Investigation for Quality Estimation Mechanism of Gas Pressure Welds. A Non-destructive Inspection Method of Gas Pressure Welds with Buldge Removal by Hot Shearing (Report 2).

Pipelines play an important role in the national/international transportation of natural gas, petroleum products, and other energy resources. Pipelines are set up in different environments and consequently suffer various damage challenges, such as environmental electrochemical reaction, welding defects, and external force damage, etc. Defects like metal loss, pitting, and cracks destroy the pipeline’s integrity and cause serious safety issues. This should be prevented before it occurs to ensure the safe operation of the pipeline. In recent years, different non-destructive testing (NDT) methods have been developed for in-line pipeline inspection. These are magnetic flux leakage (MFL) testing, ultrasonic testing (UT), electromagnetic acoustic technology (EMAT), eddy current testing (EC). Single modality or different kinds of integrated NDT system named Pipeline Inspection Gauge (PIG) or un-piggable robotic inspection systems have been developed. Moreover, data management in conjunction with historic data for condition-based pipeline maintenance becomes important as well. In this study, various inspection methods in association with non-destructive testing are investigated. The state of the art of PIGs, un-piggable robots, as well as instrumental applications, are systematically compared. Furthermore, data models and management are utilized for defect quantification, classification, failure prediction and maintenance. Finally, the challenges, problems, and development trends of pipeline inspection as well as data management are derived and discussed.

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Numerical Simulation and Experimental Study of Capacitive Imaging Technique as a Non-Destructive Testing Method

10.20944/preprints202103.0397.v1 ◽

2021 ◽

Author(s):

Farima Abdollahi Mamoudan ◽

Sebastien Savard ◽

Tobin Filleter ◽

Clemente Ibarra-Castanedo ◽

Xavier Maldague

Keyword(s):

Numerical Simulation ◽

Surface Defects ◽

Capacitive Sensor ◽

Experimental Result ◽

Destructive Testing ◽

Fe Modelling ◽

Inspection Method ◽

Physical Experiments ◽

Imaging Performance ◽

Non Destructive

It was recently demonstrated that a co-planar capacitive sensor could be applied to the evaluation of materials without the disadvantages associated with the other techniques. This technique effectively detects changes in the dielectric properties of the materials due to, for instance, imperfections or variations in the internal structure, by moving a set of simple electrodes on the surface of the specimen. An AC voltage is applied to one or more electrodes and signals are detected by others. This is a promising inspection method for imaging the interior structure of the numerous materials, without the necessity to be in contact with the surface of the sample. In this paper, Finite Element (FE) modelling was employed to simulate the electric field distribution from a co-planar capacitive sensor and the way it interacts with a non-conducting sample. Physical experiments with a prototype capacitive sensor were also performed on a Plexiglas sample with sub-surface defects, to assess the imaging performance of the sensor. A good qualitative agreement was observed between the numerical simulation and experimental result.

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Innovative digital inspection methodology

The APPEA Journal ◽

10.1071/aj19109 ◽

2020 ◽

Vol 60 (1) ◽

pp. 77

Author(s):

Stephen A Anderson

Keyword(s):

Laser Scanning ◽

Design Parameters ◽

Destructive Testing ◽

Inspection Method ◽

Digital Twin ◽

3D Space ◽

Twin Models ◽

Quality Programs ◽

Non Destructive ◽

Digital Record

The paper describes an innovative digital inspection methodology that combines 3D laser scanning, metrology and advanced non-destructive testing data that is merged in 3D space to provide a digital record of the condition and mechanical integrity of critical assets. This advanced inspection method supports condition-based maintenance programs and digital twin models to determine future equipment condition, work scope and inspection schedules, while maintaining a digital record throughout the equipment lifecycle. Testing of the methodology includes 3D scanning of drill platforms, baseline scanning of blowout preventers and sheaves, for quality purposes, and the use of augmented reality for viewing scans. Phased array testing has been conducted on sub-components such as slew ring bolting. Data are combined into digital reports that show 3D images of the equipment with precise dimensional data and identified inspection areas. Such reports can be combined with digital twin models to confirm integrity of the equipment for certificate of conformance and baseline data for future integrity comparisons as equipment ages. This innovative inspection methodology will set a new standard for how equipment data are captured, stored and represented. The process provides a range of benefits for OEMs, drilling contractors and operators alike, including digital quality programs to baseline new equipment condition and compare with design parameters, delivering condition and integrity assessments of critical equipment items in-situ or on deck, providing a consistent methodology for inspection and dimensional control of operational equipment items, and providing precise equipment data that can complement digital twin and real time monitoring programs.

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Non-Destructive Inspection Method for Detecting Open Failures in Flip Chip Structures

Advances in Electronic Packaging, Parts A, B, and C ◽

10.1115/ipack2005-73109 ◽

2005 ◽

Cited By ~ 10

Author(s):

Yuhki Sato ◽

Hideo Miura

Keyword(s):

Nondestructive Evaluation ◽

Flip Chip ◽

Evaluation Method ◽

Local Deformation ◽

Blue Laser ◽

Inspection Method ◽

Bonding Structure ◽

Small Change ◽

Non Destructive ◽

Adhesion Condition

A new nondestructive evaluation method of adhesion condition between a Si chip and small metallic bumps in a flip chip bonding structure is proposed. The local deformation of a surface of a Si chip mounted on a substrate increases drastically between two bumps with decrease of the thickness of the chip thinner than 200 μm. The magnitude of the local deformation exceeds 100 nm easily. Once the lack or delamination of the metallic bumps occurs at the interface, the local deformation at a surface of a Si chip around the bump changes remarkably. The change of the magnitude of the local deformation reaches about 50 nm to 600 nm depending on the thickness of the chip. Such a small change of deformation can be measured using a scanning blue laser microscope. Therefore, the adhesion condition of the area-arrayed bumps can be examined by measuring the local deformation of a surface of an LSI chip mounted on a substrate.

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