scholarly journals Effect of Ultrasonic Compound Cutting on the Microstructure and Properties of Formed Chip

2021 ◽  
Author(s):  
Haimeng Sun ◽  
Feng Jiao ◽  
Ying Niu ◽  
Zhuangfei Wang
Keyword(s):  
Mechanical Properties ◽  
Plastic Deformation ◽  
Dislocation Density ◽  
Strain Rate ◽  
Ultrasonic Vibration ◽  
Pure Copper ◽  
Equivalent Model ◽  
3D Fem ◽  
Motion Characteristics ◽  
Sever Plastic Deformation

Abstract Sever plastic deformation (SPD) with high strain rate can increase the material dislocation density, reduce the grain size and improve the mechanical properties. In this paper, ultrasonic compound cutting (UCC) was proposed to improve the efficiency of preparing ultra-fine grained (UFG) pure copper by sever plastic deformation methods. The motion characteristics and strain rate model of UCC were analyzed, and it was concluded that ultrasonic vibration can increase the strain rate in the primary shear zone. According to the 3D FEM equivalent model of UCC, the UCC and traditional compound cutting (TCC) were compared and analyzed from the perspective of strain rate. The simulation results show that ultrasonic vibration can significantly increase the strain rate of chip. The microstructure and mechanical properties of pure copper chip were studied by using a self-developed machining device. The experiment results show that the grain refinement, dislocation density and micro-hardness of pure copper chip were significantly improved in UCC. When the ultrasonic amplitude is 3 µm, the UCC chip grains are about 2.66 µm and the hardness reaches 124 HV, which is about 8% higher than the hardness of TCC chip. The findings of this research provide an important reference for machining UFG pure copper with enhanced mechanical properties.

scholarly journals Accumulative Roll Bonding of Pure Copper and IF Steel

2014 ◽  
Vol 2014 ◽  
pp. 1-9 ◽  
Author(s):  
Saeed Tamimi ◽  
Mostafa Ketabchi ◽  
Nader Parvin ◽  
Mehdi Sanjari ◽  
Augusto Lopes
Keyword(s):  
Mechanical Properties ◽  
Plastic Deformation ◽  
Accumulative Roll Bonding ◽  
Pure Copper ◽  
Rolling Process ◽  
Ultrafine Grain ◽  
Crystallographic Structure ◽  
Interstitial Free ◽  
If Steel ◽  
Roll Bonding

Severe plastic deformation is a new method to produce ultrafine grain materials with enhanced mechanical properties. The main objective of this work is to investigate whether accumulative roll bonding (ARB) is an effective grain refinement technique for two engineering materials of pure copper and interstitial free (IF) steel strips. Additionally, the influence of severely plastic deformation imposed by ARB on the mechanical properties of these materials with different crystallographic structure is taken into account. For this purpose, a number of ARB processes were performed at elevated temperature on the materials with 50% of plastic deformation in each rolling pass. Hardness of the samples was measured using microhardness tests. It was found that both the ultimate grain size achieved, and the degree of bonding depend on the number of rolling passes and the total plastic deformation. The rolling process was stopped in the 4th cycle for copper and the 10th cycle for IF steel, until cracking of the edges became pronounced. The effects of process temperature and wire-brushing as significant parameters in ARB process on the mechanical behaviour of the samples were evaluated.

Influence of plastic deformation temperature on the structure and mechanical properties of low-alloy copper alloys with Co, Ni and B

2017 ◽  
Vol 84 (2) ◽  
pp. 49-57 ◽  
Author(s):  
B. Grzegorczyk ◽  
W. Ozgowicz
Keyword(s):  
Mechanical Properties ◽  
Plastic Deformation ◽  
Strain Rate ◽  
Minimum Temperature ◽  
Deformation Temperature ◽  
Tensile Testing ◽  
Copper Alloys ◽  
Testing Machine ◽  
Temperature Range ◽  
Ductility Minimum

