Towards Sustainable Timber Construction Through the Application of Wood-Wood Connections

2020 ◽  
Author(s):  
Y. Weinand
Keyword(s):  
Numerical Methods ◽  
Free Form ◽  
Assembly Process ◽  
Structural Elements ◽  
Structural Behaviour ◽  
Timber Construction ◽  
Depth Study ◽  
Environmental Requirements ◽  
Ancient Wood ◽  
Simple Assembly

<p>This paper introduces a series of sustainable timber construction using wood-wood connections, which are driven from environmental requirements. These constructions are based on geometries like origami and free-form instead of standard structural elements. In addition, to predict the structural behaviour, the simplified numerical methods for accurately modelling are used. The aim of these case studies is to better explore the value of wood-wood connections as inheritance of ancient culture and extend research on their integration into design processes. Through the design, manufacturing and assembly stage, the connections are investigated as a driver for architectural forms. The utilisation of these innovative connections with minimised metal connectors ensures the rapid, precise and simple assembly process. With in-depth study and innovation of the ancient wood-wood connections, experience in prefabricated timber structure not only offers new geometrical opportunities, but also expands the understanding of integration of ancient and modern cultures.</p>

scholarly journals Masonry performance in earthquakes

1974 ◽  
Vol 7 (4) ◽  
pp. 149-166
Author(s):  
O. A. Glogau
Keyword(s):  
Earthquake Damage ◽  
Structural Behaviour ◽  
Damage Potential ◽  
Timber Construction

Past and current methods describing the damage potential of an earthquake are reviewed and discussed in relation to actual earthquake damage. The performance of a number of structures subjected to intense shaking is described with particular reference to their detailing. Examples are given showing the effect of infilling walls on structural behaviour. Veneer on timber construction is discussed. The points made are illustrated with figures and photographs.

scholarly journals TransPrint: A Method for Fabricating Flexible Transparent Free-Form Displays

2019 ◽  
Vol 2019 ◽  
pp. 1-14 ◽  
Author(s):  
Walther Jensen ◽  
Ashley Colley ◽  
Jonna Häkkilä ◽  
Carlos Pinheiro ◽  
Markus Löchtefeld
Keyword(s):  
Best Practices ◽  
Rapid Prototyping ◽  
Inkjet Printing ◽  
Screen Printing ◽  
Free Form ◽  
Assembly Process ◽  
Broad Applicability ◽  
Require Power

TransPrint is a method for fabricating flexible, transparent free-form displays based on electrochromism. Using screen-printing or inkjet printing of electrochromic ink, plus a straightforward assembly process, TransPrint enables rapid prototyping of displays by nonexperts. The displays are nonlight-emissive and only require power to switch state and support the integration of capacitive touch sensing for interactivity. We present instructions and best practices on how to design and assemble the displays and discuss the benefits and shortcomings of the TransPrint approach. To demonstrate the broad applicability of the approach, we present six application prototypes.

MEMS Die Warpage During Curing of Die Attach Material

2015 ◽  
Author(s):  
Hohyung Lee ◽  
Ruiyang Liu ◽  
Seungbae Park ◽  
Xiaojie Xue
Keyword(s):  
Material Properties ◽  
Residual Strain ◽  
Critical Role ◽  
Measurement Data ◽  
Curing Process ◽  
Assembly Process ◽  
Structural Elements ◽  
Mems Sensor ◽  
Fea Model ◽  
Die Attach

Microelectromechanical system (MEMS) packages are vulnerable to stresses due to its functional structure. During the assembly process of the package, stresses stemming out of CTE mismatches of the structural elements and curing of the die attach material can cause warpage of the MEMS die [1]. Even though die attach material takes relatively small volumetric portion of the package, it plays a critical role in warpage of the die due to its location and sensitivity of a MEMS sensor. Most of virgin die attach adhesives are in a state of viscous liquid and, as it is cured the material properties such as modulus and CTE change. Accordingly, residual strain is cumulated on MEMS die after curing process and signal trim process is required. Therefore, the material properties changes depending on the curing profile is valuable information for assembly process of the MEMS package. To monitor the material properties changes and shrinkage during curing process, strain and modulus of a die attach material are measured in each curing step. Also, to investigate the material property change depending on the curing profile, two different curing profiles are used. Experimental data show that die attach materials are gradually cured after each thermal cycling, which cause the increment of the modulus and glass transition temperature (Tg) with shrinkage at elevated temperature. Using the measurement data, FEA model is built to predict the warpage of the MEMS die. In the FEA model, residual strain on MEMS die is calculated by inputting material properties of die attach in each curing step. Also, die warpage of the package during the curing process is monitored using an optical profiler for the validation of the simulation results.

Numerical methods in construction

2018 ◽  
Author(s):  
Владимир Чемодуров ◽  
Vladimir Chemodurov ◽  
Элла Литвинова ◽  
Ella Litvinova
Keyword(s):  
Numerical Methods ◽  
Differential Equations ◽  
Strain State ◽  
System Analysis ◽  
Dynamic Loads ◽  
Analytical Models ◽  
Building Structures ◽  
Structural Elements ◽  
Complex Technical Systems ◽  
Technical Systems

The monograph deals with the development of models of stress-strain state of structural elements, the study of the behavior of building structures under the influence of dynamic loads using differential equations; methods of discretization of analytical models of the functioning of building structures and design of complex technical systems (system analysis problems). It is intended for scientific and technical workers, it will be useful to students in the areas of training 08.03.01 and 08.04.01 "Construction".

