Fabrication of p+/n Ultra Shallow Junctions (USJ) in silicon by excimer laser doping from spin-on glass sources

2004 ◽  
Vol 810 ◽  
Author(s):  
S. Coutanson ◽  
E. Fogarassy ◽  
J. Venturini
Keyword(s):  
Excimer Laser ◽  
Surface Region ◽  
Oxide Glass ◽  
Near Surface ◽  
Laser Doping ◽  
Dopant Incorporation ◽  
Ultra Shallow Junctions ◽  
20 Nm ◽  
Short Time ◽  
Dopant Source

ABSTRACTIn this work was investigated a simple laser doping method employing doped oxide glass films as dopant source (up to 2.1021cm−3) which are deposited onto silicon by the spin coating technique. Both short (20 ns) and long (200 ns) pulse duration excimer laser beams were used to deposit a large amount of energy in a short time onto the near-surface region. Under suitable conditions, the irradiation leads to surface melting and dopant incorporation by liquid phase diffusion from the surface. Boron distribution profiles in the two pulses duration regimes were studied as well as their electrical properties, and the junction formation of less than 20 nm in depth was demonstrated.

Time-Resolved Reflectivity Measurements of Silicon And Germanium Using A Pulsed Excimer Laser

1985 ◽  
Vol 51 ◽  
Author(s):  
G. E. Jellison ◽  
D. H. Lowndes ◽  
D. N. Mashburn ◽  
R. F. Wood
Keyword(s):  
Excimer Laser ◽  
Surface Region ◽  
Finite Energy ◽  
Time Resolved ◽  
Model Calculations ◽  
Near Surface ◽  
Maximum Reflectivity ◽  
Liquid Phases ◽  
Silicon And Germanium ◽  
Melt Duration

ABSTRACTTime-resolved reflectivity measurements of silicon and germanium have been made during pulsed KrF excimer laser irradiation. The reflectivity was measured simultaneously at both 1152 and 632.8 nm wavelengths, and the energy density of each laser pulse was monitored. The melt duration and the time of the onset of melting were measured and compared with the results of melting model calculations. For energy densities just above the melting threshold, it was found that the melt duration was never less than 20 ns for Si and 25 ns for Ge, while the maximum reflectivity increased from the value of the hot solid to that of the liquid over a finite energy range. These results, along with a reinterpretation of earlier time-resolved ellipsometry measurements, indicate that, during the melt-in process, the near-surface region does not melt homogeneously, but rather consists of a mixture of solid and liquid phases. The reflectivity at the onset of melting and in the liquid phase have been measured at both 632.8 and 1152 nm, and are compared with the results found in the literature.

Low Temperature Crystallization of Amorphous Silicon Films Using an Excimer Laser

1989 ◽  
Vol 149 ◽  
Author(s):  
S. E. Ready ◽  
J. B. Boyce ◽  
R. Z. Bachrach ◽  
R. I. Johnson ◽  
K. Winer ◽  
...  
Keyword(s):  
Amorphous Silicon ◽  
Excimer Laser ◽  
Laser Energy ◽  
Amorphous Material ◽  
Surface Region ◽  
Silicon Films ◽  
Starting Material ◽  
Near Surface ◽  
Silicon Thin Films ◽  
Crystallite Sizes

ABSTRACTIn an effort to enhance the electrical properties of silicon thin films, we have performed recrystallization experiments on a variety of amorphous silicon films using an excimer laser. The intense, pulsed UV produced by the laser (308nm, using XeCl gas) is highly absorbed by the amorphous material and thus provides intense localized heating in the near surface region. Two types of starting films were studied: plasma CVD a-Si:H and LPCVD a-Si. The subsequent modification produces crystallites whose structure and electrical characteristics vary due to starting material and laser scan parameters. The treated films have been characterized using Raman, x-ray diffraction, TEM, SIMS and transport measurements. The results indicate that crystallites nucleate in the surface region. The degree of crystallization near the surface increases dramatically as a function of deposited laser energy density and less so as a function of laser shot density. The hall mobility of the highly crystallized samples exhibit an increase of 2 orders of magnitude over the amorphous starting material. In the PECVD material, the rapid diffusion of hydrogen causes voids to be formed at intermediate laser energy densities and removal of film at higher energy densities. The LPCVD material withstands the high laser energies to produce well crystallized films with crystallite sizes greater then 1000Å.

