Experimental Characterization of the Reliability of Multi-Terminal Dual-Damascene Copper Interconnect Trees

2003 ◽  
Vol 766 ◽  
Author(s):  
C. L. Gan ◽  
C.V. Thompson ◽  
K. L. Pey ◽  
W. K. Choi ◽  
C. W. Chang ◽  
...  
Keyword(s):  
Current Density ◽  
Void Nucleation ◽  
Experimental Results ◽  
Experimental Characterization ◽  
Dual Damascene ◽  
Current Densities ◽  
The Common ◽  
Number Of Segments ◽  
Atomic Source

AbstractThe reliability of Cu dual-damascene interconnect trees with 3-terminal (dotted-I), 4-terminal (‘T’) and 5-terminal (‘+’) configurations has been investigated. The lifetime of multiterminal interconnect trees with the same current density through the common middle via was determined to be independent of the number of segments connected at the common junction. Furthermore, our experimental results on dotted-I test structures showed an increase in the reliability of the interconnect tree when the distribution of a same current was not equal in the two connected segments, especially for the cases where one of the segments was acting as a passive reservoir or active source of Cu atoms for the adjoining segment. Due to the low barrier for void nucleation at the Cu/Si3N4 interface, the presence of any small atomic source in neighboring segments will enhance the reliability of a connected segment in which Cu atoms are being drained away. As a consequence, failure can occur in a tree segment which is stressed at significantly lower current densities than more highly stressed adjoining segments.

scholarly journals Pengaruh Rapat Arus Terhadap Ketebalan Dan Struktur Kristal Lapisan Nikel pada Tembaga

2016 ◽  
Vol 2 (02) ◽  
pp. 1
Author(s):  
Setyowati S ◽  
Y Iriani ◽  
A H Ramelan
Keyword(s):  
Crystal Structures ◽  
Current Density ◽  
Thickness Measurement ◽  
Experimental Results ◽  
Nickel Coatings ◽  
Current Densities ◽  
Diffraction Patterns

<span>The effect of current density on thickness and crystal structures of the coatings in the <span>electroplating of nickel on copper has been investigated. The electroplating of nickel was <span>conducted at a voltage of 0.5 V for 10 minutes with varied current densities of 0.3 <span>mA/cm<span>2<span>; 0.6 mA/cm<span>2<span>; 0.9 mA/cm<span>2<span>; and 1 mA/cm<span>2<span>. The nickel coatings werw tested by <span>thickness measurement and crystal structures determination. The experimental results <span>showed that the thickness of the nickel coatings increased as the current density increased. <span>The XRD characterization of the nickel coatings revealed the diffraction patterns for cubic <span>structures with orientation of (111) and (200). As the current density increases, the crystal <span>with (111) and (200) orientation tends to be formed more lagely.</span></span></span></span></span></span></span></span><br /></span></span></span></span></span></span></span></span></span>

Experimental Characterization of the Reliability of 3-Terminal Dual-Damascene Copper Interconnect Trees

2002 ◽  
Vol 716 ◽  
Author(s):  
C. L. Gan ◽  
C. V. Thompson ◽  
K. L. Pey ◽  
W. K. Choi ◽  
F. Wei ◽  
...  
Keyword(s):  
Stress Conditions ◽  
Experimental Characterization ◽  
Contact Lines ◽  
Tree Structures ◽  
Similar Test ◽  
Dual Damascene ◽  
Copper Interconnect ◽  
Test Conditions

AbstractElectromigration experiments have been carried out on simple Cu dual-damascene interconnect tree structures consisting of straight via-to-via (or contact-to-contact) lines with an extra via in the middle of the line. As with Al-based interconnects, the reliability of a segment in this tree strongly depends on the stress conditions of the connected segment. Beyond this, there are important differences in the results obtained under similar test conditions for Al-based and Cu-based interconnect trees. These differences are thought to be associated with variations in the architectural schemes of the two metallizations. The absence of a conducting electromigrationresistant overlayer in Cu technology, and the possibility of liner rupture at stressed vias lead to significant differences in tree reliabilities in Cu compared to Al.

