Exploring Mechanisms of Ferroelectric Switching in Real Time Using In Situ TEM

2021 ◽  
Author(s):  
Christopher Reid Winkler
1993 ◽  
Vol 323 ◽  
Author(s):  
Yujing Wu ◽  
Elizabeth G. Jacobs ◽  
Cyrus Pouraghabagher ◽  
Russell F. Pinizzotto

AbstractThe formation and growth of Cu6Sn5 and Cu3Sn at the interface of Sn-Pb solder/copper substrate are factors which affect the solderability and reliability of electronic solder joints. The addition of particles such as Ni to eutectic Sn-Pb solder drastically affects the activation energies of formation for both intermetallics. This study was performed to understand the mechanisms of intermetallic formation and the effects of Ni on intermetallic growth. Cu/Sn and Cu/Sn/Ni thin films were deposited by evaporation and observed in the TEM in real time using a hot stage. The diffusion of Sn through Cu6Sn5 and Cu3Sn followed by reaction with Cu must occur for intermetallic formation and growth to take place. Ni is an effective diffusion barrier which prevents Sn from diffusing into Cu.


Nano Today ◽  
2020 ◽  
Vol 35 ◽  
pp. 100932
Author(s):  
Wei Li ◽  
Ming Li ◽  
Xueqing Wang ◽  
Pengcheng Xu ◽  
Haitao Yu ◽  
...  

2016 ◽  
Vol 22 (S3) ◽  
pp. 1366-1367 ◽  
Author(s):  
Jun Young Cheong ◽  
Joon Ha Chang ◽  
Jeong Yong Lee ◽  
Il-Doo Kim

2018 ◽  
Vol 24 (S1) ◽  
pp. 1812-1813
Author(s):  
Xiaoqing Pan ◽  
Lin-Ze Li ◽  
Mingjie Xu ◽  
Sheng Dai ◽  
Thomas Blum

2021 ◽  
Vol 284 ◽  
pp. 119743
Author(s):  
Shuohan Yu ◽  
Youhong Jiang ◽  
Yue Sun ◽  
Fei Gao ◽  
Weixin Zou ◽  
...  

2015 ◽  
Vol 639 ◽  
pp. 54-64 ◽  
Author(s):  
David Framil Carpeño ◽  
Takahito Ohmura ◽  
Ling Zhang ◽  
Jérôme Leveneur ◽  
Michelle Dickinson ◽  
...  

2000 ◽  
Vol 6 (S2) ◽  
pp. 1018-1019
Author(s):  
R. Alani ◽  
M. Pan

“In-situ” TEM studies is currently going through resurgence for materials microcharacterization. One important aspect of these studies has always been the image recording process. Traditionally, the following analog image recording techniques have been used: i) “static” images taken by photographic films and ii) viewing the images with a TV camera and recording them onto a videotape [1]. On the other hand, with the advent of CCD cameras and its rapid evolution for digital “static” imaging in TEM [2-3], “real-time” digital imaging for “in-situ” experimentation has been in high demand. In this work, we report the utilization of a new CCD camera for both “real-time” and “static” image acquisitions. The performance of the camera is shown for heating/cooling “in-situ” TEM experiments performed on an aluminum alloy using a double tilt hot stage.We have utilized a newly designed CCD camera that addresses imaging needs for “in-situ” applications.


2013 ◽  
Vol 56 (11) ◽  
pp. 2630-2635 ◽  
Author(s):  
LiFen Wang ◽  
Zhi Xu ◽  
ShiZe Yang ◽  
XueZeng Tian ◽  
JiaKe Wei ◽  
...  

Author(s):  
Charles W. Allen

Irradiation effects studies employing TEMs as analytical tools have been conducted for almost as many years as materials people have done TEM, motivated largely by materials needs for nuclear reactor development. Such studies have focussed on the behavior both of nuclear fuels and of materials for other reactor components which are subjected to radiation-induced degradation. Especially in the 1950s and 60s, post-irradiation TEM analysis may have been coupled to in situ (in reactor or in pile) experiments (e.g., irradiation-induced creep experiments of austenitic stainless steels). Although necessary from a technological point of view, such experiments are difficult to instrument (measure strain dynamically, e.g.) and control (temperature, e.g.) and require months or even years to perform in a nuclear reactor or in a spallation neutron source. Consequently, methods were sought for simulation of neutroninduced radiation damage of materials, the simulations employing other forms of radiation; in the case of metals and alloys, high energy electrons and high energy ions.


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