scholarly journals Biogenic and Non-Biogenic Waste Utilization in the Synthesis of 2D Materials (Graphene, h-BN, g-C2N) and Their Applications

2021 ◽  
Vol 3 ◽  
Author(s):  
Manish Pratap Singh ◽  
Abhishek Kumar Bhardwaj ◽  
Keval Bharati ◽  
Rahul Pratap Singh ◽  
Sujeet Kumar Chaurasia ◽  
...  
Keyword(s):  
2D Materials ◽  
Waste Utilization ◽  
Waste Materials ◽  
Synthesis Methods ◽  
Synthetic Approach ◽  
Material Synthesis ◽  
2D Layered Materials ◽  
Future Challenges ◽  
Biogenic Waste ◽  
The Cost

There is a significant amount of waste generated which creates a huge environmental issue for humanity/earth and a tremendous number of varieties of resources of a different kind are needed globally. In this context, nanoscience technology has shown its potential ability to solve the above issues and provides realistic applications and devices. The beauty of nanotechnology is its multidisciplinary approach, in which green nanotechnology has been translated to focus on waste materials. Waste materials are generally generated from biogenic (rice husk, dead leaves, waste food, etc.) and non-biogenic (several types of plastics waste, lard oil, etc.) materials produced from municipal or industrial waste. Currently, a large number of efforts have been made to utilize the waste materials for the synthesis of 2D materials in a greener way. This green synthetic approach has two advantages 1) it reduces the cost of synthesis and 2) includes minimal use of hazardous chemicals. Biogenic wastes (contains biomolecules) contain several significant constituents such as co-enzymes, enzymes, proteins, terpenoids, etc. These constituents or biomolecules are known to play an energetic role in the formation of a different variety of 2D materials and hence control the protocols of green synthesis of 2D materials. This review focuses on the exploration of the current understanding of 2D-layered material synthesis methods using waste material produce from biogenic and non-biogenic waste. It also investigates the applications of various 2D-layered materials in perspective with synthesis from waste and future challenges along with their limitations to industrial-scale synthesis.

scholarly journals Fabrication Methods for Integrating 2D Materials

2021 ◽  
Author(s):  
David Moss
Keyword(s):  
2D Materials ◽  
Device Fabrication ◽  
Superior Performance ◽  
Material Synthesis ◽  
Diverse Range ◽  
2D Layered Materials ◽  
Integrated Devices ◽  
Low Energy Consumption ◽  
High Scalability ◽  
On Chip

With compact footprint, low energy consumption, high scalability, and mass producibility, chip-scale integrated devices are an indispensable part of modern technological change and development. Recent advances in two-dimensional (2D) layered materials with their unique structures and distinctive properties have motivated their on-chip integration, yielding a variety of functional devices with superior performance and new features. To realize integrated devices incorporating 2D materials, it requires a diverse range of device fabrication techniques, which are of fundamental importance to achieve good performance and high reproducibility. This paper reviews the state-of-art fabrication techniques for the on-chip integration of 2D materials. First, an overview of the material properties and on-chip applications of 2D materials is provided. Second, different approaches used for integrating 2D materials on chips are comprehensively reviewed, which are categorized into material synthesis, on-chip transfer, film patterning, and property tuning / modification. Third, the methods for integrating 2D van der Waals heterostructures are also discussed and summarized. Finally, the current challenges and future perspectives are highlighted.

scholarly journals Fabrication techniques for the integration of 2D materials

2021 ◽  
Author(s):  
David Moss
Keyword(s):  
2D Materials ◽  
Device Fabrication ◽  
Superior Performance ◽  
Material Synthesis ◽  
Diverse Range ◽  
2D Layered Materials ◽  
Integrated Devices ◽  
Low Energy Consumption ◽  
High Scalability ◽  
On Chip