Purpose: This work presents the influence of chemical composition and plastic deformation temperature of CuCoNi and CuCoNiB as well as CuCo2 and CuCo2B alloys on the structure, mechanical properties and, especially on the inter-crystalline brittleness phenomenon and ductility minimum temperature effect in tensile testing with strain rate of 1.2·10-3 s-1 in the range from 20°C to 800°C. Design/methodology/approach: The tensile test of the investigated copper alloys was realized in the temperature range of 20-800°C with a strain rate of 1.2·10-3 s–1 on the universal testing machine. Metallographic observations of the structure were carried out on a light microscope and the fractographic investigation of fracture on an electron scanning microscope. Findings: Low-alloy copper alloys such as CuCo2 and CuCo2B as well as CuCoNi and CuCoNiB show a phenomenon of minimum plasticity at tensile testing in plastic deforming temperature respectively from 500°C to 700°C for CuCo2, from 450°C to 600°C for CuCo2B and from 450°C to 600°C for CuCo2B and from 500°C to 600°C for CuCoNiB. Practical implications: In result of tensile tests of copper alloys it has been found that the ductility minimum temperature of the alloys equals to about 500°C. At the temperature of stretching of about 450°C the investigated copper alloys show maximum strength values. Originality/value: Based on the test results the temperature range for decreased plasticity of CuCoNi and CuCoNiB as well as CuCo2 and CuCo2B alloys was specified. This brittleness is a result of decreasing plasticity in a determined range of temperatures of deforming called the ductility minimum temperature.

Direct consolidation of pure aluminum and pure copper powders subjected to plastic deformation and evaluation of their mechanical properties

2019 ◽  
Vol 2019.54 (0) ◽  
pp. 182
Author(s):  
Shun NAGAI ◽  
Sho TAKEDA ◽  
Hiroyuki MIKI ◽  
Takamichi MIYAZAKI ◽  
Hiroyuki KOSUKEGAWA ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Plastic Deformation ◽  
Pure Aluminum ◽  
Pure Copper ◽  
Copper Powders

An Experimental Evaluation on Change in Impedance of TRIP Steel Subjected to Plastic Deformation at Various Strain Rates

2013 ◽  
Vol 535-536 ◽  
pp. 445-448 ◽  
Author(s):  
Daiki Inoshita ◽  
Shiro Yamanaka ◽  
Takeshi Iwamoto
Keyword(s):  
Mechanical Properties ◽  
Plastic Deformation ◽  
Martensitic Transformation ◽  
Strain Rate ◽  
Trip Steel ◽  
Rate Sensitivity ◽  
Volume Resistivity ◽  
Strain Rates ◽  
Trip Steels ◽  
The Relationship

For automotive industries, weight of an automobile can be reduced if TRIP steel which has excellent mechanical properties dominated by strain-induced martensitic transformation (SIMT) can be applied to shock absorption members. However, strain rate sensitivity of TRIP steels has not been fully understood because a relationship between a strain rate and an amount of martensite produced by SIMT is still unclear. In previous studies, volume resistivity and impedance have been measured to obtain information on the amount of produced martensite, however, these studies have not been succeeded to clarify the relationship. Here, by focusing a property that martensite shows ferromagnetism, it is attempted that impedance of TRIP steel is measured at various strain rates during the deformation by using prototype coil and circuits.

Experimental study of the simultaneous effects of severe plastic deformation and secondary radial strain on copper

2021 ◽  
pp. 095440892110244
Author(s):  
Seyyed Ehsan Eftekhari Shahri ◽  
Mohammad Amin Ranaei ◽  
Hossein Jamshidi ◽  
Elyas Rezaei
Keyword(s):  
Mechanical Properties ◽  
Electrical Conductivity ◽  
Plastic Deformation ◽  
Severe Plastic Deformation ◽  
Copper Wire ◽  
Pure Copper ◽  
Radial Strain ◽  
High Strength ◽  
Homogeneous Structure ◽  
Direct Extrusion

Due to the widespread use of copper wires in electrical power transmission, the need for raw materials with a homogeneous structure and high strength while maintaining their conductive properties is of high importance. The present study investigates the production of copper wire with improved mechanical properties and homogeneous microstructure due to its nanometre-sized structure. Therefore, the commercial pure copper specimens were subjected to severe plastic deformation (SPD) by means of equal channel angular pressing (ECAP) during four steps at ambient temperature. Due to the creation of a structure with elongated grains in the ECAP process, the deformed specimens were subjected to the direct extrusion operations; thus, a more homogeneous structure was created in them due to the appearance of a secondary radial strain. The obtained results indicate that by applying the simultaneous effects of SPD and direct extrusion on the microstructure, the mechanical properties such as strength and hardness have improved significantly, while the electrical conductivity of pure copper decreased slightly. The outcome can be used as an alternative to current methods for producing high-strength copper wires with suitable electrical conductivity properties.

