-semiconductor-metal photodetectors is presented in this paper. Two kinds of samples are compared: GaAs grown on a 15 Å Si epilayer grown on GaAs, and GaAs grown at low temperature (300°C) on Si substrates. It is shown that the GaAs epitaxial layer grown on thin Si layer has reverse polarity to the substrate (antiphase relation). Higher defect density is observed for GaAs grown on Si substrate. This higher defect density correlates with an increased device speed, but with reduced sensitivity.

Crystallization of Amorphous Si In Al/Si Multilayers

1991 ◽  
Vol 230 ◽  
Author(s):  
Toyohiko J. Konno ◽  
Robert Sinclair
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Differential Scanning Calorimetry ◽  
Layered Structure ◽  
Heat Of Reaction ◽  
X Ray Diffraction ◽  
Scanning Calorimetry ◽  
X Ray ◽  
Transmission Electron ◽  
Amorphous Si

AbstractThe crystallization of amorphous Si in a Al/Si multilayer (with a modulation length of about 120Å) was investigated using transmission electron microscopy, differential scanning calorimetry and X-ray diffraction. Amorphous Si was found to crystallize at about 175 °C with the heat of reaction of 11±2(kJ/mol). Al grains grow prior to the nucleation of crystalline Si. The crystalline Si was found to nucleate within the grown Al layers. The incipient crystalline Si initially grows within the Al layer and then spreads through the amorphous Si and other Al layers. Because of extensive intermixing, the original layered structure is destroyed. The Al(111) texture is also enhanced.

Deformation of Monocrystalline Silicon under Nanoscratching

2008 ◽  
Vol 41-42 ◽  
pp. 15-19 ◽  
Author(s):  
Y.Q. Wu ◽  
Han Huang ◽  
Jin Zou
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Applied Load ◽  
Normal Load ◽  
Stacking Faults ◽  
Monocrystalline Silicon ◽  
Crystalline Region ◽  
Density Of Dislocations ◽  
Transmission Electron ◽  
Amorphous Si

In this work, deformation of monocrystalline silicon (Si) under nanoscratching was investigated using transmission electron microscopy (TEM). The results indicated that no fracture occurred during nanoscratching with loads ranging from 1 to 6 mN. The damaged regions induced by nanoscratching included an amorphous Si region and a damaged crystalline Si region. Detailed TEM analyses revealed that at the lowest load of 1 mN no dislocation was observed in the damaged crystalline region, and only stacking faults were observed at the boundary between the damaged crystalline Si and amorphous Si. Dislocations started to nucleate along (111) planes and penetrated into the bulk Si when the normal load was increased to 2 mN and above. Defects perpendicular to the scratched surface were initiated when the load was greater than 4 mN. The density of dislocations also increased rapidly with the increase of the applied load.

Atomistic Visualization of Mechanical Interaction in Gold Crystalline Boundaries by Time-Resolved High Resolution Transmission Electron Microscopy

1998 ◽  
Vol 05 (03n04) ◽  
pp. 739-745
Author(s):  
Tokushi Kizuka
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
High Resolution ◽  
Atomic Layer ◽  
Mechanical Tests ◽  
Atomic Scale ◽  
Mechanical Interaction ◽  
Time Resolved ◽  
Specimen Holder ◽  
Transmission Electron

The atomic processes in mechanical interaction were visualized by time-resolved high resolution transmission electron microscopy at a spatial resolution of 0.2 nm and a time resolution of 1/60 s. Nanometer-sized tips of gold were approached, contacted, bonded, deformed and fractured inside a 200 kV electron microscope using a piezo-driving specimen holder. The crystallographic boundary formed after the contact. A few layers near the surfaces and bonding boundaries were responsible for the approach, contact and bonding processes. Atomic scale mechanical tests, such as the friction test, compressing, tensile and shear deformation tests, were proposed. A new type of mechanical processing at one-atomic-layer resolution was demonstrated. Atomic scale contact or noncontact type surface scanning similar to that in atomic force microscopy was also performed with the gold tips.

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