<p><a>With compact footprint, low energy consumption, high scalability, and mass producibility, chip-scale integrated devices are an indispensable part of modern technological change and development. Recent advances in </a>two-dimensional (2D) layered materials with their unique structures and distinctive properties have motivated their on-chip integration, yielding a variety of functional devices with superior performance and new features. To realize integrated devices incorporating 2D materials, it requires a diverse range of device fabrication techniques, which are of fundamental importance to achieve good performance and high reproducibility. This paper reviews the state-of-art fabrication techniques for the on-chip integration of 2D materials. First, an overview of the material properties and on-chip applications of 2D materials is provided. Second, different approaches used for integrating 2D materials on chips are comprehensively reviewed, which are categorized into material synthesis, on-chip transfer, film patterning, and property tuning / modification. Third, the methods for integrating 2D van der Waals heterostructures are also discussed and summarized. Finally, the current challenges and future perspectives are highlighted.</p> <p><b> </b></p>

scholarly journals Fabrication techniques for the integration of 2D materials

2021 ◽  
Author(s):  
David Moss
Keyword(s):  
2D Materials ◽  
Device Fabrication ◽  
Superior Performance ◽  
Material Synthesis ◽  
Diverse Range ◽  
2D Layered Materials ◽  
Integrated Devices ◽  
Low Energy Consumption ◽  
High Scalability ◽  
On Chip

<p><a>With compact footprint, low energy consumption, high scalability, and mass producibility, chip-scale integrated devices are an indispensable part of modern technological change and development. Recent advances in </a>two-dimensional (2D) layered materials with their unique structures and distinctive properties have motivated their on-chip integration, yielding a variety of functional devices with superior performance and new features. To realize integrated devices incorporating 2D materials, it requires a diverse range of device fabrication techniques, which are of fundamental importance to achieve good performance and high reproducibility. This paper reviews the state-of-art fabrication techniques for the on-chip integration of 2D materials. First, an overview of the material properties and on-chip applications of 2D materials is provided. Second, different approaches used for integrating 2D materials on chips are comprehensively reviewed, which are categorized into material synthesis, on-chip transfer, film patterning, and property tuning / modification. Third, the methods for integrating 2D van der Waals heterostructures are also discussed and summarized. Finally, the current challenges and future perspectives are highlighted.</p> <p><b> </b></p>

scholarly journals Integration technologies for chips with 2D materials

2022 ◽  
Author(s):  
David Moss
Keyword(s):  
2D Materials ◽  
Device Fabrication ◽  
Superior Performance ◽  
Material Synthesis ◽  
Diverse Range ◽  
2D Layered Materials ◽  
Integrated Devices ◽  
Low Energy Consumption ◽  
High Scalability ◽  
On Chip

With compact footprint, low energy consumption, high scalability, and mass producibility, chip-scale integrated devices are an indispensable part of modern technological change and development. Recent advances in two-dimensional (2D) layered materials with their unique structures and distinctive properties have motivated their on-chip integration, yielding a variety of functional devices with superior performance and new features. To realize integrated devices incorporating 2D materials, it requires a diverse range of device fabrication techniques, which are of fundamental importance to achieve good performance and high reproducibility. This paper reviews the state-of-art fabrication techniques for the on-chip integration of 2D materials. First, an overview of the material properties and on-chip applications of 2D materials is provided. Second, different approaches used for integrating 2D materials on chips are comprehensively reviewed, which are categorized into material synthesis, on-chip transfer, film patterning, and property tuning / modification. Third, the methods for integrating 2D van der Waals heterostructures are also discussed and summarized. Finally, the current challenges and future perspectives are highlighted.

Green Synthesized Nanomaterials as Theranostic Platforms for Cancer Treatment: Principles, Challenges and the Road Ahead

2019 ◽  
Vol 26 (8) ◽  
pp. 1311-1327 ◽  
Author(s):  
Pala Rajasekharreddy ◽  
Chao Huang ◽  
Siddhardha Busi ◽  
Jobina Rajkumari ◽  
Ming-Hong Tai ◽  
...  
Keyword(s):  
Nanoparticle Synthesis ◽  
Research Field ◽  
Synthesis Methods ◽  
Synthetic Approach ◽  
Future Directions ◽  
The Road ◽  
New Methods ◽  
Recent Developments ◽  
Theranostic Applications ◽  
Insight Into

