Atomic Layer Deposition of InN Using Trimethylindium and Ammonia Plasma

10.26434/chemrxiv.7269506.v2 ◽

2018 ◽

Author(s):

Petro Deminskyi ◽

Polla Rouf ◽

Ivan G. Ivanov ◽

Henrik Pedersen

Keyword(s):

Thin Films ◽

Atomic Layer Deposition ◽

Atomic Layer ◽

Film Deposition ◽

High Electron ◽

Low Carbon ◽

Carbon Level ◽

Ammonia Plasma ◽

Layer Deposition ◽

Film Bulk

<div>InN is a low band gap, high electron mobility semiconductor material of interest to optoelectronics and telecommunication. Such applications require the deposition of uniform crystalline InN thin films on large area substrates, with deposition temperatures compatible with this temperature-sensitive material. As conventional chemical vapor deposition (CVD) struggles with the low temperature tolerated by the InN crystal, we hypothesize that a time-resolved, surface-controlled CVD route could offer a way</div><div>forward for InN thin film deposition. In this work, we report atomic layer deposition of crystalline, wurtzite InN thin films using trimethylindium and ammonia plasma on Si (100). We found a narrow ALD window of 240–260 °C with a deposition rate of 0.36 Å/cycle and that the flow of ammonia into the plasma is an important parameter for the crystalline quality of the film. X-ray photoelectron spectroscopy measurements shows nearly stoichiometric InN with low carbon level (< 1 atomic %) and oxygen level (< 5 atomic %) in the film bulk. The low carbon level is attributed to a favorable surface chemistry enabled by the NH<sub>3</sub> plasma. The film bulk oxygen content is attributed to oxidation upon exposure to air via grain boundary diffusion and possibly by formation of oxygen containing species in the plasma discharge.</div>

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Atomic Layer Deposition of InN Using Trimethylindium and Ammonia Plasma

10.26434/chemrxiv.7269506.v3 ◽

2019 ◽

Author(s):

Petro Deminskyi ◽

Polla Rouf ◽

Ivan G. Ivanov ◽

Henrik Pedersen

Keyword(s):

Thin Films ◽

Atomic Layer Deposition ◽

Atomic Layer ◽

Film Deposition ◽

High Electron ◽

Low Carbon ◽

Carbon Level ◽

Ammonia Plasma ◽

Layer Deposition ◽

Film Bulk

<div>InN is a low band gap, high electron mobility semiconductor material of interest to optoelectronics and telecommunication. Such applications require the deposition of uniform crystalline InN thin films on large area substrates, with deposition temperatures compatible with this temperature-sensitive material. As conventional chemical vapor deposition (CVD) struggles with the low temperature tolerated by the InN crystal, we hypothesize that a time-resolved, surface-controlled CVD route could offer a way</div><div>forward for InN thin film deposition. In this work, we report atomic layer deposition of crystalline, wurtzite InN thin films using trimethylindium and ammonia plasma on Si (100). We found a narrow ALD window of 240–260 °C with a deposition rate of 0.36 Å/cycle and that the flow of ammonia into the plasma is an important parameter for the crystalline quality of the film. X-ray photoelectron spectroscopy measurements shows nearly stoichiometric InN with low carbon level (< 1 atomic %) and oxygen level (< 5 atomic %) in the film bulk. The low carbon level is attributed to a favorable surface chemistry enabled by the NH<sub>3</sub> plasma. The film bulk oxygen content is attributed to oxidation upon exposure to air via grain boundary diffusion and possibly by formation of oxygen containing species in the plasma discharge.</div>

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Atomic Layer Deposition of Inn Using Trimethylindium and Ammonia Plasma

10.26434/chemrxiv.7269506.v1 ◽

2018 ◽

Author(s):

Petro Deminskyi ◽

Polla Rouf ◽

Ivan G. Ivanov ◽

Henrik Pedersen

Keyword(s):