Accurate and simple assembly process of shape memory alloy tubular micro manipulator with a bias mechanism

2011 ◽  
Vol 88 (8) ◽  
pp. 2683-2686 ◽  
Author(s):  
Takashi Mineta ◽  
Shinya Kudoh ◽  
Eiji Makino ◽  
Takahiro Kawashima ◽  
Takayuki Shibata
Keyword(s):  
Shape Memory Alloy ◽  
Shape Memory ◽  
Assembly Process ◽  
Micro Manipulator ◽  
Simple Assembly

scholarly journals Diagnostics of the strength and stiffness of the loader carrier system structural elements in terms of thinning of walls by numerical methods

Diagnostyka ◽  
2021 ◽  
Vol 22 (3) ◽  
pp. 73-71
Author(s):  
Varvara Piterska ◽  
Oleksii Nemchuk ◽  
Viktor Orobey ◽  
Oleksandr Lymarenko ◽  
Olga Sherstiuk ◽  
...  
Keyword(s):  
Numerical Methods ◽  
Structural Elements ◽  
Carrier System ◽  
Strength And Stiffness

3D-CERAMIC INTERCONNECTION DEVICES

2011 ◽  
Vol 2011 (CICMT) ◽  
pp. 000306-000311
Author(s):  
Pascal METAYER
Keyword(s):  
Low Cost ◽  
High Volume ◽  
High Dimensional ◽  
Assembly Process ◽  
Laser Structuring ◽  
High Volume Production ◽  
Volume Production ◽  
Materials Used ◽  
Simple Assembly ◽  
Design Freedom

Electronic packaging can benefit from 3D interconnect devices that combine mechanical and electrical functions on a single 3D-shape part. Design freedom, miniaturisation, simple assembly process, low cost and reliability are some of the advantages that stimulate innovation or replacement of existing products. This monolithic concept was developed for high volume production with moulded thermoplastics as materials used for circuit carriers. Ceramic counterparts have been implemented so far to a smaller extent although their thermal, mechanical and dielectric make them suitable for applications requiring high dimensional stability. This article presents the use of ceramics for 3D-interconnect devices. Ceramics properties will be highlighted with some existing applications. Fabrication processes will be overviewed with emphasis on laser structuring.

An Efficient Technique for Derivation of the Kurtosis of Offshore Structural Response Due to Random Morison Wave Loading

2004 ◽  
Author(s):  
G. Najafian ◽  
R. Burrows ◽  
R. G. Tickell
Keyword(s):  
Structural Response ◽  
Computational Effort ◽  
Complex Structures ◽  
Structural Elements ◽  
Wave Loading ◽  
Structural Behaviour ◽  
Evaluation Procedures ◽  
Probabilistic Description ◽  
Non Gaussian

Nonlinear wave loading leads to non-Gaussian offshore structural response so that higher-order statistical moments, such as kurtosis, are often necessary for its probabilistic description. The existing models for determination of these moments are computationally very demanding. Consequently, the distributed wave loading on the structure is idealised by a relatively small number of nodal loads, requiring care and experience in the representation of the continuous loading on (complex) structures with many structural elements. These shortcomings are successfully overcome by an approximate approach, as described herein, offering a dramatic reduction in computational effort so that the distributed loading can be idealised more realistically by a large number of nodal loads. The effectiveness of the proposed procedures, which have arisen from a UK EPSRC-sponsored project, are demonstrated by applying them to a test structure under different environmental conditions. With these improved tools, designers can now consider incorporation of more robust and precise probabilistic analysis into their evaluation procedures for structural behaviour, without facing onerous computational effort.

scholarly journals A Calculation Method for Interconnected Timber Elements Using Wood-Wood Connections

Buildings ◽  
2020 ◽  
Vol 10 (3) ◽  
pp. 61 ◽  
Author(s):  
Julien Gamerro ◽  
Jean François Bocquet ◽  
Yves Weinand
Keyword(s):  
Calculation Method ◽  
Large Scale ◽  
Limit State ◽  
Digital Fabrication ◽  
Calculation Model ◽  
Free Form ◽  
Structural Elements ◽  
Timber Constructions ◽  
Building Components ◽  
Vibration Tests

Wood-wood connections, widely used in the past, have been progressively replaced by steel fasteners in timber constructions. Currently, they can be manufactured and implemented more efficiently thanks to digital fabrication techniques. In addition, with the emergence of new timber plate engineered products, digitally produced wood-wood connections have been developed with a strong focus on complex free-form geometries. The gained knowledge through research and building implementations have pushed the development of more standardized structural elements. As a result, this work presents a new concept of building components using through tenon connections based on the idea of transportable flat-packs directly delivered and assembled on site. The main objective of this research is to develop a convenient calculation model for practice that can capture the semi-rigid behavior of the connections and predict the effective bending stiffness of such structural elements. A case study is used as a reference with three large-scale slabs of a 8.1 m span. Bending and vibration tests are performed to study the mechanical behavior and assess the proposed calculation method. The results show the high influence of the semi-rigid behavior of connections on the bending properties and, therefore, on the serviceability limit state. The model is in good agreement with the test results, and further improvements can be made regarding the local behavior of the connection. This study demonstrates the feasibility of the proposed construction system and the applicability of the developed calculation model to design practice.

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