Controllable, High Force Amplification Using Elastic Cable Capstans

2012 ◽  
Author(s):  
Gray C. Thomas ◽  
Clayton C. Gimenez ◽  
Erica D. Chin ◽  
Andrew P. Carmedelle ◽  
Aaron M. Hoover
Keyword(s):  
Dynamic Performance ◽  
Experimental Results ◽  
Rotating Drum ◽  
Experimental Characterization ◽  
Experimental Apparatus ◽  
Linear Force ◽  
Low Torque ◽  
Robotic Applications

This paper presents the design and experimental characterization of a continuously variable linear force amplifier based on the theory of capstans. In contrast to traditional capstan amplifiers, the design presented here uses an elastic cable, enabling a control actuator to not only continuously clutch output to a rotating drum but also passively declutch by releasing tension. Our experimental results demonstrate successful declutching at all force amplification ratios up to the limit of our experimental apparatus, 21 — significantly higher than previously published values. A system of distributed capstan amplifiers driven by a central torque source with cable engagement switched by lightweight, low torque actuators has potential to reduce the mass of distal actuators and enable more dynamic performance in robotic applications.

scholarly journals Cloning of the Haemophilus influenzae Dam methyltransferase and analysis of its relationship to the Dam methyltransferase encoded by the HP1 phage.

2001 ◽  
Vol 48 (4) ◽  
pp. 969-983 ◽  
Author(s):  
J M Bujnicki ◽  
M Radlinska ◽  
P Zaleski ◽  
A Piekarowicz
Keyword(s):  
Haemophilus Influenzae ◽  
Binding Pocket ◽  
Experimental Characterization ◽  
Cofactor Binding ◽  
Structural Context ◽  
Target Dna ◽  
The Common ◽  
Lysogenic Phage ◽  
Dna Adenine Methyltransferase

In this paper we report cloning and experimental characterization of the DNA adenine methyltransferase (dam) gene from Haemophilus influenzae and comparison of its product with the Dam protein from the lysogenic phage of H. influenzae, HP1. Molecular modeling of M.HinDam and M.HP1Dam was carried out, providing a framework for a comparative analysis of these enzymes and their close homologs in the structural context. Both proteins share the common fold and essential cofactor-binding and catalytic residues despite overall divergence. However, subtle but significant differences in the cofactor-binding pocket have been identified. Moreover, while M.HinDam seems to contact its target DNA sequence using a number of loops, most of them are missing from M.HP1Dam. Analysis of both MTases suggests that their catalytic activity was derived from a common ancestor, but similar sequence specificities arose by convergence.

Physicochemical Characterization of Porous Silicon Surfaces Etched in Salt Solutions of Varying Compositions and pH

2003 ◽  
Vol 762 ◽  
Author(s):  
Mariem Rosario-Canales ◽  
Ana R. Guadalupe ◽  
Luis F. Fonseca ◽  
Oscar Resto
Keyword(s):  
Porous Silicon ◽  
Current Density ◽  
Silicon Oxide ◽  
Physicochemical Characterization ◽  
Silicon Surfaces ◽  
Silicon Oxide Layer ◽  
Electrochemical Processes ◽  
Current Densities ◽  
Secondary Ion

AbstractWe prepared porous silicon (PSi) structures by standard electrochemical processes using aqueous sodium fluoride (NaF) solutions. We report the dependence of the porous structure on the variation of pH and salt concentration of the etching solution, and the applied current density. The PSi structures were characterized by Scanning Electron Microscopy (SEM) and Secondary Ion Mass Spectroscopy (SIMS) to determine the pore size and distribution and the surface chemical composition. Results obtained from SEM show that the PSi grown has two different structures depending on the current density. Low current densities produce a uniform, high-density arrangement of pores while high current densities yield a sponge-like structural network. SIMS results indicate that the porous framework is covered with a silicon oxide layer.

Interconnect Failure Mechanism Maps for Different Metallization Materials and Processes

1999 ◽  
Vol 563 ◽  
Author(s):  
V. K. Andleigh ◽  
Y. J. Park ◽  
C. V. Thompson
Keyword(s):  
Failure Mechanism ◽  
Current Density ◽  
Void Growth ◽  
Void Nucleation ◽  
Failure Mechanisms ◽  
Line Length ◽  
Test Results ◽  
Interconnect Reliability ◽  
Current Densities ◽  
Service Conditions

AbstractA tool for simulation of electromigration and electromigration-induced damage, MIT/EmSim, has been used to investigate interconnect reliability, focusing on transitions in failure mechanisms associated with void nucleation, growth, and growth saturation. Conventional scaling of electromigration test results assume that the median time to electromigration-induced failure scales with the current density j to the power −n. The effects of transitions in failure mechanisms have been studied by characterizing the apparent current density exponent. When failure is limited by void nucleation, n=2 scaling is observed, and when failure requires substantial void growth, n=1 scaling is observed. When lines end at diffusion barriers such as W or liner-filled vias, void growth saturates in short lines at low current densities, and, depending on the failure criterion, lines under these conditions can be ‘immortal’. As growth saturates, apparent current density exponents increase above 2. Failure mechanism maps can be constructed to illustrate the failure mechanisms and scaling behavior as a function of line length and current density. Failure maps can be used in accurately scaling test results to service conditions, to suggest layout strategies for optimized circuit reliability, and to assess the reliability of new interconnect materials and structures.