Using Ion Beams to Modify Nanocrystalline Composites: Co Nanoparticles in Sapphire

2001 ◽  
Vol 703 ◽  
Author(s):  
A. Meldrum ◽  
K.S. Beaty ◽  
M. Lam ◽  
C.W. White ◽  
R.A. Zuhr ◽  
...  
Keyword(s):  
Surface Region ◽  
Amorphous Layer ◽  
Ion Beams ◽  
Near Surface ◽  
Nanocrystalline Composites ◽  
Transmission Electron ◽  
Co Nanoparticles ◽  
20 Nm ◽  
And Control ◽  
Single Crystal Sapphire

ABSTRACTIon implantation and thermal processing were used to create a layer of Co nanoclusters embedded in the near-surface region of single-crystal sapphire. The Co nanoparticles ranged in size from 2-20 nm and were crystallographically aligned with the host sapphire. Specimens were irradiated with Xe and Pt ions, and the microstructural evolution of the nanoclusters was investigated by transmission electron microscopy. With increasing Pt or Xe ion dose, the Co nanoparticles lost their initially excellent faceting, although they remained crystalline. The host Al2O3 became amorphous and the resulting microstructure consisted of a buried amorphous layer containing the still-crystalline Co nanoparticles. EDS mapping and electron diffraction were used to determine the distribution of the implanted species, and the magnetic properties of the composite were measured with a SQUID magnetometer. The results show that ion beams can be applied to modify and control the properties of ferromagnetic nanocomposites, and, combined with lithographic techniques, will find applications in exercising fine-scale spatial control over the properties of magnetic materials.

Excimer Laser Induced Modification of Teflon Surface into Silicon Carbide-Like

1991 ◽  
Vol 236 ◽  
Author(s):  
M. Okoshi ◽  
K. Toyoda ◽  
M. Murahara
Keyword(s):  
Silicon Carbide ◽  
Excimer Laser ◽  
Photochemical Reaction ◽  
Surface Region ◽  
Mixed Gas ◽  
Near Surface ◽  
Modification Process ◽  
Gas Atmosphere ◽  
Ft Ir ◽  
Arf Excimer Laser

AbstractA silicon carbide-like layer was produced in the near-surface region of teflon by irradiating with an ArF excimer laser in a SiH4 and B(CH3)3 mixed gas atmosphere. The pure photochemical reaction was employed in the modification process, and the defluorination of the surface was performed with boron atoms which were photodissociated from B(CH3)3. The CH3 radicals, also photodissociated, induced the dehydrogenation of SiH4 gas; which followed the production of SiHx radicals. The SiHx radicals and CH3 radicals which could not have induced the dehydrogenation of SiH4 were substituted for fluorine atoms of the surface. As a result, the surface was photomodified into silicon carbide. Chemical composition of the photomodified surface was inspected by the XPS and the ATR-FT-IR spectra measurement, and the bonding of the Si-CH3 radicals which traded off the reduction of the fluorine atoms was comfirmed. The Si/C composition ratio of the photomodified surface was 0.7.

Influence of Low-Temperature Argon Ion-Beam Treatment on the Photovoltage Spectra of Standard Cz Si Wafers

2007 ◽  
Vol 131-133 ◽  
pp. 333-338 ◽  
Author(s):  
Anis M. Saad ◽  
Olga V. Zinchuk ◽  
N.A. Drozdov ◽  
A.K. Fedotov ◽  
A.V. Mazanik
Keyword(s):  
Low Temperature ◽  
Spectral Region ◽  
Ion Beam ◽  
Surface Region ◽  
Near Surface ◽  
Ion Energy ◽  
Ion Beam Treatment ◽  
P Type ◽  
20 Nm ◽  
Argon Ion

The main goal of this work is to investigate the influence of low-temperature argon ionbeam treatment on the electric and structural properties of a near-surface region of the standard commercial p-type Cz Si wafers, and to compare the effects of Ar+ and H+ ion-beam treatment. The measurements of thermo-EMF have shown that both Ar+ and H+ ion-beam treatment with the ion energy 200 eV and current density 0.15 mA/cm2 at a temperature of 30 oC during 30 min leads to the p-to-n −type overcompensation of the near-surface layer of silicon wafers. The measurements of photovoltage spectra have shown that (i) Ar+ and H+ treatments in like manner lead to the appearance of a photovoltage signal over a wide spectral region due to the formation of p-n-junction on the treated surface, and (ii) photosensitivity of the Ar+ ion-beam treated wafers in the ultraviolet (UV) spectral region (200-400 nm) is much greater as compared to the wafers subjected to H+ ion beam treatment in the same conditions. The main difference in the Ar+ and H+ ion-beam treatment effects is the formation of a thin (5-20 nm) oxygen-containing dielectric layer on the surface of hydrogenated samples and the absence of such layer in case of Ar+ ion-beam treatment.

