Measurement And Simulation Calculation of Wire Bow Angle During The Diamond Wire Saw Process

2022 ◽  
Author(s):  
Zhiteng Xu ◽  
Hui Huang ◽  
Changcai Cui
Keyword(s):  
High Speed ◽  
Processing Parameters ◽  
Tension Force ◽  
Feed Speed ◽  
Diamond Wire ◽  
Wire Tension ◽  
Diamond Wire Saw ◽  
Simulation Calculation ◽  
The Wire ◽  
Sawing Process

Abstract The wire bow angle is an important factor that affects the shape precision of an ingot after the diamond wire sawing process. In this research, the wire bow angles of the inside and outside of an ingot were recorded with a high-speed camera. The effects of the processing parameters such as the wire tension force, feed speed, and wire speed on the wire bow angles inside and outside the ingot were analyzed. A numerical simulation model of the wire bow in the wire sawing process is presented in this paper to describe the wire bow angle inside the ingot. It was shown that the wire bow angle inside the ingot was smaller than that of outside the ingot for all of the processing parameters. The wire bow angles improved with the increase of the feed speed and decrease of the wire speed and the wire tension force. The results of the wire bow angle measurement of the inside ingot and the simulation calculation were similar for the process parameters.

Abrasive Distribution of the Fixed Diamond Wire in Wire Sawing Process

2012 ◽  
Vol 579 ◽  
pp. 145-152 ◽  
Author(s):  
Chun Hui Chung
Keyword(s):  
Material Removal ◽  
Wafer Surface ◽  
Operating Environment ◽  
Diamond Wire ◽  
Wire Saw ◽  
Diamond Wire Saw ◽  
Cutting Rate ◽  
The Wire ◽  
Fixed Diamond Wire ◽  
Sawing Process

Fixed diamond wire saw has the advantages such as higher cutting rate and clearer operating environment over the slurry wire saw in wafering. However, the higher cost and poor sliced wafer surface are still the obstacles for the diamond wire saw to totally replace slurry wire saw. In this study, the distribution of diamond grits on the wire was investigated by numerical simulation. The results show that there is a critical value of the abrasive interval to transfer the machining mechanism from plastic plowing to brittle indentation cracking for the material removal. The value depends on both the wire tension and bow angle during the operation.

Analysis of the Breakage of Diamond Wire Saws in Sawing of Stone

2006 ◽  
Vol 304-305 ◽  
pp. 123-126 ◽  
Author(s):  
Guo Qin Huang ◽  
Xi Peng Xu
Keyword(s):  
Fatigue Failure ◽  
Process Parameters ◽  
Processing Parameters ◽  
Diamond Wire ◽  
Wire Saw ◽  
Diamond Wire Saw ◽  
The Wire

An investigation is reported on the breakage of the diamond wire saw during stone processing. A Lot of breaken wire samples were collected from factories and observed macroscopically and microscopically. The results indicate that the breakages were mainly fatigue failure. And statistic of results show that all the breakage sites centralize on two sections. Reasons for the two break sections are also discussed in detail. Furthermore, sawing experiment was conducted to study the effect of the process parameters and the results reveal that the breakage of the wire saw is sensitive to the processing parameters. Finally, some proposals for manufacture and application were presented.

Experimental Research on Cutting of Silicon with Fixed Diamond Wire Saw

2010 ◽  
Vol 431-432 ◽  
pp. 25-28 ◽  
Author(s):  
Li Gang Zhao ◽  
Dun Wen Zuo ◽  
Yu Li Sun ◽  
Min Wang
Keyword(s):  
Surface Roughness ◽  
Experimental Research ◽  
Linear Velocity ◽  
Feed Speed ◽  
Diamond Wire ◽  
Wire Saw ◽  
Diamond Wire Saw ◽  
The Wire ◽  
Fixed Diamond Wire

The experimental research on silicon was reported in this paper. The surface roughness under the different workpiece feed speed and linear velocity of the wire saws is studied mainly in this experiment. The effects of the workpiece feed Vs and the linear velocity of the wire saws Vw were analyzed.

scholarly journals A Method For Cutting And Preparing Thin-Sections Of Frozen Soil

