scholarly journals How to perform an ergonomic analysis of a workstation

2019 ◽  
Vol 7 (12) ◽  
pp. 474-491
Author(s):  
Carlos Domingues Ascate Júnior ◽  
Mariana Sarmanho de Oliveira Lima ◽  
Jonas Gomes da Silva
Keyword(s):  
Assembly Line ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Entire Body ◽  
Average Risk ◽  
Risk Minimization ◽  
Pcb Assembly ◽  
Work Related ◽  
The Face ◽  
Ergonomic Analysis

In the face of numerous complaints about upper limb pain of employees involved with a printed circuit board (PCB) assembly line, there was a need to assess the level of Work-Related Musculoskeletal Disorders (WRMD). To solve this problem, the research aimed to perform an ergonomic analysis in a workstation of an assembly line of a company X of the Manaus Industrial Pole (PIM). Therefore, the risks of WRMD were evaluated and the problems faced were diagnosed, to propose improvement actions to adapt the work environment to the workers. With the aid of the Ergonomic Work Analysis (EWA) method and the Rapid Entire Body Assessment (REBA) method for the assessment of the risks of WRMD, it was found that the operator was subjected to an average risk of WRMD and that the intervention for resolution or risk minimization was required. The operator's complaints were a pain in the shoulders, arms, and neck. In the end, five recommendations were suggested to company managers to solve or mitigate the problem.

Modeling of Order Oriented Planning for Printed Circuit Board Assembly Line

2015 ◽  
Vol 789-790 ◽  
pp. 1245-1251
Author(s):  
Ullah Saif ◽  
Zai Lin Guan ◽  
Zong Dong He ◽  
Cong He ◽  
Cao Jun
Keyword(s):  
Assembly Line ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Mixed Integer ◽  
Assembly Planning ◽  
Sequencing Problem ◽  
Printed Circuit ◽  
Pcb Assembly ◽  
Planning Problems ◽  
Model Sequencing

Printed circuit board (PCB) assembly planning problem has been given lot of attention to efficiently manage the orders of different PCB products. However, little effort has been paid to describe its comprehensive model which can demonstrate all the planning problems collectively considering in the surface mount technology (SMT) lines. A mixed integer model for PCB assembly line which includes the integration of different levels of the planning problems and considered component allocation problem (line balancing), PCB model sequencing problem (mixed model sequencing problem), feeder arrangement problem and component placement sequencing problem on different SMT machines collectively. Current research is significant to solve different planning problems of the PCB assembly line simultaneously to get the overall global solution of the problem in future.

Optimization of Printed Circuit Board Assignment and Component Allocation in Assembly Line

2010 ◽  
Vol 97-101 ◽  
pp. 2455-2458
Author(s):  
Xuan Du ◽  
Zong Bin Li ◽  
Guo Hui Zhang
Keyword(s):  
Assembly Line ◽  
Printed Circuit Board ◽  
Solution Space ◽  
Circuit Board ◽  
Printed Circuit ◽  
Pcb Assembly ◽  
Fitness Value ◽  
Component Allocation ◽  
Constraint Model ◽  
Polychromatic Sets Theory

The assembly optimization problem of multiple printed circuit board (PCB) tasks is analyzed, and an optimal model is formulated to balance the workload in decoupled PCB assembly line. Combined with polychromatic sets and genetic algorithm (GA), an integrated methodology is developed to solve the PCB assignment and component allocation simultaneously. Based on polychromatic sets theory, a 3D numerical contour matrix is presented to describe the characters of PCB, component and machine and the constraint of machine and process, and a constraint model is formulated. Constraint model guarantees that GA searches in the available solution space and simplify the calculation of fitness value and GA operation. Computational results indicate that the approach presented in this paper is useful and effective.