Studies on excimer laser doping of GaAs using sulphur adsorbate as dopant source

1994 ◽  
Vol 58 (2) ◽  
pp. 191-195 ◽  
Author(s):  
S. K. Zhang ◽  
K. Sugioka ◽  
J. Fan ◽  
K. Toyoda ◽  
S. C. Zou
Keyword(s):  
Excimer Laser ◽  
Laser Doping ◽  
Dopant Source

Soft X‐Ray Studies of Y‐Ba‐Cu‐O Thin Films Prepared by Laser Ablation

1989 ◽  
Vol 169 ◽  
Author(s):  
A. Krol ◽  
C.J. Sher ◽  
D.R. Storch ◽  
L.W. Song ◽  
Y.H. Kao ◽  
...  
Keyword(s):  
Thin Films ◽  
Laser Ablation ◽  
Parallel Plate ◽  
Surface Region ◽  
Angular Variation ◽  
Near Surface ◽  
X Ray ◽  
20 Nm ◽  
First Time ◽  
Oxygen Atoms

AbstractAngular variation of x‐ray fluorescence due to oxygen atoms in high‐T Y‐Ba‐Cu‐O thin films is measured for the first time by using a new parallel plate avalanche chamber. This technique allows the possibility of nondestructive probing of the depth‐profile of oxygen atoms in the superconducting materials. Our preliminary results indicate that the near surface region of the Y‐Ba‐Cu‐O film may contain an oxygen‐depleted layer of thickness around 20 nm.

Analysis of 2D and 3D defects associated with precipitation of Cu in silicon

1991 ◽  
Vol 49 ◽  
pp. 870-871
Author(s):  
P.M. Rice ◽  
MJ. Kim ◽  
R.W. Carpenter
Keyword(s):  
Colony Growth ◽  
Dark Field ◽  
Dark Side ◽  
Silicide Phase ◽  
Strain Fields ◽  
Near Surface ◽  
Unknown Composition ◽  
Secondary Precipitates ◽  
20 Nm ◽  
2D And 3D

Extrinsic gettering of Cu on near-surface dislocations in Si has been the topic of recent investigation. It was shown that the Cu precipitated hetergeneously on dislocations as Cu silicide along with voids, and also with a secondary planar precipitate of unknown composition. Here we report the results of investigations of the sense of the strain fields about the large (~100 nm) silicide precipitates, and further analysis of the small (~10-20 nm) planar precipitates.Numerous dark field images were analyzed in accordance with Ashby and Brown's criteria for determining the sense of the strain fields about precipitates. While the situation is complicated by the presence of dislocations and secondary precipitates, micrographs like those shown in Fig. 1(a) and 1(b) tend to show anomalously wide strain fields with the dark side on the side of negative g, indicating the strain fields about the silicide precipitates are vacancy in nature. This is in conflict with information reported on the η'' phase (the Cu silicide phase presumed to precipitate within the bulk) whose interstitial strain field is considered responsible for the interstitial Si atoms which cause the bounding dislocation to expand during star colony growth.

Preparation of cross-sectional samples for near-surface TEM studies

1987 ◽  
Vol 45 ◽  
pp. 380-381
Author(s):  
R.C. Dickenson ◽  
K.R. Lawless
Keyword(s):  
Standard Sample ◽  
Surface Region ◽  
Specimen Preparation ◽  
Thick Sheet ◽  
Drill Bit ◽  
Sample Holder ◽  
Metal Interface ◽  
Cross Sectional ◽  
Near Surface ◽  
Cold Worked

In thermal oxidation studies, the structure of the oxide-metal interface and the near-surface region is of great importance. A technique has been developed for constructing cross-sectional samples of oxidized aluminum alloys, which reveal these regions. The specimen preparation procedure is as follows: An ultra-sonic drill is used to cut a 3mm diameter disc from a 1.0mm thick sheet of the material. The disc is mounted on a brass block with low-melting wax, and a 1.0mm hole is drilled in the disc using a #60 drill bit. The drill is positioned so that the edge of the hole is tangent to the center of the disc (Fig. 1) . The disc is removed from the mount and cleaned with acetone to remove any traces of wax. To remove the cold-worked layer from the surface of the hole, the disc is placed in a standard sample holder for a Tenupol electropolisher so that the hole is in the center of the area to be polished.

The Effects of Ion Implantation on the Surface Features of Inconel 600

1985 ◽  
Vol 43 ◽  
pp. 288-289
Author(s):  
John D. Rubio
Keyword(s):  
Grain Boundary ◽  
Ion Implantation ◽  
Nuclear Power ◽  
Power Plants ◽  
Surface Region ◽  
Selective Dissolution ◽  
Boundary Region ◽  
Near Surface ◽  
Inconel 600 ◽  
Steam Generator Tubing

The degradation of steam generator tubing at nuclear power plants has become an important problem for the electric utilities generating nuclear power. The material used for the tubing, Inconel 600, has been found to be succeptible to intergranular attack (IGA). IGA is the selective dissolution of material along its grain boundaries. The author believes that the sensitivity of Inconel 600 to IGA can be minimized by homogenizing the near-surface region using ion implantation. The collisions between the implanted ions and the atoms in the grain boundary region would displace the atoms and thus effectively smear the grain boundary.To determine the validity of this hypothesis, an Inconel 600 sample was implanted with 100kV N2+ ions to a dose of 1x1016 ions/cm2 and electrolytically etched in a 5% Nital solution at 5V for 20 seconds. The etched sample was then examined using a JEOL JSM25S scanning electron microscope.

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