scholarly journals Review on the Integration of Microelectronics for E-Textile

Author(s):  
Abdella Ahmmed Simegnaw ◽  
Benny Malengier ◽  
Gideon K. Rotich ◽  
Melkie Getnet Tadesse ◽  
Lieva Van Langenhove

Modern electronic textiles are moving towards flexible wearable textiles, so-called e-textiles that have micro-electronic elements embedded onto the textile fabric that can be used for varied classes of functionalities. There are different methods of integrating rigid microelectronic components into/onto textiles for the development of smart textiles, which include, but are not limited to, physical, mechanical and chemical approaches. The integration systems must satisfy being flexible, lightweight, stretchable and washable to offer a superior usability, comfortability and non-intrusiveness. Furthermore, the resulting wearable garment needs to be breathable. In this review work, three levels of integration of the microelectronics into/onto the textile structures are discussed, the textile-adapted, the textile-integrated, and the textile-based integration. The textile-integrated and the textile- adapted e-textiles have failed to efficiently meet being flexible and washable. To overcome the above problems, researchers studied the integration of microelectronics into/onto textile at fiber or yarn level applying various mechanisms. Hence, a new method of integration, textile-based, has risen to the challenge due to the flexibility and washability advantages of the ultimate product. In general, the aim of this review is to provide a complete overview of the different interconnection methods of electronic components into/onto textile substrate.

Materials ◽  
2021 ◽  
Vol 14 (17) ◽  
pp. 5113
Author(s):  
Abdella Ahmmed Simegnaw ◽  
Benny Malengier ◽  
Gideon Rotich ◽  
Melkie Getnet Tadesse ◽  
Lieva Van Langenhove

Modern electronic textiles are moving towards flexible wearable textiles, so-called e-textiles that have micro-electronic elements embedded onto the textile fabric that can be used for varied classes of functionalities. There are different methods of integrating rigid microelectronic components into/onto textiles for the development of smart textiles, which include, but are not limited to, physical, mechanical, and chemical approaches. The integration systems must satisfy being flexible, lightweight, stretchable, and washable to offer a superior usability, comfortability, and non-intrusiveness. Furthermore, the resulting wearable garment needs to be breathable. In this review work, three levels of integration of the microelectronics into/onto the textile structures are discussed, the textile-adapted, the textile-integrated, and the textile-based integration. The textile-integrated and the textile-adapted e-textiles have failed to efficiently meet being flexible and washable. To overcome the above problems, researchers studied the integration of microelectronics into/onto textile at fiber or yarn level applying various mechanisms. Hence, a new method of integration, textile-based, has risen to the challenge due to the flexibility and washability advantages of the ultimate product. In general, the aim of this review is to provide a complete overview of the different interconnection methods of electronic components into/onto textile substrate.


Author(s):  
Abdella Ahmmed Simegnaw ◽  
Benny Malengier ◽  
Gideon K. Rotich ◽  
Melkie Getnet Tadesse ◽  
Lieva Van Langenhove

Modern electronic textiles are moving towards flexible wearable textiles, so-called e-textiles that have micro-electronic elements embedded onto the textile fabric that can be used for varied classes of functionalities. There are different methods of integrating rigid microelectronic components into/onto textiles for the development of smart textiles, which include, but are not limited to, physical, mechanical and chemical approaches. The integration systems must satisfy being flexible, lightweight, stretchable and washable to offer a superior usability, comfortability and non-intrusiveness. Furthermore, the resulting wearable garment needs to be breathable. In this review work, three levels of integration of the microelectronics into/onto the textile structures are discussed, the textile-adapted, the textile-integrated, and the textile-based integration. The textile-integrated and the textile- adapted e-textiles have failed to efficiently meet being flexible and washable. To overcome the above problems, researchers studied the integration of microelectronics into/onto textile at fiber or yarn level applying various mechanisms. Hence, a new method of integration, textile-based, has risen to the challenge due to the flexibility and washability advantages of the ultimate product. In general, the aim of this review is to provide a complete overview of the different interconnection methods of electronic components into/onto textile substrate.