Modeling of the Plastic Deformation of Polycrystalline Materials in Micro and Nano Level Using Finite Element Method

2013 ◽  
Vol 22 ◽  
pp. 41-60 ◽  
Author(s):  
Mohammad Jafari ◽  
Saeed Ziaei-Rad ◽  
Nima Nouri
Keyword(s):  
Mechanical Properties ◽  
Plastic Deformation ◽  
Finite Element ◽  
Dislocation Density ◽  
Grain Boundary ◽  
Constitutive Equations ◽  
Nanocrystalline Materials ◽  
Boundary Phase ◽  
Polycrystalline Materials ◽  
Microcrystalline Materials

Recent experiments on polycrystalline materials show that nanocrystalline materials have a strong dependency to the strain rate and grain size in contrast to the microcrystalline materials. In this study, mechanical properties of polycrystalline materials in micro and nanolevel were studied and a unified notation for them was presented. To completely understand the rate-dependent stress-strain behavior and size-dependency of polycrystalline materials, a dislocation density based model was presented that can predict the experimentally observed stress-strain relations for these materials. In nanocrystalline materials, crystalline and grain-boundary were considered as two separate phases. The mechanical properties of the crystalline phase were modeled using viscoplastic constitutive equations, which take dislocation density evolution and diffusion creep into account, while an elasto-viscoplastic model based on diffusion mechanism was used for the grain boundary phase. For microcrystalline materials, the surface-to-volume ratio of the grain boundaries is low enough to ignore its contribution to the plastic deformation. Therefore, the grain boundary phase was not considered in microcrystalline materials and the mechanical properties of the crystalline phase were modeled using an appropriate dislocation density based constitutive equation. Finally, the constitutive equations for polycrystalline materials were implemented into a finite-element code and the results obtained from the proposed constitutive equations were compared with the experimental data for polycrystalline copper and good agreement was observed.

scholarly journals Mechanical Properties of Copper Processed by Equal Channel Angular Pressing

2017 ◽  
Vol 17 (2) ◽  
pp. 124-129
Author(s):  
K. Sülleiová ◽  
B. Ballóková ◽  
M. Besterci ◽  
T. Kvačkaj
Keyword(s):  
Mechanical Properties ◽  
Plastic Deformation ◽  
Grain Size ◽  
Equal Channel Angular Pressing ◽  
Dynamic Equilibrium ◽  
Pure Copper ◽  
Angular Pressing ◽  
Static Tensile ◽  
Strength And Ductility ◽  
Test Stress

Abstract The development of the nanostructure in commercial pure copper and the strength and ductility after severe plastic deformation (SPD) with the technology of equal channel angular pressing (ECAP) are analysed. Experimental results and analyses showed that both strength and ductility can be increased simultaneously by SPD. The final grain size decreased from the initial 50μm by SPD to 100-300 nm after 10 passes. An increase of the ductility together with an increase of strength caused by SPD are explained by a strong grain refinement and by a dynamic equilibrium of weakening and strengthening, and it is visible on the final static tensile test stress-strain charts.

328 Microstructure and Mechanical Properties of Copper Processed by Sever Plastic Deformation

2015 ◽  
Vol 2015.23 (0) ◽  
pp. _328-1_-_328-5_
Author(s):  
Masaomi Baba ◽  
Tetsuya Fujimura ◽  
Takaei Yamamoto ◽  
Terutoshi Yakushiji ◽  
Masahiro Goto
Keyword(s):  
Mechanical Properties ◽  
Plastic Deformation ◽  
Microstructure And Mechanical Properties ◽  
Sever Plastic Deformation

The Mechanical Behavior of a Grain Boundary-Rich (Nanocrystalline) Metal

1991 ◽  
Vol 229 ◽  
Author(s):  
M. J. Mayo
Keyword(s):  
Mechanical Properties ◽  
Plastic Deformation ◽  
Grain Boundary ◽  
Strain Rate ◽  
Gas Phase ◽  
Wear Debris ◽  
Microstructural Feature ◽  
Dislocation Glide ◽  
Sources And Sinks ◽  
Diffusional Flow

AbstractNanocrystalline copper has been produced by two different techniques -- gas phase condensation and mechanical wear. Both nanocrystalline coppers have hardnesses and strain rate sensitivities that are greater than those of conventional, large-grained copper. These properties differences are tentatively explained on the basis of the two routes by which grain boundaries traditionally influence plastic deformation: by acting as barriers to dislocation glide, and by providing the vacancy sources and sinks necessary to facilitate diffusional flow. Additionally, there are notable differences in the mechanical properties of the two nanocrystalline coppers. Although the materials appear quite similar microstructurally, nanoindentation experiments show that the wear debris is 50% harder and 3 times more strain rate sensitive than the gas phase condensation-produced copper. These differences indicate that the microstructures are probably not as similar as first perceived, and that a previously overlooked microstructural feature may be influencing deformation in one or both of the materials.

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