scholarly journals Integration of CNTs thin film for sensing and actuating micro structures

2012 ◽  
Vol 34 (4) ◽  
pp. 299-309 ◽  
Author(s):  
Van Thanh Dau ◽  
Bui Thanh Tung ◽  
Dzung Viet Dao ◽  
Susumu Sugiyama
Keyword(s):  
Thin Film ◽  
Seebeck Effect ◽  
Top Down ◽  
Piezoresistive Effect ◽  
Paper Review ◽  
Micro Structures

This paper reports the top-down fabrication of CNTs thin film on MEMS structure to develop sensing and actuating micro structures. In particular, this paper review the integration of CNTs film in application of silicon micromirror based on angular vertical comb actuator, development of microstructures with piezoresistive effect and Seebeck effect.

scholarly journals Nanoimprinted multifunctional nanoprobes for a homogeneous immunoassay in a top-down fabrication approach

2021 ◽  
Vol 11 (1) ◽  
Author(s):  
Hubert Brueckl ◽  
Astrit Shoshi ◽  
Stefan Schrittwieser ◽  
Barbara Schmid ◽  
Pia Schneeweiss ◽  
...  
Keyword(s):  
Thin Film ◽  
Nanoimprint Lithography ◽  
Thin Film Deposition ◽  
Film Deposition ◽  
In Vitro Diagnostics ◽  
Top Down ◽  
Highly Sensitive ◽  
Optical And Magnetic Properties ◽  
Lift Off

AbstractMultifunctional nanoparticles are discussed as versatile probes for homogeneous immunoassays for in-vitro diagnostics. Top-down fabrication allows to combine and tailor magnetic and plasmonic anisotropic properties. The combination of nanoimprint lithography, thin film deposition, and lift-off processing provides a top-down fabrication platform, which is both flexible and reliable. Here, we discuss the material compositions and geometrical designs of monodisperse multicomponent nanoparticles and their consequences on optical and magnetic properties. The rotational hydrodynamics of nanoparticles is measured and considered under the influence of magnetic shape anisotropy in the framework of the Stoner-Wohlfarth theory. The plasmon-optical properties are explained by discrete-dipole finite-element simulations. Rotational dynamical measurements of imprinted nanoprobes for two test proteins demonstrate the applicability as highly sensitive biomolecular nanoprobes.

Characteristics of Near-infrared Induced Transmission Enhancement of Thin Film Micro-structures

2019 ◽  
Vol 48 (7) ◽  
pp. 731001
Author(s):  
葛少博 GE Shao-bo ◽  
刘卫国 LIU Wei-guo ◽  
周顺 ZHOU Shun ◽  
杨鹏飞 YANG Peng-fei ◽  
李世杰 LI Shi-jie ◽  
...  
Keyword(s):  
Thin Film ◽  
Near Infrared ◽  
Transmission Enhancement ◽  
Micro Structures

scholarly journals Flexible Temperature Sensor Integrated with Soft Pneumatic Microactuators for Functional Microfingers

2019 ◽  
Vol 9 (1) ◽  
Author(s):  
Satoshi Konishi ◽  
Akiya Hirata
Keyword(s):  
Thin Film ◽  
Temperature Sensor ◽  
Output Voltage ◽  
Temperature Sensors ◽  
Seebeck Effect ◽  
Temperature Sensing ◽  
Bending Test ◽  
Contact Detection ◽  
Dissimilar Metals

Abstract The integration of a flexible temperature sensor with a soft microactuator (a pneumatic balloon actuator) for a functional microfinger is presented herein. A sensor integrated with a microactuator can actively approach a target for contact detection when a distance exists from the target or when the target moves. This paper presents a microfinger with temperature sensing functionality. Moreover, thermocouples, which detect temperature based on the Seebeck effect, are designed for use as flexible temperature sensors. Thermocouples are formed by a pair of dissimilar metals or alloys, such as copper and constantan. Thin-film metals or alloys are patterned and integrated in the microfinger. Two typical thermocouples (K-type and T-type) are designed in this study. A 2.0 mm × 2.0 mm sensing area is designed on the microfinger (3.0 mm × 12 mm × 400 μm). Characterization indicates that the output voltage of the sensor is proportional to temperature, as designed. It is important to guarantee the performance of the sensor against actuation effects. Therefore, in addition to the fundamental characterization of the temperature sensors, the effect of bending deformation on the characteristics of the temperature sensors is examined with a repeated bending test consisting of 1000 cycles.