1977 ◽  
Vol 18 (78) ◽  
pp. 143-144 ◽  
Author(s):  
T.E. Osterkamp
Keyword(s):  
Cutting Forces ◽  
Frozen Soil ◽  
Operating Conditions ◽  
Operating Parameters ◽  
Thin Sections ◽  
Diamond Wire ◽  
Wire Saw ◽  
Diamond Wire Saw ◽  
The Wire

Abstract A diamond wire saw was modified for cutting thin sections of frozen soil and suitable operating conditions were determined experimentally. It was found that a lubricated wire, 0.34 mm in diameter, operaied at cutting velocities of 100-300 mm s-1 and cutting forces 0.02-0.1 kg produced smooth cut surfaces un thin sections 0.4-0.5 mm in thickness. The; temperature and wire size were not critical operating parameters and the wire tensions recommended by the manufacturer were satisfactory. A method of mounting the thin sections is also described.

Study on Removal Mechanism of Fixed-Abrasive Diamond Wire Saw Slicing Monocrystalline Silicon

2007 ◽  
Vol 359-360 ◽  
pp. 450-454 ◽  
Author(s):  
Yu Fei Gao ◽  
Pei Qi Ge ◽  
Zhi Jian Hou
Keyword(s):  
Monocrystalline Silicon ◽  
Wafer Surface ◽  
Removal Mechanism ◽  
Surface Formation ◽  
Diamond Wire ◽  
Brittle Ductile Transition ◽  
Wire Saw ◽  
Diamond Wire Saw ◽  
The Wire ◽  
Fixed Abrasive

The physical model of fixed-abrasive diamond wire-sawing monocrystalline silicon was founded to analyze the elastic deformation of the wire, supposing that every grit was connected to the surface of the wire by a spring. Ignoring lateral vibration of the wire, the geometrical model of wire-sawing was founded; the average cut depth of single grit was calculated theoretically. Based the indentation fracture mechanics and investigations on brittle-ductile transition of machining monocrystalline silicon, the removal mechanism and surface formation was studied theoretically. It shows that in the case of wire-sawing velocity of 10m/s or higher, infeed velocity of 0.20mm/s and diamond grain size of 64μm or smaller, the chip formation and material removal is in a brittle regime mainly, but the silicon wafer surface formation is sawed in a ductile regime. The size of the abrasives, the wire-saw velocity and infeed velocity can influence the sawing process obviously.

Study on Electroplated Diamond Wire Saw Development and Wire Saw Wear Analysis

2009 ◽  
Vol 416 ◽  
pp. 311-315 ◽  
Author(s):  
Pei Qi Ge ◽  
Yu Fei Gao ◽  
Shao Jie Li ◽  
Zhi Jian Hou
Keyword(s):  
Current Density ◽  
High Performance ◽  
Experimental Studies ◽  
Cathode Current Density ◽  
Diamond Wire ◽  
Wire Saw ◽  
Diamond Wire Saw ◽  
Cathode Current ◽  
The Wire ◽  
Electroplating Process

Development of high performance diamond impregnated wire is the key of application for fixed-abrasive wire sawing technology. In this paper, some experimental studies were done for development of electroplated diamond wire saw by employing the bright nickel bath. The wire saw electroplating process was developed, the effects of cathode current density and time at tack-on stage on diamond grits density and adhesion between saw matrix and plating coating were discussed. The wire saw cutting experiments were carried out for analysis the used wire wear using the scanning electron microscope (SEM). The experimental results show the optimum tack-on current density to obtain the wire saw with good abrasive distribution and adhesion is 1.5~2.0A/dm2, and the time of pre-plating, tack-on and buildup is 6, 8~10 and 18min in turn. Diamond wire saw wear includes coating wear and grain-abrasion, and the primary wear form is grits pulled-out.

