Vibrating RF MEMS for Low Power Communications

2002 ◽  
Vol 741 ◽  
Author(s):  
Clark T.-C. Nguyen

ABSTRACTMicromechanical communication circuits fabricated via IC-compatible MEMS technologies and capable of low-loss filtering, mixing, switching, and frequency generation, are described with the intent to miniaturize wireless transceivers. Possible transceiver front-end architectures are then presented that use these micromechanical circuits in large quantities to substantially reduce power consumption. Technologies that integrate MEMS and transistor circuits into single-chip systems are then reviewed with an eye towards the possibility of single-chip communication transceivers.

2005 ◽  
Vol 14 (06) ◽  
pp. 1085-1099
Author(s):  
SHAOFA YANG ◽  
HON WAI LEONG

It has been estimated that multiplexors (MUXes) make up a major portion of the circuitry in a typical chip. Therefore, to reduce power consumption of a chip, it is important to consider the design of MUXes that consumes less power. This is called the low power MUX decomposition problem and has been studied in Ref. 1. This paper improves on the results of Ref. 1 in two ways: (a) we propose a method to speed up the algorithms in Ref. 1, and (b) we propose a post-optimization procedure to further reduce the overall power dissipation of decompositions obtained by any MUX decomposition algorithm. Using this post-optimization procedure, we have been able to further reduce the power dissipation results of Ref. 1.


2020 ◽  
Vol 6 (18) ◽  
pp. eaaz6511 ◽  
Author(s):  
Gongjin Li ◽  
Zhe Ma ◽  
Chunyu You ◽  
Gaoshan Huang ◽  
Enming Song ◽  
...  

The sensing module that converts physical or chemical stimuli into electrical signals is the core of future smart electronics in the post-Moore era. Challenges lie in the realization and integration of different detecting functions on a single chip. We propose a new design of on-chip construction for low-power consumption sensor, which is based on the optoelectronic detection mechanism with external stimuli and compatible with CMOS technology. A combination of flipped silicon nanomembrane phototransistors and stimuli-responsive materials presents low-power consumption (CMOS level) and demonstrates great functional expansibility of sensing targets, e.g., hydrogen concentration and relative humidity. With a device-first, wafer-compatible process introduced for large-scale silicon flexible electronics, our work shows great potential in the development of flexible and integrated smart sensing systems for the realization of Internet of Things applications.


2011 ◽  
Vol 3 (2) ◽  
pp. 131-138 ◽  
Author(s):  
Michael Kraemer ◽  
Daniela Dragomirescu ◽  
Robert Plana

The research on the design of receiver front-ends for very high data-rate communication in the 60 GHz band in nanoscale Complementary Metal Oxide Semiconductor (CMOS) technologies is going on for some time now. Although a multitude of 60 GHz front-ends have been published in recent years, they are not consequently optimized for low power consumption. Thus, these front-ends dissipate too much power for battery-powered applications like handheld devices, mobile phones, and wireless sensor networks. This article describes the design of a direct conversion receiver front-end that addresses the issue of power consumption, while at the same time permitting low cost (due to area minimization by the use of spiral inductors). It is implemented in a 65 nm CMOS technology. The realized front-end achieves a record power consumption of only 43 mW including low-noise amplifier (LNA), mixer, a voltage controlled oscillator (VCO), a local oscillator (LO) buffer, and a baseband buffer (without this latter buffer the power consumption is even lower, only 29 mW). Its pad-limited size is 0.55 × 1 mm2. At the same time, the front-end achieves state-of-the-art performance with respect to its other properties: Its maximum measured power conversion gain is 30 dB, the RF and IF bandwidths are 56.5–61.5 and 0–1.5 GHz, respectively, its measured minimum noise figure is 9.2 dB, and its measured IP−1 dB is −36 dBm.


Sign in / Sign up

Export Citation Format

Share Document