Nonlinear-Time-Dependent Analysis of Micro Via-In-Pad Substrates for Solder Bumped Flip Chip Applications

2002 ◽  
Vol 124 (3) ◽  
pp. 205-211 ◽  
Author(s):  
John H. Lau ◽  
S. W. Ricky Lee ◽  
Stephen H. Pan ◽  
Chris Chang
Keyword(s):  
Cross Sections ◽  
Flip Chip ◽  
Printed Circuit Board ◽  
Low Cost ◽  
Circuit Board ◽  
Test Results ◽  
Pcb Assembly ◽  
Creep Analysis ◽  
Chip Scale Package ◽  
Time Dependent Analysis

An elasto-plastic-creep analysis of a low-cost micro via-in-pad (VIP) substrate for supporting a solder bumped flip chip in a chip scale package (CSP) format which is soldered onto a printed circuit board (PCB) is presented in this study. Emphasis is placed on the design, materials, and reliability of the micro VIP substrate and of the micro VIP CSP solder joints on PCB. The solder is assumed to obey Norton’s creep law. Cross-sections of samples are examined for a better understanding of the solder bump, CSP substrate redistribution, micro VIP, and solder joint. Also, the thermal cycling test results of the micro VIP CSP PCB assembly is presented.

scholarly journals PELATIHAN PEMBUATAN LAYOUT PCB DENGAN DIP TRACE DAN DRY FILM PHOTORESIST BAGI SMK MUHAMMADIYAH 2 SALAM MAGELANG

2018 ◽  
Vol 1 (1) ◽  
pp. 13
Author(s):  
Denny Dermawan
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Short Term ◽  
Work Related ◽  
Short Course ◽  
Photoresist Film ◽  
Near Term ◽  
Dry Film ◽  
Final Work ◽  
Dry Film Photoresist

The desire of students of SMK Muhammadiyah 2 Salam Magelang to be able to make a printed circuit board is something that is very important to be welcomed and followed up wisely so that the desire of the students is not just a wishful dream but will be a reality. This activity is meant to be an effort not only to overcome difficulties at certain times (short-term activities), but is expected to be sustainable for the future (longer term). Looking at the fact, of course, should be strived to realize the handling of the problem at least for the near term. For that required activities that are practical and immediate benefits can be taken as the activity can be a short course or short training. To solve the problem, it is realized by holding a short course / training course on PCB Layout Creation with DIP TRACE and Dry Film Photoresist technology followed by etching process, drilling and installation of components that will be useful for students who want to do the main final work related with the manufacture of tools / hardware. Keywords: Making PCB, DIP TRACE, Dry Photoresist film

Origami for Tight Spaces - 3D 250C PCB Assemblies for Control Systems

2019 ◽  
Vol 2019 (HiTen) ◽  
pp. 000034-000038 ◽  
Author(s):  
Piers Tremlett ◽  
Phil Elliot ◽  
Pablo Tena
Keyword(s):  
High Temperature ◽  
Printed Circuit Board ◽  
Real Life ◽  
Circuit Board ◽  
Calibration Data ◽  
Engine Fuel ◽  
Sensors And Actuators ◽  
Pcb Assembly ◽  
Operational Life ◽  
Mems Technology

Printed circuit board (PCB) assemblies must fit into unusual spaces for many real-life, high temperature applications such as sensors and actuators. This paper details the design and manufacture of a complex control circuit for a jet engine fuel flow valve. “Origami” was needed to fit this control circuitry into the tight space in the valve, this was achieved using a high temperature flex rigid PCB assembly. The valve was mounted on a hot section of the engine, and the assembly was tested for its capability to operate at 178°C and withstand multiple thermal cycles of −55°C and 175°C during its operational life. Various component joining media were investigated to extend the life of the assembly. The project also developed a one-time programmable (OTP) memory aimed at up to 300°C operation for on board memory to provide calibration data or boot memory for high temperature microcontrollers or processors. The device was based on Micro-Electro-Mechanical Systems (MEMS) technology.