scholarly journals Enhancing the Seebeck effect in Ge/Si through the combination of interfacial design features

2019 ◽  
Vol 9 (1) ◽  
Author(s):  
Andriy Nadtochiy ◽  
Vasyl Kuryliuk ◽  
Viktor Strelchuk ◽  
Oleg Korotchenkov ◽  
Pei-Wen Li ◽  
...  
Keyword(s):  
Thin Film ◽  
Quantum Dots ◽  
Integrated Circuits ◽  
Seebeck Coefficient ◽  
Physical Properties ◽  
Thermal Management ◽  
Phonon Scattering ◽  
Atomic Layer ◽  
Epitaxial Films ◽  
Seebeck Effect

Abstract Due to their inherent physical properties, thin-film Si/SiGe heterostructures have specific thermal management applications in advanced integrated circuits and this in turn is essential not only to prevent a high local temperature and overheat inside the circuit, but also generate electricity through the Seebeck effect. Here, we were able to enhance the Seebeck effect in the germanium composite quantum dots (CQDs) embedded in silicon by increasing the number of thin silicon layers inside the dot (multi-fold CQD material). The Seebeck effect in the CQD structures and multi-layer boron atomic layer-doped SiGe epitaxial films was studied experimentally at temperatures in the range from 50 to 300 K and detailed calculations for the Seebeck coefficient employing different scattering mechanisms were made. Our results show that the Seebeck coefficient is enhanced up to ≈40% in a 3-fold CQD material with respect to 2-fold Ge/Si CQDs. This enhancement was precisely modeled by taking into account the scattering of phonons by inner boundaries and the carrier filtering by the CQD inclusions. Our model is also able to reproduce the observed temperature dependence of the Seebeck coefficient in the B atomic layer-doped SiGe fairly well. We expect that the phonon scattering techniques developed here could significantly improve the thermoelectric performance of Ge/Si materials through further optimization of the layer stacks inside the quantum dot and of the dopant concentrations.

scholarly journals Procedures and Properties for a Direct Nano-Micro Integration of Metal and Semiconductor Nanowires on Si Chips

2012 ◽  
Vol 2012 ◽  
pp. 1-13 ◽  
Author(s):  
Dawit Gedamu ◽  
Ingo Paulowicz ◽  
Seid Jebril ◽  
Yogendra Kumar Mishra ◽  
Rainer Adelung
Keyword(s):  
Thin Film ◽  
Electrical Properties ◽  
Field Effect ◽  
Field Effect Transistors ◽  
Electronic Devices ◽  
Semiconductor Nanowires ◽  
Semiconductor Nanostructures ◽  
Wafer Level ◽  
Vapor Liquid Solid ◽  
Micro Structures

1-dimensional metal and semiconductor nanostructures exhibit interesting physical properties, but their integration into modern electronic devices is often a very challenging task. Finding the appropriate supports for nanostructures and nanoscale contacts are highly desired aspects in this regard. In present work we demonstrate the fabrication of 1D nano- and mesostructures between microstructured contacts formed directly on a silicon chip either by a thin film fracture (TFF) approach or by a modified vapor-liquid-solid (MVLS) approach. In principle, both approaches offer the possibilities to integrate these nano-meso structures in wafer-level fabrications. Electrical properties of these nano-micro structures integrated on Si chips and their preliminary applications in the direction of sensors and field effect transistors are also presented.

scholarly journals Study Of Diffusion Influence Materials Of Copper-Zinc-Steel On The Hardness And Micro Hardness Under Heat Treatment

2019 ◽  
Vol 12 (3) ◽  
pp. 1-7
Author(s):  
Ali Adwan H
Keyword(s):  
Thin Film ◽  
Heat Treatment ◽  
Corrosion Resistance ◽  
Treatment Condition ◽  
Heat Treatment Condition ◽  
Micro Hardness ◽  
Sufficient Time ◽  
Good Corrosion Resistance ◽  
Copper Zinc ◽  
Micro Structures

Low melting metals like zinc used in this research to promote increasing of diffusion process with presence of pure powder of copper., this metals have good corrosion resistance in chemical and environmental conditions  by making thin film to hardening surface of rod of stainless steel18/8Ni-Cr under heat treatment condition at 890c above eutectic line to reached austerity zone and under this line at 0,600c to obtained re-crystallization annealing and 400c0 at sufficient time 90min..chemical composition ,hardness ,micro-hardness ,and micro structures were investigated to track the effectiveness of diffusion zinc-copper melting in different s points.

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