Sensors ◽  
2020 ◽  
Vol 20 (8) ◽  
pp. 2383 ◽  
Author(s):  
Chi Cuong Vu ◽  
Jooyong Kim

Electronic textiles, also known as smart textiles or smart fabrics, are one of the best form factors that enable electronics to be embedded in them, presenting physical flexibility and sizes that cannot be achieved with other existing electronic manufacturing techniques. As part of smart textiles, e-sensors for human movement monitoring have attracted tremendous interest from researchers in recent years. Although there have been outstanding developments, smart e-textile sensors still present significant challenges in sensitivity, accuracy, durability, and manufacturing efficiency. This study proposes a two-step approach (from structure layers and shape) to actively enhance the performance of e-textile strain sensors and improve manufacturing ability for the industry. Indeed, the fabricated strain sensors based on the silver paste/single-walled carbon nanotube (SWCNT) layers and buffer cutting lines have fast response time, low hysteresis, and are six times more sensitive than SWCNT sensors alone. The e-textile sensors are integrated on a glove for monitoring the angle of finger motions. Interestingly, by attaching the sensor to the skin of the neck, the pharynx motions when speaking, coughing, and swallowing exhibited obvious and consistent signals. This research highlights the effect of the shapes and structures of e-textile strain sensors in the operation of a wearable e-textile system. This work also is intended as a starting point that will shape the standardization of strain fabric sensors in different applications.


2008 ◽  
Vol 1129 ◽  
Author(s):  
Joo-Hyung Kim ◽  
Kwangsun Kang ◽  
Sungryul Yun ◽  
Sangyeul Yang ◽  
Min-Hee Lee ◽  
...  

AbstractCellulose electro-active paper (EAPap) has attracted much attention as a new smart electronic material to be utilized as mechanical sensors, bio compatible applications and wireless communications. The thin EAPap film has many advantages such as lightweight, flexible, dryness, biodegradable, easy to chemically modify, cheap and abundance. Also EAPap film has a good reversibility for mechanical performance, such as bending movement, under electric field. The main actuation mechanism governed by piezoelectric property can be modulated by material direction and stretching ratio during process. In this paper we present the overview as well as fabrication process of cellulose EAPap as a novel smart material. Also we propose the method to enhance the piezoelectricity, its mechanical and electromechanical properties. In addition, the fabrication of high quality metal patterns with Schottky diode on the cellulose surface is an initiating stage for the integration of the EAPap actuator and electronic components. The integration of flexible actuator and electronic elements has huge potential application including flying magic carpets, microwave driven flying insets and micro-robots and smart wall papers.


2020 ◽  
Author(s):  
Sunbin Hwang ◽  
Minji Kang ◽  
Aram Lee ◽  
Sukang Bae ◽  
Seoung-Ki Lee ◽  
...  

Abstract Electronic textiles have been considered one of the desired device platforms due to their dimensional compatibility with fabrics by weaving them with yarn. However, the existing electronic textile platforms are generally composed of only one type of electronic component with a single function on a fiber substrate because of processing challenges. A precise connecting process between each electronic fiber is essential to configure the desired electronic circuits or systems. Here we present a chip on a fiber, a new electronic fiber platform, by introducing large scale integration of electronic device or circuit components onto a one-dimensional microfiber substrate. The electronic components such as transistors, inverters, ring oscillators, and thermocouples were integrated together onto the outer surface of a fiber substrate with precise semiconductor and electrode patterns. Our results show that the electronic components can be integrated on a single fiber with reliable operation. We evaluate the electronic properties of the chip on a fiber as a multifunctional electronic textile platform by testing their switching and data processing, as well as sensing or transducing units for detecting optical/thermal signals. The demonstration of the chip on a fiber suggests significant proof of concepts for realization of high performance with wearable electronic textile systems.


2021 ◽  
Author(s):  
Ikra Iftekhar Shuvo ◽  
Justine Decaens ◽  
Dominic Lachapelle ◽  
Patricia I. Dolez

Test methods for smart or electronic textiles (e-textiles) are critical to ensure product safety and industrial quality control. This paper starts with a review of three key aspects: (i) commercial e-textile products/technologies, (ii) safety and quality control issues observed or foreseen, and (iii) relevant standards published or in preparation worldwide. A total of twenty-two standards on smart textiles – by CEN TC 248/WG 31, IEC TC 124, ASTM D13.50, and AATCC RA111 technical committees – were identified; they cover five categories of e-textile applications: electrical, thermal, mechanical, optical, and physical environment. Based on the number of e-textile products currently commercially available and issues in terms of safety, efficiency, and durability, there is a critical need for test methods for thermal applications, as well as to a lesser degree, for energy harvesting and chemical and biological applications. The results of this study can be used as a roadmap for the development of new standardized test methods for safety & quality control of smart textiles.


