scholarly journals Thermal measurements of integrated inductors in CMOS technology and simple 1D analytical model of heat conduction

2014 ◽  
Author(s):  
I. Papagiannopoulos ◽  
M. Kaluza ◽  
B. Wiecek ◽  
A. Hatzopoulos ◽  
V. Chatziathanasiou ◽  
...  
Keyword(s):  
Heat Conduction ◽  
Analytical Model ◽  
Cmos Technology ◽  
Integrated Inductors ◽  
Thermal Measurements

scholarly journals Influence of the Static Pre-Stress in Micro-Viscothermoelastic Resonators Based on Dual-Phase-Lagging Heat Conduction

2020 ◽  
Vol 2020 ◽  
pp. 1-8
Author(s):  
Najat A. Alghamdi ◽  
Hamdy M. Youssef
Keyword(s):  
Heat Conduction ◽  
Energy Dissipation ◽  
Thermal Behavior ◽  
Quality Factor ◽  
Analytical Model ◽  
Relaxation Times ◽  
Mechanical Relaxation ◽  
Length Scale ◽  
Dual Phase ◽  
Quality Factors

Thermal and mechanical relaxation times play vital roles in the values of the quality factor of micro/nanoresonators. They can control the energy dissipation across the coupling of mechanical and thermal behavior. In this paper, we introduce an analytical model that considers a pre-stress in a micro-viscothermoelastic resonator to modify the thermal and mechanical relaxation times and thus higher the quality factor. The impacts of length scale and static pre-stress on the quality factor have been discussed. The model expects that significant improvement in terms of quality factors is possible by tuning the pre-stress and the thermal and mechanical relaxation times parameters, and the isothermal value of frequency have significant effects on the thermal quality factor of the resonators.

scholarly journals MOS Current Mode Logic with Capacitive Coupling

2012 ◽  
Vol 2012 ◽  
pp. 1-7 ◽  
Author(s):  
Kirti Gupta ◽  
Neeta Pandey ◽  
Maneesha Gupta
Keyword(s):  
Analytical Model ◽  
Digital Circuits ◽  
Logic Gates ◽  
Current Mode ◽  
Cmos Technology ◽  
Capacitive Coupling ◽  
Ring Oscillator ◽  
Switching Speed ◽  
Current Mode Logic

A new MOS current mode logic (MCML) style exhibiting capacitive coupling to enhance the switching speed of the digital circuits is proposed. The mechanism of capacitive coupling and its effect on the delay are analytically modeled. SPICE simulations to validate the accuracy of the analytical model have been carried out with TSMC 0.18 μm CMOS technology parameters. Several logic gates such as five-stage ring oscillator, NAND, XOR2, XOR3, multiplexer, and demultiplexer based on the proposed logic style are implemented and their performance is compared with the conventional logic gates. It is found that the logic gates based on the proposed MCML style lower the delay by 23 percent. An asynchronous FIFO based on the proposed MCML style has also been implemented as an application.

scholarly journals Ultra-Low-Voltage CMOS-Based Current Bleeding Mixer with High LO-RF Isolation

2014 ◽  
Vol 2014 ◽  
pp. 1-5 ◽  
Author(s):  
Gim Heng Tan ◽  
Roslina Mohd Sidek ◽  
Harikrishnan Ramiah ◽  
Wei Keat Chong ◽  
De Xing Lioe
Keyword(s):  
Low Voltage ◽  
Supply Voltage ◽  
Cmos Technology ◽  
Third Order ◽  
Chip Area ◽  
Integrated Inductors ◽  
Low Voltage Operation ◽  
Dc Power ◽  
Current Bleeding ◽  
Intercept Point

This journal presents an ultra-low-voltage current bleeding mixer with high LO-RF port-to-port isolation, implemented on 0.13 μm standard CMOS technology for ZigBee application. The architecture compliments a modified current bleeding topology, consisting of NMOS-based current bleeding transistor, PMOS-based switching stage, and integrated inductors achieving low-voltage operation and high LO-RF isolation. The mixer exhibits a conversion gain of 7.5 dB at the radio frequency (RF) of 2.4 GHz, an input third-order intercept point (IIP3) of 1 dBm, and a LO-RF isolation measured to 60 dB. The DC power consumption is 572 µW at supply voltage of 0.45 V, while consuming a chip area of 0.97 × 0.88 mm2.

scholarly journals Modelling and Prediction of Cutting Temperature in the Machining of H13 Hard Steel of Transient Heat Conduction

Materials ◽  
2021 ◽  
Vol 14 (12) ◽  
pp. 3176
Author(s):  
Jingjie Zhang ◽  
Xiangfei Meng ◽  
Jin Du ◽  
Guangchun Xiao ◽  
Zhaoqiang Chen ◽  
...  
Keyword(s):  
Heat Conduction ◽  
Analytical Model ◽  
Cutting Tools ◽  
Cutting Temperature ◽  
Transient State ◽  
Transient Heat Conduction ◽  
Conduction Model ◽  
Cutting Heat ◽  
Fourier Heat Conduction ◽  
Pass Through

Cutting heat conduction undergoes three stages that include intensity transient-state, transient-state, and steady-states. Especially during machining with coated cutting tools, in the conduction process, cutting heat needs to pass through a few micron thick coatings and then flow into the tool body. This heat conduction presents typical non-Fourier heat conduction characteristics. This paper focuses on the cutting temperature in transient heat conduction with a coated tool. A new analytical model to characterize the thermal shock based on the non-Fourier heat conduction was proposed. The distribution of cutting temperature in mono-layer coated tools during the machining was then illustrated. The cutting temperature distribution predicted by the Fourier heat conduction model was employed to compare with that by non-Fourier heat conduction in order to reveal the non-Fourier heat conduction effect in transient heat conduction. The results show that the transient heat conduction analytical model is more suitable for the intensity transient-state and transient-state in the process of cutting heat conduction.

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