Thin Films ◽

Atomic Layer Deposition ◽

Atomic Layer ◽

Film Deposition ◽

High Electron ◽

Low Carbon ◽

Carbon Level ◽

Ammonia Plasma ◽

Layer Deposition ◽

Film Bulk

<div>InN is a low band gap, high electron mobility semiconductor material of interest to optoelectronics and telecommunication. Such applications require the deposition of uniform crystalline InN thin films on large area substrates, with deposition temperatures compatible with this temperature-sensitive material. As conventional chemical vapor deposition (CVD) struggles with the low temperature tolerated by the InN crystal, we hypothesize that a time-resolved, surface-controlled CVD route could offer a way</div><div>forward for InN thin film deposition. In this work, we report atomic layer deposition of crystalline, wurtzite InN thin films using trimethylindium and ammonia plasma on Si (100). We found a narrow ALD window of 240–260 °C with a deposition rate of 0.36 Å/cycle and that the flow of ammonia into the plasma is an important parameter for the crystalline quality of the film. X-ray photoelectron spectroscopy measurements shows nearly stoichiometric InN with low carbon level (< 1 atomic %) and oxygen level (< 5 atomic %) in the film bulk. The low carbon level is attributed to a favorable surface chemistry enabled by the NH<sub>3</sub> plasma. The film bulk oxygen content is attributed to oxidation upon exposure to air via grain boundary diffusion and possibly by formation of oxygen containing species in the plasma discharge.</div>

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Characteristics of ZnO Thin Film by Atomic Layer Deposition for Film Bulk Acoustic Resonator

Materials Science Forum ◽

10.4028/www.scientific.net/msf.449-452.977 ◽

2004 ◽

Vol 449-452 ◽

pp. 977-980 ◽

Cited By ~ 1

Author(s):

S.G. Kim ◽

Seung Boo Jung ◽

Ji Hun Oh ◽

H.J. Kim ◽

Yong Hyeon Shin

Keyword(s):

Thin Films ◽

Atomic Layer Deposition ◽

Magnetron Sputtering ◽

Atomic Layer ◽

Rf Magnetron Sputtering ◽

Acoustic Resonator ◽

Film Deposition ◽

Layer Deposition ◽

Film Bulk Acoustic Resonator ◽

Film Bulk

Polycrystalline ZnO thin films were for the first time deposited on SiO2/Si (100) substrate using 2-step deposition; atomic layer deposition (ALD) and RF magnetron sputtering, for Film Bulk Acoustic Resonator (FBAR) applications. The film deposition performed in this study was composed of following two procedures; the 1st deposition was using ALD method and 2nd deposition was using RF magnetron sputtering. The ZnO buffer layer ALD films were deposited using alternating diethylzinc (DEZn)/H2O exposures and ultrahigh purity argon gas for purging. Exposure time of 1 sec and purge time of 23 sec yielded an ALD cycle time. Two-step deposited ZnO films revealed stronger c-axis preferred-orientation than one-step deposited. Therefore, this method could be applied to the FBAR applications, since FBAR devices require high quality of thin films.

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Plasma Enhanced Atomic Layer Deposition of ZrO2 Gate Dielectric

MRS Proceedings ◽

10.1557/proc-716-b2.1 ◽

2002 ◽

Vol 716 ◽

Author(s):

Jaehyoung Koo ◽

Jiwoong Han ◽

Sungwoo Choi ◽

Chan Gyung Park ◽

Yangdo Kim ◽

...

Keyword(s):

Dielectric Constant ◽

Atomic Layer Deposition ◽

Leakage Current ◽

Oxygen Plasma ◽

Gate Dielectric ◽

Atomic Layer ◽

Interface Layer ◽

Film Deposition ◽

Low Carbon ◽

Layer Deposition

AbstractZirconium oxide (ZrO2) films were investigated as a potential replacement for silicon dioxide gate dielectric. ZrO2 films were deposited by both atomic layer deposition (ALD) and plasma enhanced ALD (PEALD) techniques using Zr t-butoxide and Zr(NEt2)4 as Zr precursors and oxygen as reactant gas. The XTEM images showed a randomly oriented polycrystalline structure of ZrO2 and amorphous characteristics of the interfacial layer. The calculated dielectric constant value of the ZrO2 films are about 10∼18 and these low values are believed due to the low dielectric constant interface layer. ZrO2 films deposited with oxygen plasma using Zr(NEt2)4 showed the leakage current of 3.12X10-9 A/cm2 at the gate bias voltage of -1.0 Volt with the equivalent oxide thickness value of 1.39 nm. ZrO2 films deposited with the oxygen plasma showed generally improved film quality with relatively low leakage current, small hysteresis and low carbon incorporation as well as the higher growth rate compared to the films deposited with the oxygen gas. Also, ZrO2 films deposited using Zr(NEt2)4 showed relatively improved film properties compared to the films deposited using Zr t-butoxide. This study demonstrated the possible application of PEALD technique for the high quality ZrO2 gate dielectric film deposition.

