scholarly journals SUGGESTIONS OF NEW TECHNOLOGIES FOR PROCESSING COAL ON THE BASIS OF USING UNIVERSAL MODULES OF INDUSTRIAL DISINTEGRATORS/ACTIVATORS

ASJ. ◽  
2021 ◽  
Vol 1 (50) ◽  
pp. 36-43
Author(s):  
A. Kulakov ◽  
V. Rantsev-Kartinov
Keyword(s):  
Carbon Nanotubes ◽  
Construction Industry ◽  
Diesel Fuel ◽  
Magnetic Induction ◽  
New Technologies ◽  
Environmentally Friendly ◽  
High Density ◽  
Boiler Furnace ◽  
Industrial Manufacturing ◽  
Technological Paradigm

The UMID/A developed by the authors of the present paper represent the devices, which are fully compliant with the nano energetics of the Sixth Technological Paradigm and possess unique technical characteristics (extremely high density of the magnetic induction, which is close to the hundred percent of the performance factor, low consumption of materials etc.) that provides for the possibility of grinding in those modules of various materials up to nano dimensions with the purpose of using the ground materials in various sectors of industrial manufacturing, chemistry and medicine. Unique characteristics of the UMID/A determined the possibility of using such disintegrators in the principally new, developed by us technologies for obtaining inexpensive alkaline nano-cements/concretes without additional annealing of the waste of mining and metallurgy productions, inexpensive and environmentally friendly pure arbolite made of alkaline cements, boiler furnace fuel, diesel fuel, lubricating preparations made of coal inexpensive carbon nanotubes and binders of brittle and not very demanded by the construction industry inexpensive materials.

Enhanced dispersion of carbon nanotubes in high density polyethylene matrix using secondary nanofiller and compatibilizer

2015 ◽  
Vol 16 (1) ◽  
pp. 129-137 ◽  
Author(s):  
M. E. Ali Mohsin ◽  
Agus Arsad ◽  
Syed K. H. Gulrez ◽  
Zurina Muhamad ◽  
H. Fouad ◽  
...  
Keyword(s):  
Carbon Nanotubes ◽  
High Density Polyethylene ◽  
High Density ◽  
Polyethylene Matrix

Si-mediated fabrication of reduced graphene oxide and its hybrids for electrode materials

2015 ◽  
Vol 17 (2) ◽  
pp. 776-780 ◽  
Author(s):  
Barun Kumar Barman ◽  
Karuna Kar Nanda
Keyword(s):  
Carbon Nanotubes ◽  
Graphene Oxide ◽  
Reduced Graphene Oxide ◽  
Electrode Materials ◽  
Multiwall Carbon Nanotubes ◽  
Environmentally Friendly ◽  
Si Substrate ◽  
Reduced Graphene ◽  
Multiwall Carbon

We demonstrate a Si-mediated environmentally friendly reduction of graphene oxide (GO) and the fabrication of hybrid electrode materials with multiwall carbon nanotubes and nanofibers. The reduction of GO is facilitated by the nascent hydrogen generated by the reaction between Si and KOH. The overall process consumes 10 to 15 μm of Si each time and the same Si substrate can be used multiple times.

scholarly journals A Review on the Fabrication and Reliability of Three-Dimensional Integration Technologies for Microelectronic Packaging: Through-Si-Via and Solder Bumping Process

Metals ◽  
2021 ◽  
Vol 11 (10) ◽  
pp. 1664
Author(s):  
Do Hoon Cho ◽  
Seong Min Seo ◽  
Jang Baeg Kim ◽  
Sri Harini Rajendran ◽  
Jae Pil Jung
Keyword(s):  
High Speed ◽  
High Performance ◽  
New Technologies ◽  
Three Dimensional ◽  
High Density ◽  
Internal Stresses ◽  
Deep Reactive Ion Etching ◽  
Fifth Generation ◽  
Precise Understanding ◽  
Fabrication Defects

With the continuous miniaturization of electronic devices and the upcoming new technologies such as Artificial Intelligence (AI), Internet of Things (IoT), fifth-generation cellular networks (5G), etc., the electronics industry is achieving high-speed, high-performance, and high-density electronic packaging. Three-dimensional (3D) Si-chip stacking using through-Si-via (TSV) and solder bumping processes are the key interconnection technologies that satisfy the former requirements and receive the most attention from the electronic industries. This review mainly includes two directions to get a precise understanding, such as the TSV filling and solder bumping, and explores their reliability aspects. TSV filling addresses the DRIE (deep reactive ion etching) process, including the coating of functional layers on the TSV wall such as an insulating layer, adhesion layer, and seed layer, and TSV filling with molten solder. Solder bumping processes such as electroplating, solder ball bumping, paste printing, and solder injection on a Cu pillar are discussed. In the reliability part for TSV and solder bumping, the fabrication defects, internal stresses, intermetallic compounds, and shear strength are reviewed. These studies aimed to achieve a robust 3D integration technology effectively for future high-density electronics packaging.