2020 ◽  
pp. 152808372095740
Author(s):  
Xiaoxiao Wei ◽  
Mohamed Amine Aouraghe ◽  
Shasha Pang ◽  
Farial Islam Farha ◽  
Sidra Saleemi ◽  
...  

By virtue of the light-weight, high conductivity, and extraordinary strength, carbon nanotube yarns (CNT yarn, CNTY) are attractive candidates for promoting wearable electronic textiles. However, the unstable conductivity of the CNTY due to piezoelectric characterization of the CNTs may severely affect the conductive performance of the CNTY that is woven into smart textiles. Herein, we report a highly stretchable and stable electro-conductive yarn fabricated by wrapping CNTY on the multifilament polyester yarn (MPY). The stretchable CNTY/MPY wrapping yarn exhibited not only significant-high tensile force (∼727.60 cN) but also ultra-high tensile strain (∼142.76%) compared to pristine CNTY (tensile force ∼211 cN, strain ∼20%). Furthermore, the CNTY/MPY wrapping yarn displayed very limited decrement (<0.5%) of resistance changes after cyclic loading and could still work even during ∼60% stretching. Moreover, this CNTY/MPY wrapping yarn presented steady-state temperature (205.5 °C) with a high quick electro-thermal response (with 1 s) when applied with 2 V voltage. In addition, the CNTY/MPY wrapping yarn could retain the electro-thermal stability when sewed into gloves, displaying low temperature-changes (<2%) under various deformations. Our work explored the potential applications of CNTY/MPY wrapping yarn for wearable smart textiles.


2008 ◽  
Vol 1078 ◽  
Author(s):  
Siegfried Bauer

ABSTRACTFlexible and stretchable electronic components are currently at the heart of macroelectronics research. Materials useful for such applications are based on entropy elastic soft matter, combined with energy elastic functional elements. Examples include functional materials for sensing pressure and temperature changes, such as ferroelectrets, ferroelectric polymers, and nanocomposites of ferroelectric polymers and piezoelectric ceramics. Components for making flexible or stretchable electronic components additionally require electronic circuitry based on amorphous silicon or on organic semiconductors. Progress in such electronic elements is rapid, state of the art are elements which can easily operate at low voltage levels of 1 V. Combined with functional materials, sensing elements for temperature and pressure changes are easily achieved, as demonstrated with a few working examples of paper thin microphones, optothermal switching elements and skin-like electronics. Entropy-elastic elastomers form the basis for actuating elements, outlined by examples based on self organized actuating structures. Such materials can be also made functional by design, enabling fully reversible stretchable sensing elements for temperature, pressure and other physical parameters.


Sensors ◽  
2021 ◽  
Vol 21 (15) ◽  
pp. 5000
Author(s):  
Arkadiusz Hulewicz ◽  
Krzysztof Dziarski ◽  
Grzegorz Dombek

This article describes the measuring system and the influence of selected factors on the accuracy of thermographic temperature measurement using a macrolens. This method enables thermographic measurement of the temperature of a small object with an area of square millimeters as, e.g., electronic elements. Damage to electronic components is often preceded by a rise in temperature, and an effective way to diagnose such components is the use of a thermographic camera. The ability to diagnose a device under full load makes thermography a very practical method that allows us to assess the condition of the device during operation. The accuracy of such a measurement depends on the conditions in which it is carried out. The incorrect selection of at least one parameter compensating the influence of the factor occurring during the measurement may cause the indicated value to differ from the correct value. This paper presents the basic issues linked to thermographic measurements and highlights the sources of errors. A measuring stand which enables the assessment of the influence of selected factors on the accuracy of thermographic measurement of electronic elements with the use of a macrolens is presented.


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