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Electrochemical Atomic Layer Deposition (EC-ALD) Low Cost Synthesis of Engineered Materials a Short Review

Advances in Materials Science and Engineering ◽

10.33140/amse/02/01/11 ◽

2018 ◽

Vol 2 (1) ◽

Keyword(s):

Thin Films ◽

Atomic Layer Deposition ◽

Communication Systems ◽

Atomic Layer ◽

Mass Scale ◽

Silicon Compound ◽

Scale Production ◽

High Electron ◽

Electron Hole ◽

Layer Deposition

Having mastered the technology of epitaxial deposition of crystalline thin films (i.e. homo and heteroepitaxy) on crystalline substrates has already been found providing better device designs with numerous advantages in the development of microelectronics devices and circuits. Consequently, mass-scale production of epitaxial thin films could successfully be developed and used in fabricating discrete devices and integrated circuits (ICs) using silicon/compound semiconductors commercially. Especially, realizing the hetero-epitaxial interfaces possessing two-dimensional electron/hole gas (2DEG/2DHG) sheets could offer very-high electron/hole mobilities for producing high-electronmobility transistors (HEMTs) and amplifiers for microwave/millimeter-wave communication systems. However, the major limitation of this technology was its requirement of extremely high cost infrastructures. Subsequently, the rising demands of the technologies to produce large-size displays/electronics systems, and large-numbers of sensors/ actuators in Internet of Thing (IoT) made it imminent for the researchers to explore replacing the existing cost intensive technologies by more affordable ones. In such an endeavor, developing a simpler and alternate epitaxial technology became imminent to look for. Incidentally, electrodeposition based epitaxy attracted the attention of the researchers by employing potentiostatic set-up for understanding the growth kinetics of the ionic species involved. While going through these studies, starting with the deposition of metallic/semiconducting thin films, atomic-layer epitaxial depositions could be successfully made and named as electrochemical atomic layer deposition (EC-ALD). Despite numerous attempts made for almost two decades in this fascinating field the related technology is not yet ready for its commercial exploitations. Some of the salient features of this process (i.e. commonly known as EC-ALD or EC-ALE) are examined here with recent results along with future prospects. Indexing Terms: Vapor Phase Epitaxy (VPE), Liquid Phase Epitaxy (LPE), Atomic Layer Deposition, Atomic Layer Epitaxy (ALE), and Molecular Beam Epitaxy (MBE); Electrochemical Atomic Layer Deposition (EC-ALD)

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Alternative Surface Reaction Route in the Atomic Layer Deposition of Titanium Nitride Thin Films for Electrode Applications

ACS Applied Electronic Materials ◽

10.1021/acsaelm.0c01079 ◽

2021 ◽

Vol 3 (2) ◽

pp. 999-1005

Author(s):

Hyeok Jae Lee ◽

Jin Ha Hwang ◽

Ji-Yong Park ◽

Sang Woon Lee

Keyword(s):

Thin Films ◽

Atomic Layer Deposition ◽

Titanium Nitride ◽

Surface Reaction ◽

Atomic Layer ◽

Reaction Route ◽

Layer Deposition

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Depositing High-Performance Conductive Thin Films by Using Atomic Layer Deposition

Applied Mechanics and Materials ◽

10.4028/www.scientific.net/amm.764-765.138 ◽

2015 ◽

Vol 764-765 ◽

pp. 138-142 ◽

Cited By ~ 1

Author(s):

Fa Ta Tsai ◽

Hsi Ting Hou ◽

Ching Kong Chao ◽

Rwei Ching Chang

Keyword(s):

Thin Films ◽

Atomic Layer Deposition ◽

High Performance ◽

Atomic Layer ◽

Electric Properties ◽

X Ray Diffraction ◽

Layer Deposition ◽

Azo Thin Film ◽

Aluminum Doped Zinc Oxide ◽

Conductive Thin Films

This work characterizes the mechanical and opto-electric properties of Aluminum-doped zinc oxide (AZO) thin films deposited by atomic layer deposition (ALD), where various depositing temperature, 100, 125, 150, 175, and 200 °C are considered. The transmittance, microstructure, electric resistivity, adhesion, hardness, and Young’s modulus of the deposited thin films are tested by using spectrophotometer, X-ray diffraction, Hall effect analyzer, micro scratch, and nanoindentation, respectively. The results show that the AZO thin film deposited at 200 °C behaves the best electric properties, where its resistance, Carrier Concentration and mobility reach 4.3×10-4 Ωcm, 2.4×1020 cm-3, and 60.4 cm2V-1s-1, respectively. Furthermore, microstructure of the AZO films deposited by ALD is much better than those deposited by sputtering.

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