scholarly journals Радиоизлучение, создаваемое электрическим пробоем пленки полипропилена

Author(s):  
В.А. Пахотин ◽  
Н.Т. Сударь

During electrical breakdown of a thin film of polypropylene, radiation of a radio pulse was detected. The pulse duration is about 400 ns. The spectrum of the radio pulse consists of three main frequencies. The relationship between the breakdown channel resistance and the observed spectrum is substantiated

2020 ◽  
Author(s):  
Viktoria Kapralova ◽  
Vladimir Pakhotin ◽  
Nicolay Sudar

1996 ◽  
Vol 43 (9) ◽  
pp. 1592-1601 ◽  
Author(s):  
S.J. Bijlsma ◽  
H. van Kranenburg ◽  
K.J.B.M. Nieuwesteeg ◽  
M.G. Pitt ◽  
J.F. Verweij

Author(s):  
Rajiv Paul ◽  
Anil K. Kulkarni ◽  
Jogender Singh

Sintering is the process of making materials from powder form by heating the powder below its melting point until the particles fuse to each other. Field assisted sintering technology (FAST), also sometimes known as spark plasma sintering (SPS), uses a pulsed and/or continuous electric current along with the simultaneous application of compressive pressure which leads to extremely high heating rates and short processing durations. A high relative density and small grain size promote superior properties such as greater hardness and electrical breakdown. Hence, selection of the proper sintering parameters is of paramount importance and a predictive model would be extremely useful in narrowing the range of experimental parameters. This will drastically reduce the number of extra attempts at obtaining certain properties in a material and save experimentation time, effort and material to name a few. Four of the most important FAST parameters: target temperature, holding time, heating rate and initial particle size, have been reviewed to assess their effect on the densification, hardening and grain growth of Alumina, Copper, Silicon Carbide, Tungsten and Tungsten Carbide through extensive literature survey. The relationship between each has been incorporated in a Microsoft Excel program which acts as a predictive tool to determine an estimate of the final properties based on the initial parameters chosen. This is done by curve fitting a polynomial onto the existing data points as closely as possible and using the polynomial to obtain final properties as a function of the initial parameters. The model was verified against an existing paper which sought to obtain the optimum sintering parameters for Copper. While the actual experimentation range was 400°C to 800°C, the program would have suggested a much narrower range from 650°C to 800°C and hence saved unnecessary additional efforts.


Author(s):  
Pornvitoo Rittinon ◽  
Ken Suzuki ◽  
Hideo Miura

Copper thin films are indispensable for the interconnections in the advanced electronic products, such as TSV (Trough Silicon Via), fine bumps, and thin-film interconnections in various devices and interposers. However, it has been reported that both electrical and mechanical properties of the films vary drastically comparing with those of conventional bulk copper. The main reason for the variation can be attributed to the fluctuation of the crystallinity of grain boundaries in the films. Porous or sparse grain boundaries show very high resistivity and brittle fracture characteristic in the films. Thus, the thermal conductivity of the electroplated copper thin films should be varied drastically depending on their micro texture based on the Wiedemann-Franz’s law. Since the copper interconnections are used not only for the electrical conduction but also for the thermal conduction, it is very important to quantitatively evaluate the crystallinity of the polycrystalline thin-film materials and clarify the relationship between the crystallinity and thermal properties of the films. The crystallinity of the interconnections were quantitatively evaluated using an electron back-scatter diffraction method. It was found that the porous grain boundaries which contain a significant amount of vacancies increase the local electrical resistance in the interconnections, and thus, cause the local high Joule heating. Such porous grain boundaries can be eliminated by control the crystallinity of the seed layer material on which the electroplated copper thin film is electroplated.


1997 ◽  
Vol 471 ◽  
Author(s):  
W. Eccleston

ABSTRACTThe drift of electrons in the channels of Thin Film Transistors is analysed for discrete grains separated by grain boundaries containing amorphous silicon. The model provides the relationship channel mobility and grain size. The relationship between drain current and the terminal voltages is also predicted. The model relates to normal high current region of transistor operation.


2013 ◽  
Vol 723 ◽  
pp. 136-140
Author(s):  
Yi Hua Nie ◽  
Ping Liu ◽  
Li Xin Xu ◽  
Jie Ding

In this paper, rolling thin film oven is used to heat No.70 road asphalt to simulate asphalt aging. Six aging time tests of 0min, 40min, 85min, 180min, 240min and 300min were carried and the relationship of asphalt performance indexes before and after aging was got as well as four components. The analysis results indicate that: as the aging time increases, change processes of all performance indexes followed curve of index and the correlation coefficient reached significant level. Changing regularity of asphalt four components are also got: the contents of saturate and aromatic both decrease with the aging time increasing, while asphaltene content and resin content increased and the increasing speed of resin is faster. Key words: No.70 road asphalt; four components; performance index; aging.


2005 ◽  
Vol 291-292 ◽  
pp. 475-482 ◽  
Author(s):  
Koichi Okuda ◽  
Masayuki Nunobiki

This study aims at clarifying the relationship between the surface integrity of PTFE finished by an ultra-precision diamond cutting and the adhesion strength of a metal thin film. As the first step of this study, the basic properties such as surface integrity in the diamond cutting of PTFE and the effect of the surface roughness on the textile water repellency are demonstrated in this report. The following remarks were found. The measured roughness of finished surface largely exceeded the theoretical roughness, while the cutting force was very small comparing with aluminum and the flow type chips were formed. The surface with a smaller roughness tended to repel water.


2017 ◽  
Vol 2017 ◽  
pp. 1-5 ◽  
Author(s):  
Masashi Yamamoto ◽  
Shiro Nagaoka ◽  
Hironobu Umemoto ◽  
Keisuke Ohdaira ◽  
Takashi Nishiyama ◽  
...  

We examined an environmentally friendly photoresist removal method using H radicals produced by decomposing hydrogen on a hot iridium catalyst. We examined the relationship between photoresist removal rate and its surface temperature using thin film interference and the removal properties using H radicals produced by the Ir catalyst. Decomposition behavior at polymer surface by radicals may be analyzed in further detail from the aspect of kinetics. Additionally, we investigated the oxygen addition effects on the removal rate. The photoresist removal rate increased with the oxygen additive amount and then decreased more gradually than in the case of using W filament. The increasing behavior was similar but there was a large difference between W and Ir catalyst in the decreasing behavior.


2014 ◽  
Vol 635-637 ◽  
pp. 882-885
Author(s):  
Yun Ping Cheng ◽  
Wen Ge Wu ◽  
Xiao Jun Du ◽  
Gui Ling Qiao

Cutting force is one of important parameters for manufacturing processes. The traditional dynamometer is limited by size, machining environments, and so on. This paper introduces a new constantan thin film sensor which embedded on the holder of external turning tool to measure cutting force. The relationship between force and output voltage are deduced from theory. By using the finite element software, the analyses on induction and linearity capability of thin film sensor are simulated, and the influences of the location and thickness of film on the output voltage are analyzed. The results show that the linearity of input and output is good and the deviation between the calculated value and simulation results is identical. As the result, the constantan thin film sensor unit can be used to measure the cutting forces.


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