With the emergence of nanotechnology, new methods have been developed for engineering various nanoparticles for biomedical applications. Nanotheranostics is a burgeoning research field with tremendous prospects for the improvement of diagnosis and treatment of various cancers. However, the development of biocompatible and efficient drug/gene delivery theranostic systems still remains a challenge. Green synthetic approach of nanoparticles with low capital and operating expenses, reduced environmental pollution and better biocompatibility and stability is a latest and novel field, which is advantageous over chemical or physical nanoparticle synthesis methods. In this article, we summarize the recent research progresses related to green synthesized nanoparticles for cancer theranostic applications, and we also conclude with a look at the current challenges and insight into the future directions based on recent developments in these areas.

scholarly journals Recent advances in mode-locked fiber lasers based on two-dimensional materials

Nanophotonics ◽  
2020 ◽  
Vol 9 (8) ◽  
pp. 2315-2340 ◽  
Author(s):  
Junli Wang ◽  
Xiaoli Wang ◽  
Jingjing Lei ◽  
Mengyuan Ma ◽  
Cong Wang ◽  
...  
Keyword(s):  
Fiber Lasers ◽  
2D Materials ◽  
Synthesis Methods ◽  
Two Dimensional ◽  
New Materials ◽  
Saturable Absorbers ◽  
Operating Wavelength ◽  
Recent Advances ◽  
Two Dimensional Materials ◽  
Diverse Mode

AbstractDue to the unique properties of two-dimensional (2D) materials, much attention has been paid to the exploration and application of 2D materials. In this review, we focus on the application of 2D materials in mode-locked fiber lasers. We summarize the synthesis methods for 2D materials, fiber integration with 2D materials and 2D materials based saturable absorbers. We discuss the performance of the diverse mode-locked fiber lasers in the typical operating wavelength such as 1, 1.5, 2 and 3 μm. Finally, a summary and outlook of the further applications of the new materials in mode-locked fiber lasers are presented.

scholarly journals A Universal Atomic Substitution Conversion Strategy Towards Synthesis of Large-Size Ultrathin Nonlayered Two-Dimensional Materials

2021 ◽  
Vol 13 (1) ◽  
Author(s):  
Mei Zhao ◽  
Sijie Yang ◽  
Kenan Zhang ◽  
Lijie Zhang ◽  
Ping Chen ◽  
...  
Keyword(s):  
Theoretical Calculations ◽  
2D Materials ◽  
Direct Synthesis ◽  
Two Dimensional ◽  
Covalent Bonds ◽  
2D Layered Materials ◽  
Large Size ◽  
Two Dimensional Materials ◽  
Microfabrication Technique ◽  
Atomic Substitution

AbstractNonlayered two-dimensional (2D) materials have attracted increasing attention, due to novel physical properties, unique surface structure, and high compatibility with microfabrication technique. However, owing to the inherent strong covalent bonds, the direct synthesis of 2D planar structure from nonlayered materials, especially for the realization of large-size ultrathin 2D nonlayered materials, is still a huge challenge. Here, a general atomic substitution conversion strategy is proposed to synthesize large-size, ultrathin nonlayered 2D materials. Taking nonlayered CdS as a typical example, large-size ultrathin nonlayered CdS single-crystalline flakes are successfully achieved via a facile low-temperature chemical sulfurization method, where pre-grown layered CdI2 flakes are employed as the precursor via a simple hot plate assisted vertical vapor deposition method. The size and thickness of CdS flakes can be controlled by the CdI2 precursor. The growth mechanism is ascribed to the chemical substitution reaction from I to S atoms between CdI2 and CdS, which has been evidenced by experiments and theoretical calculations. The atomic substitution conversion strategy demonstrates that the existing 2D layered materials can serve as the precursor for difficult-to-synthesize nonlayered 2D materials, providing a bridge between layered and nonlayered materials, meanwhile realizing the fabrication of large-size ultrathin nonlayered 2D materials.