Mechanical Stress Analysis and Evaluation of Hybrid Land Grid Array Attached Large Form Factor Organic Modules

2012 ◽  
Vol 2012 (1) ◽  
pp. 000818-000824
Author(s):  
John Torok ◽  
Shawn Canfield ◽  
Yuet-Ying Yu ◽  
Jiantao Zheng
Keyword(s):  
Form Factor ◽  
Stress Analysis ◽  
Mechanical Stress ◽  
Printed Circuit Board ◽  
Organic Substrate ◽  
Circuit Board ◽  
Bottom Surface ◽  
Mechanical Shock ◽  
Analysis And Evaluation ◽  
Pcb Assembly

Recent industry trends to continue enabling increased server system performance and packaging density has driven the need to implement larger form factor hybrid land grid array (LGA) attached organic modules. In addition, given the need to package multiple modules on a single printed circuit board (PCB) assembly, PCB cross-sections and their corresponding physical properties (e.g., flatness, etc.) as well as module bottom surface metallurgy (BSM) co-planarity require a more detailed understanding of impacts to the compliant as well as the soldered connector interfaces. Lastly, the migration to lead (Pb)-free solders has further complicated the issue given both the change in material properties as well as processing temperatures. In this paper we will discuss the mechanical stress analysis and evaluation tests assessment of a recently developed 50 mm square organic processor module, hybrid LGA attached to a multiple site PCB. The analysis presented will highlight the methodology to identify both connector soldered stress and predicted contact load variation across the module's mated interface. Key parameters discuss will include the PCB flatness, Organic substrate BSM co-planarity (both predicted and measured) and the Hybrid LGA as-soldered contact co-planarity. Corroborating predicted analytical results, we will discuss various evaluation tests performed to validate the design's integrity. Key tests include, pressure sensitive film (PSF) studies and environment stress exposures, including thermal shock, mechanical shock and vibration and seismic exposure. Post test electrical integrity and test sample construction analysis, including 3D x-ray and mechanical cross-section, will also be described. The analysis process and testing described will provide a method to evaluate more challenging hybrid LGA applications as both module sizes and/or number applied per PCB assembly increase and Pb-free assembly is introduced in future applications.

Modeling of Errors Counting System for PCB Soldered in the Wave Soldering Technology

2014 ◽  
Vol 874 ◽  
pp. 139-143 ◽  
Author(s):  
Jacek Pietraszek ◽  
Aneta Gądek-Moszczak ◽  
Tomasz Toruński
Keyword(s):  
Quality Assurance ◽  
Experimental Design ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Counting System ◽  
Printed Circuit ◽  
Pcb Assembly ◽  
Wave Soldering ◽  
Soldering Technology ◽  
Through Hole

PartnerTech provides printed circuit board (PCB) assembly on request. Wired elements are assembled in through-hole technology and soldered on the wave soldering machine. The PCB with inserted elements is passed across the pumped wave of melted solder. Typically this process is accompanied by some class of defects like cracks, cavities, wrong solder thickness and poor conductor. In PartnerTech Ltd. another type of defects was observed: dispersion of small droplets of solder around holes. Quality assurance department plans to optimize the process in order to reduce the number of defects. In the first stage, it was necessary to develop a methodology for counting defects. This paper presents experimental design and analysis related to this project.

A Virtual Prototyping Framework for Electronics Manufacturing

Manufacturing ◽  
2002 ◽  
Author(s):  
J. Cecil ◽  
A. Kanchanapiboon
Keyword(s):  
Life Cycle ◽  
Printed Circuit Board ◽  
Virtual Prototyping ◽  
Circuit Board ◽  
Electronics Manufacturing ◽  
Functional Evaluation ◽  
Surface Mount Technology ◽  
Team Members ◽  
Printed Circuit ◽  
Pcb Assembly

This paper presents a framework for supporting virtual prototyping related activities in the domain of printed circuit board (PCB) assembly. The focus of discussion is restricted to Surface Mount Technology (SMT) based processes only. In general, Virtual Prototyping enables the conceptualization, evaluation and validation of proposed ideas, plans and solutions. Using a virtual prototyping framework, cross functional evaluation and analysis can be facilitated where designers, manufacturing engineers, testing and other life-cycle team members can communicate effectively as well as identify and eliminate problems, which may arise later in the downstream manufacturing and testing activities.

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