scholarly journals Didática para Ensino de IoT Otimiza Recursos Públicos / Didactics for IoT Optimizes Public Transportation

2019 ◽  
Vol 5 (1) ◽  
pp. 1-7
Author(s):  
Helbert Da Rocha ◽  
Tânia Lucia Monteiro
Keyword(s):  
Smart Grid ◽  
Health Monitoring ◽  
Public Transportation ◽  
Preventive Maintenance ◽  
New Technologies ◽  
Smart Cities ◽  
Technological Paradigm ◽  
City Hall ◽  
Public Resources ◽  
Two Cities

ABSTRACTInternet of Things (IoT) is a technological paradigm and one of the most important tendency of TI nowadays, it is having a broad scope of research in the most different areas. IoT is playing an important role in the concept of smart cities, smart grid, smart health monitoring, smart clothes, preventive maintenance, etc. The IoT contribution to cities in order to make them intelligent, creates a hall of possibilities where there is almost no limit. The knowledge of this topic was presented to the students of the discipline Advanced Topics in Computer Networks. Unorthodoxly and using new technologies, resulted in the project “Vou de ônibus”. The project, aims to optimize public resources, used in the transportation of university students between two cities in the interior of Brazil, provided daily to academics by one of the local city hall. The project has the goal to determine the partial number of students that will use the transportation on a certain day of the week.RESUMOInternet of Things (IoT) é um paradigma tecnológico e uma das tendências de TI mais importantes da atualidade, tendo amplo escopo de pesquisa nas mais diversas áreas. IoT está desempenhando um papel importante no conceito de cidades inteligentes, smart grid, monitoramento de saúde inteligente, roupas inteligentes, manutenção preditiva, etc. A contribuição da IoT para cidades, com finalidade de torná-las inteligentes cria um hall de possibilidades onde quase não há limite. O conhecimento deste tema foi apresentado aos alunos da Disciplina de Tópicos Avançados em Redes de Computadores, de forma não ortodoxa e utilizando novas tecnologias, tendo como resultado o projeto “Vou de ônibus”. O projeto, visa otimizar recursos públicos, utilizados no transporte de universitários entre duas cidades no interior do Brasil, fornecido diariamente aos acadêmicos locais por uma das prefeituras. Tendo como objetivo determinar o número parcial de alunos que irá utilizar o transporte em determinado dia da semana.

scholarly journals Study on Energy-saving Insulation Materials in the Building’s Exterior

2015 ◽  
Vol 4 (1) ◽  
pp. 4
Author(s):  
Yang Zhang ◽  
Yazhi Hu
Keyword(s):  
Energy Consumption ◽  
Energy Saving ◽  
Construction Industry ◽  
New Technologies ◽  
High Energy ◽  
Insulation Material ◽  
Curtain Wall ◽  
Construction Engineering ◽  
Technology Application ◽  
Insulation Materials

<p>Construction industry has been one of China's energy guzzlers, if we can reduce the energy consumption of the building industry through the use of new materials or new technologies, which will have a significant impact on the development of economy and society. The status quo of China's construction industry, high energy consumption, paper use energy-saving technologies in the field of construction works to expand the analysis, discusses the necessity of the construction industry currently uses energy-saving insulation materials and analyzes the current energy field of construction engineering technology application status, on the basis of focus on the application of energy-saving insulation materials in construction, particularly in the new system and the new glass curtain wall insulation material in construction applications, which further enhance the energy-saving technology within the field of construction engineering the application level has a certain reference.</p>

Fabrication of high-density arrays of individually isolated nanocapacitors using anodic aluminum oxide templates and carbon nanotubes

2005 ◽  
Vol 87 (12) ◽  
pp. 123115 ◽  
Author(s):  
Jung Inn Sohn ◽  
Youn-Su Kim ◽  
Chunghee Nam ◽  
B. K. Cho ◽  
Tae-Yeon Seong ◽  
...  
Keyword(s):  
Carbon Nanotubes ◽  
Aluminum Oxide ◽  
Anodic Aluminum Oxide ◽  
High Density ◽  
Anodic Aluminum ◽  
Anodic Aluminum Oxide Templates

Growth of high-density vertically aligned arrays of carbon nanotubes by plasma-assisted catalyst pretreatment

2009 ◽  
Vol 95 (17) ◽  
pp. 173115 ◽  
Author(s):  
S. Esconjauregui ◽  
B. C. Bayer ◽  
M. Fouquet ◽  
C. T. Wirth ◽  
C. Ducati ◽  
...  
Keyword(s):  
Carbon Nanotubes ◽  
High Density ◽  
Aligned Arrays ◽  
Catalyst Pretreatment ◽  
Vertically Aligned
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