A Very Low-Cost, Labor-Efficient, and Simple Method to Block Scattered Ultraviolet Light in PDMS Microfluidic Devices by Inserting Aluminum Foil Strips

2018 ◽  
Vol 11 (1) ◽  
Author(s):  
Shuo Wang ◽  
Peter Shankles ◽  
Scott Retterer ◽  
Yong Tae Kang ◽  
Chang Kyoung Choi
Keyword(s):  
Soft Lithography ◽  
Uv Light ◽  
Low Cost ◽  
Microfluidic Devices ◽  
Aluminum Foil ◽  
Material Synthesis ◽  
Simple Method ◽  
Micro Particles ◽  
Complex Shapes ◽  
The Cost

Abstract Opto-microfluidic methods have advantages for manufacturing complex shapes or structures of micro particles/hydrogels. Most of these microfluidic devices are made of polydimethylsiloxane (PDMS) by soft lithography because of its flexibility of designing and manufacturing. However, PDMS scatters ultraviolet (UV) light, which polymerizes the photocrosslinkable materials at undesirable locations and clogs the microfluidic devices. A fluorescent dye has previously been employed to absorb the scattered UV light and shift its wavelength to effectively solve this issue. However, this method is limited due to the cost of the materials (tens of dollars per microchip), the time consumed on synthesizing the fluorescent material and verifying its quality (two to three days). More importantly, significant expertise on material synthesis and characterization is required for users of the opto-microfluidic technique. The cost of preliminary testing on multiple iterations of different microfluidic chip designs would also be excessive. Alternatively, with a delicate microchannel design, we simply inserted aluminum foil strips (AFS) inside the PDMS device to block the scattered UV light. By using this method, the UV light was limited to the exposure region so that the opto-microfluidic device could consistently generate microgels longer than 6 h. This is a nearly cost- and labor-free method to solve this issue.

First-principles investigation of copper diffusion barrier performance in defective 2D layered materials

2022 ◽  
Author(s):  
Manareldeen Ahmed ◽  
Yan Li ◽  
Wenchao Chen ◽  
Erping Li
Keyword(s):  
Barrier Layer ◽  
Diffusion Barrier ◽  
First Principles ◽  
Energy Barrier ◽  
2D Materials ◽  
Diffusion Path ◽  
Layered Materials ◽  
Vacancy Defects ◽  
2D Layered Materials ◽  
Barrier Performance

Abstract This paper investigates the diffusion barrier performance of 2D layered materials with pre-existing vacancy defects using first-principles density functional theory. Vacancy defects in 2D materials may give rise to a large amount of Cu accumulation, and consequently, the defect becomes a diffusion path for Cu. Five 2D layered structures are investigated as diffusion barriers for Cu, i.e., graphene with C vacancy, hBN with B/N vacancy, and MoS2 with Mo/2S vacancy. The calculated energy barriers using climbing image - nudged elastic band show that MoS2-V2S has the highest diffusion energy barrier among other 2D layers, followed by hBN-VN and graphene. The obtained energy barrier of Cu on defected layer is found to be proportional to the length of the diffusion path. Moreover, the diffusion of Cu through vacancy defects is found to modulate the electronic structures and magnetic properties of the 2D layer. The charge density difference shows that there exists a considerable charge transfer between Cu and barrier layer as quantified by Bader charge. Given the current need for an ultra-thin diffusion barrier layer, the obtained results contribute to the field of application of 2D materials as Cu diffusion barrier in the presence of mono-vacancy defects.

Challenges Ahead

2013 ◽  
pp. 230-237
Keyword(s):  
Customer Value ◽  
Selling Price ◽  
Global Marketplace ◽  
International Firms ◽  
Future Challenges ◽  
Marketing Systems ◽  
Reduced Costs ◽  
Hybrid Grid ◽  
Market Coverage ◽  
The Cost

This chapter discusses the future challenges that firms might face in determining and managing pricing strategies in the global markets. It has been argued that international firms are developing new hybrid marketing systems that entail architecture of marketing channels with a focus on optimizing consumer response. Such systems offer larger market coverage and reduced costs, through hybrid grid, a map that illustrates the combination of channels and tasks that will optimize cost and coverage. The author critically examines the current practices in pricing followed by the firms and states that pricing is emerging as a challenge for firms amidst the growing competition in the global marketplace. Companies differ substantially in their approach to price setting, but most of them follow the cost-based pricing, competition-based pricing, or customer value-based pricing. Customer value-based pricing uses information on the perceived customer value of the product as the main factor for determining the final selling price.

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