Experimental Study on Reciprocating Electroplated Diamond Wire Saws Cutting SiC Wafer

2010 ◽  
Vol 450 ◽  
pp. 296-299 ◽  
Author(s):  
Xiao Ye Wang ◽  
Yan Li ◽  
Shu Juan Li
Keyword(s):  
Surface Quality ◽  
Tangential Force ◽  
Cutting Speed ◽  
Work Piece ◽  
Feed Speed ◽  
Diamond Wire ◽  
Wire Saw ◽  
Diamond Wire Saw ◽  
Sic Wafer

The experiment that WXD170-type reciprocating rotating diamond wire saw cuts SiC wafer was studied using orthogonal test method in this paper. The influence of cutting speed of diamond wire saw, work-piece feed speed and rotating speed of work-piece on cutting process were analyzed. The optimized cutting parameters which can improve surface quality of slices and reduce tangential force were obtained. The results show that: the surface quality of slices which was cloud-shaped can be improved significantly due to the increase of the work-piece rotation. The work-piece feed speed and the rotation speed have greater impact on the tangential force than the saw wire speed; the work-piece feed speed and the work-piece rotation speed have greater impact on surface roughness than the saw wire speed. An important way to be obtained the smaller tangential force and better surface quality of slices is considering of a reasonable match among cutting speed of diamond wire saw, work-piece feed speed and rotating speed of work-piece comprehensively.

An Experimental Research on the Force and Energy During the Sapphire Sawing Using Reciprocating Electroplated Diamond Wire Saw

2017 ◽  
Vol 139 (12) ◽  
Author(s):  
Hui Huang ◽  
Xixi Li ◽  
Xipeng Xu
Keyword(s):  
Crystal Structure ◽  
Sapphire Crystal ◽  
Diamond Wire ◽  
Sawing Force ◽  
Linear Relationships ◽  
Wire Saw ◽  
Diamond Wire Saw ◽  
Tangential Forces ◽  
Sawing Process ◽  
Stable Stage

This study investigated the sawing of A-plane and C-plane sapphires using the reciprocating diamond wire saw. The influences of process parameters and sapphire crystal structure on sawing force were experimentally researched. The experimental results indicated that, in sapphire sawing process, the sapphire crystal structure, the wire speed, and the feed rate had effects on the tangential sawing forces, and the tangential forces had good linear relationships with the material removal rates (MRRs). The specific sawing energies in the stable stage were clearly smaller than in the unstable stage.

scholarly journals Optimization of Machining Parameters of SiC Single Crystal Cut by Diamond Wire Saw

2018 ◽  
Vol 232 ◽  
pp. 03002 ◽  
Author(s):  
Lun Li ◽  
Shaodong Yang ◽  
Jishun Li
Keyword(s):  
Single Crystal ◽  
Process Parameters ◽  
Grey System Theory ◽  
Orthogonal Experimental Design ◽  
Feed Speed ◽  
Machining Parameters ◽  
Grey System ◽  
Diamond Wire ◽  
Wire Saw ◽  
Diamond Wire Saw

For the process of optimizing the process parameters in the process of cutting the hard and brittle materials such as single-crystal SiC by diamond wire saw, the process parameters such as wire saw speed, workpiece feed speed and workpiece rotation speed are the design variables, and the sawing force and surface roughness are the processing targets by orthogonal experimental design. The grey system theory is introduced to optimize the multi-objective cutting process. According to the experimental data, the grey correlation resolution coefficient is determined. The significant relationship between the processing parameters and the target characteristics is analyzed. The optimal combination of process parameters under multi-target conditions is obtained, namely the workpiece feed rate is 0.025mm/min, the wire saw speed is 1.6m/s, and the workpiece rotating speed is 16r/min.

A Spraying Method for Development of Diamond Wire Saw

2011 ◽  
Vol 175 ◽  
pp. 249-253
Author(s):  
Chun Yan Yao ◽  
Jin Sheng Wang ◽  
Wei Peng
Keyword(s):  
Removal Rate ◽  
Rotation Frequency ◽  
Work Piece ◽  
Feed Speed ◽  
Ultraviolet Curing ◽  
Diamond Wire ◽  
Wire Saw ◽  
Diamond Wire Saw ◽  
Novel Method ◽  
Selection Of

Slicing the wafers with diamond wire saw is recently paid much attention. This study proposes a novel method for developing a kind of diamond wire saws with ultraviolet curing resin and spraying technique. The process of wire saw manufacturing and the selection of optimal parameters are introduced. The experiments of the slicing marble are carried out using different diamond wire saws. The effects of wire saw running speed, work-piece in-feed speed, work-piece rotation frequency on the material removal rate, and surface roughness were investigated. Result shows that new method for development of diamond wire saw is feasible.

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