scholarly journals Failure Analysis and Optimization of the Tie Rod Using FEA

2021 ◽  
Vol 9 (8) ◽  
pp. 2781-2786
Author(s):  
Shraddha Shrikrushna Bhirad
Keyword(s):  
Failure Analysis ◽  
Cost Effective ◽  
Steering Wheel ◽  
Minimum Period ◽  
Time To Market ◽  
Hollow Section ◽  
Stress Optimization ◽  
Effective Product ◽  
Fea Analysis ◽  
Suspension Performance

Abstract: A car’s steering wheel is used to connect the steering gear which is connect to the wheels via the tie rod ends. The main use of the tie rod end is to ensure the wheels are aligned. Hence the functioning of tie rod is crucial for steering as well as suspension performance of vehicle. Today’s world is competitive with respective to efficiency as well as economical in price, every organization striving for cost effective product at a lower price and within minimum period for ‘time to market. In this work, an attempt is made on optimization of the tier rod through changing materials and to reducing the weight. FEA analysis is performed on solid section and hollow sections with different thicknesses. The stress results at critical locations for different design iterations are discussed in this work. From the FEA results it is observed that the effected wright for hollow section is reduced by 18.15 % compare to solid section. Keywords: Tie rod, ANSYS, CATIA, Stress, optimization

Application of Fast Laser Deprocessing Techniques in Physical Failure Analysis on SRAM Memory of Advance Technology

2014 ◽  
Author(s):  
H.H. Yap ◽  
P.K. Tan ◽  
G.R. Low ◽  
M.K. Dawood ◽  
H. Feng ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Integrated Circuit ◽  
Cost Effective ◽  
Tetraethyl Orthosilicate ◽  
Ic Design ◽  
Advance Technology ◽  
Defect Identification ◽  
Technology Scaling ◽  
And Function ◽  
Metal Layers

Abstract With technology scaling of semiconductor devices and further growth of the integrated circuit (IC) design and function complexity, it is necessary to increase the number of transistors in IC’s chip, layer stacks, and process steps. The last few metal layers of Back End Of Line (BEOL) are usually very thick metal lines (>4μm thickness) and protected with hard Silicon Dioxide (SiO2) material that is formed from (TetraEthyl OrthoSilicate) TEOS as Inter-Metal Dielectric (IMD). In order to perform physical failure analysis (PFA) on the logic or memory, the top thick metal layers must be removed. It is time-consuming to deprocess those thick metal and IMD layers using conventional PFA workflows. In this paper, the Fast Laser Deprocessing Technique (FLDT) is proposed to remove the BEOL thick and stubborn metal layers for memory PFA. The proposed FLDT is a cost-effective and quick way to deprocess a sample for defect identification in PFA.

A Sample Preparation on Decapsulation Methodology for Effective Failure Analysis on Thin Small Leadless (TSLP) Flip Chip Package with Copper Pillar (CuP) Bump Interconnect Technology

2014 ◽  
Author(s):  
Gwee Hoon Yen ◽  
Ng Kiong Kay
Keyword(s):  
Sample Preparation ◽  
Failure Analysis ◽  
Flip Chip ◽  
Fault Localization ◽  
Cost Effective ◽  
Fault Isolation ◽  
Voltage Contrast ◽  
Interconnect Technology

Abstract Today, failure analysis involving flip chip [1] with copper pillar bump packaging technologies would be the major challenges faced by analysts. Most often, handling on the chips after destructive chemical decapsulation is extremely critical as there are several failure analysis steps to be continued such as chip level fault localization, chip micro probing for fault isolation, parallel lapping [2, 3, 4] and passive voltage contrast. Therefore, quality of sample preparation is critical. This paper discussed and demonstrated a quick, reliable and cost effective methodology to decapsulate the thin small leadless (TSLP) flip chip package with copper pillar (CuP) bump interconnect technology.

Review on modification strategies of polyethylene/polypropylene immiscible thermoplastic polymer blends for enhancing their mechanical behavior

2018 ◽  
Vol 51 (4) ◽  
pp. 291-336 ◽  
Author(s):  
Antimo Graziano ◽  
Shaffiq Jaffer ◽  
Mohini Sain
Keyword(s):  
High Performance ◽  
Cost Effective ◽  
Good Method ◽  
Waste Recycling ◽  
Industrial Applications ◽  
Polymer Waste ◽  
Reactive Compatibilization ◽  
Brittle To Ductile Transition ◽  
Commercial Applications ◽  
Effective Product