Experimental Characterization of Bonded Microcoolers for Hot Spot Removal

2005 ◽  
Author(s):  
Yan Zhang ◽  
Gehong Zeng ◽  
Christine Hoffman ◽  
Ali Shakouri ◽  
Peng Wang ◽  
...  
Keyword(s):  
Integrated Circuit ◽  
Hot Spots ◽  
Hot Spot ◽  
Experimental Results ◽  
Cooling Power ◽  
Experimental Characterization ◽  
Region Versus ◽  
Test Range ◽  
Microelectronic Devices

In this paper we describe the experimental results of Si/SiGe superlattice microcoolers, which are used to cool the target hot spot on a 65μm-thick silicon substrate. The device areas under test range from 50×50 to 150×150 μm2. We measured the cooling temperature at the hot spot region versus the current supplied to the microcooler, as well as the thermal resistance, and the cooling power density (CPD, also defined as heat flux — the flow of heat per unit area in W/cm2) of these devices. The experimental results show the maximum cooling at the hot spot region approaches 1°C for device area 150×150μm2 at 80°C, and CPD up to ∼110W/cm2 for device area 50×50×2 μm2 (two 50×50μm2 device array, as illustrated in Figure 3) at 80°C. The two-chip bonded configuration will allow the integration of spot coolers and integrated circuit chips with minimum impact on the processing of microelectronic devices. Key parameters limiting the cooling performance at the hot spots are also discussed.

scholarly journals Turbidity and oil removal from oilfield produced water, middle oil company by electrocoagulation technique

2018 ◽  
Vol 162 ◽  
pp. 05010
Author(s):  
Thamer Mohammed ◽  
Esraa Abbas ◽  
Thabit Ahmed
Keyword(s):  
Current Density ◽  
Oil Content ◽  
Produced Water ◽  
Oil Wells ◽  
Experimental Results ◽  
Allowable Limit ◽  
Current Densities ◽  
Oilfield Produced Water ◽  
Limit Effect ◽  
Oil Company

Huge quantity of produced water is salty water trapped in the oil wells rock and brought up along with oil or gas during production. It usually contains hydrocarbons as oil and suspended solids or turbidity. Therefore the aim of this study is to treat produced water before being discharge to surface water or re injected in oil wells. In this paper experimental results were investigated on treating produced water (which is obtained from Middle Oil Company-Iraq), through electrocoagulation (EC). The performance of EC was investigated for reduction of turbidity and oil content up to allowable limit. Effect of different parameters were studied; (pH, current density, distance between two electrodes, and electrolysis time). The experimental runs carried out by an electrocoagulation unit was assembled and installed in the lab and the reactor was made of a material Perspex, with a capacity of approximately 2.5 liters and dimensions were 20 cm in length, 14 cm in width and 16 cm height. The electrodes employed were made of commercial materials. The anode was a perforated aluminum rectangular plate with a thickness of 1.72 mm, a height of 60 mm and length of 140 mm and the cathode was a mesh iron. The current was used in the unit with different densities to test the turbidity removing efficiency (0.0025, 0.00633, 0.01266 and 0.0253 A/cm2).The experiment showed that the best turbidity removing was (10, 9.7, 9.2, 18 NTU) respectively. The distance between the electrodes of the unit was 3cm. The present turbidity removing was 92.33%. A slight improvement of turbidity removing was shown when the distance between the electrodes was changed from 0.5 to 3 cm with fixation of current density. The best turbidity removing was 93.5% , (7.79 NTU) when the distance between the electrodes were 1 cm. The experimental results found that concentration of oil had decreased to (10.7, 11.2, 11.7, 12.3) mg/l when different current densities (0.00253, 0.00633, 0.01266, 0.0253) A/cm2 were used, respectively with the distance between the electrodes was 3 cm. The best result of oil content decreasing was 10.7 mg/l with current density 0.0253 A/cm2. These results are within allowable limit to provide the possibility of reuse the water and can be injected in oil wells

Sign in / Sign up

Export Citation Format

Share Document