Blends of polyethylene (PE) and polypropylene (PP) have always been the subject of intense reasearch for encouraging polymer waste recycling while producing new materials for specific applications in a sustainable way. However, being thermodynamically immiscible, these polyolefins form a binary system usually exhibiting lower performances compared with those of the homopolymers. Many studies have been carried out to better understand the PE/PP blend compatibilization for developing a high-performance and cost-effective product. Both nonreactive and reactive compatibilization promote the brittle to ductile transition for a PE/PP blend. However, the final product usually does not meet the requirements for high demanding commercial applications. Therefore, further PE/PP modification with a reinforcing filler, being either synthetic or natural, proved to be a good method for manufacturing high-performance reinforcend polymer blend composites, with superior and tailored properties. This review summarizes the recent progress in compatibilization techniques applied for enhancing the interfacial adhesion between PE and PP. Moreover, future perspectives on better understanding the influence of themodynamics on PE/PP synergy are discussed to introduce more effective compatibilization strategies, which will allow this blend to be used for innovative industrial applications.

Designing Composites for Graceful Failure

2020 ◽  
Author(s):  
Amany Micheal ◽  
Yehia Bahei-El-Din ◽  
Mahmoud E. Abd El-Latief
Keyword(s):  
Mechanical Properties ◽  
Energy Dissipation ◽  
Composite Laminates ◽  
Ultimate Load ◽  
Low Cost ◽  
Cost Effective ◽  
Carbon Composite ◽  
Three Point Bending ◽  
Glass Carbon ◽  
Effective Product

Abstract When inevitable, failure in composite laminates is preferred to occur gracefully to avoid loss of property and possibly life. While the inherent inhomogeneity leads to slow dissipation of damage-related energy, overall failure is fiber-dominated and occurs in a rather brittle manner. Multidirectional plies usually give a more ductile response. Additionally, stiffness and strength as well as cost are important factors to consider in designing composite laminates. It is hence desirable to optimize for high mechanical properties and low cost while keeping graceful failure. Designing composite laminates with hybrid systems and layups, which permit gradual damage energy dissipation, are two ways proposed in this work to optimize for mechanical properties while avoiding catastrophic failure. In the hybrid system design, combining the less expensive glass reinforced plies with carbon reinforced plies offers a cost-effective product, marginal mechanical properties change and ductile profile upon failure. Hybrid glass/carbon composite laminates subjected to three-point bending showed strain to failure which is double that measured for carbon composite specimens, without affecting the ultimate load. Energy dissipation mechanisms were also created by building laminates which were intentionally made discontinuous by introducing cuts in the fibers of the interior plies. This created a longer path for damage before cutting through the next ply resulting in double failure strain with marginal reduction in load. The effect of fiber discontinuity in terms of spacing and distribution are among the factors considered.

Adding More Agility to Software Product Line Methods

2014 ◽  
Vol 5 (4) ◽  
pp. 17-34 ◽  
Author(s):  
Kun Tian
Keyword(s):  
Cost Effective ◽  
Software Product Line ◽  
Product Line ◽  
Time To Market ◽  
Engineering Software ◽  
Software Product ◽  
Agile Practices ◽  
Market Needs ◽  
Development Methods ◽  
Development Application

Software Product Line Methods (SPLMs) have been continuously gaining attention, especially in practice, for on one hand, they address diverse market needs while controlling costs by planned systematic reuse in core assets development (domain engineering), and on another hand, they reduce products' time-to-market, achieving a certain level of agility in product development (application engineering). More cost-effective and agile as they are than traditional development methods for producing families of similar products, SPLMs still seem to be heavy weight in nature. In SPLMs, significant up-front commitments are involved in development of a flexible product platform, which will be modified into a range of products sharing common features. Agile Methods (AMs) share similar goals with SPLMs, e.g., on rapidly delivering high quality software that meets the changing needs of stakeholders. However, they appear to differ significantly practices. The purpose of this work is to compare Agile and Software Product line approaches from fundamental goals/principles, engineering, software quality assurance, sand project management perspectives, etc. The results of the study can be used to determine the feasibility of tailoring a software product line approach with Agile practices, resulting in a lighter-weight approach that provides mass customization, reduced time-to-market, and improved customer satisfaction.

Construction of a cost-effective failure analysis service network––microelectronic failure analysis service in Japan

2002 ◽  
Vol 42 (4-5) ◽  
pp. 511-521 ◽  
Author(s):  
S Nakajima ◽  
S Nakamura ◽  
K Kuji ◽  
T Ueki ◽  
T Ajioka ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Cost Effective ◽  
Service Network
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